DE69122919D1 - Metallfolienbedeckte Schichtstoffe mit einer glatten Oberfläche - Google Patents

Metallfolienbedeckte Schichtstoffe mit einer glatten Oberfläche

Info

Publication number
DE69122919D1
DE69122919D1 DE69122919T DE69122919T DE69122919D1 DE 69122919 D1 DE69122919 D1 DE 69122919D1 DE 69122919 T DE69122919 T DE 69122919T DE 69122919 T DE69122919 T DE 69122919T DE 69122919 D1 DE69122919 D1 DE 69122919D1
Authority
DE
Germany
Prior art keywords
metal foil
smooth surface
laminates
covered
laminates covered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69122919T
Other languages
English (en)
Other versions
DE69122919T2 (de
Inventor
Kenji Ishii
Takamasa Nakai
Hiroyuki Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Application granted granted Critical
Publication of DE69122919D1 publication Critical patent/DE69122919D1/de
Publication of DE69122919T2 publication Critical patent/DE69122919T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/30—Fillers, e.g. particles, powders, beads, flakes, spheres, chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3382—Including a free metal or alloy constituent
    • Y10T442/3415—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the woven fabric]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3382—Including a free metal or alloy constituent
    • Y10T442/3415—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the woven fabric]
    • Y10T442/3431—Plural fabric layers
    • Y10T442/3439—Including a nonwoven fabric layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
    • Y10T442/654—Including a free metal or alloy constituent
    • Y10T442/656—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the nonwoven fabric]
DE69122919T 1990-07-27 1991-07-24 Metallfolienbedeckte Schichtstoffe mit einer glatten Oberfläche Expired - Fee Related DE69122919T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2197743A JP2993065B2 (ja) 1990-07-27 1990-07-27 表面平滑金属箔張積層板

Publications (2)

Publication Number Publication Date
DE69122919D1 true DE69122919D1 (de) 1996-12-05
DE69122919T2 DE69122919T2 (de) 1997-03-27

Family

ID=16379607

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69122919T Expired - Fee Related DE69122919T2 (de) 1990-07-27 1991-07-24 Metallfolienbedeckte Schichtstoffe mit einer glatten Oberfläche

Country Status (4)

Country Link
US (1) US5368921A (de)
EP (1) EP0468476B1 (de)
JP (1) JP2993065B2 (de)
DE (1) DE69122919T2 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2787846B2 (ja) * 1993-04-13 1998-08-20 住友ベークライト株式会社 印刷回路用積層板
US5849396A (en) * 1995-09-13 1998-12-15 Hughes Electronics Corporation Multilayer electronic structure and its preparation
US5837356A (en) * 1995-09-22 1998-11-17 Kyocera Corporation Wiring board and method for manufacturing the same
US5998237A (en) * 1996-09-17 1999-12-07 Enthone-Omi, Inc. Method for adding layers to a PWB which yields high levels of copper to dielectric adhesion
US5837355A (en) * 1996-11-07 1998-11-17 Sumitomo Bakelite Company Limited Multilayer printed circuit board and process for producing and using the same
US6207595B1 (en) 1998-03-02 2001-03-27 International Business Machines Corporation Laminate and method of manufacture thereof
US6419981B1 (en) 1998-03-03 2002-07-16 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US8105690B2 (en) 1998-03-03 2012-01-31 Ppg Industries Ohio, Inc Fiber product coated with particles to adjust the friction of the coating and the interfilament bonding
KR100637904B1 (ko) * 1998-03-18 2006-10-24 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 레이저에 의한 관통홀 제조방법
US6242078B1 (en) * 1998-07-28 2001-06-05 Isola Laminate Systems Corp. High density printed circuit substrate and method of fabrication
CN100488906C (zh) * 1998-10-13 2009-05-20 Ppg工业俄亥俄公司 玻璃纤维补强的预浸渍片、层压件、电路板以及装配织物的方法
JP4348785B2 (ja) * 1999-07-29 2009-10-21 三菱瓦斯化学株式会社 高弾性率ガラス布基材熱硬化性樹脂銅張積層板
CN1181139C (zh) * 1999-11-30 2004-12-22 大塚化学株式会社 树脂组合物和挠性印刷电路板
KR20030026353A (ko) * 2000-08-29 2003-03-31 오츠카 가가쿠 가부시키 가이샤 수지 조성물, 그 성형체 및 그 용도
JP2002324729A (ja) 2001-02-22 2002-11-08 Tdk Corp 電子部品とその製造方法
JP2003020407A (ja) * 2001-07-05 2003-01-24 Hitachi Chem Co Ltd ワニス組成物、それを用いたプリプレグ及び金属箔張積層板
JP2004059643A (ja) * 2002-07-25 2004-02-26 Mitsubishi Gas Chem Co Inc プリプレグ及び積層板
US8062746B2 (en) 2003-03-10 2011-11-22 Ppg Industries, Inc. Resin compatible yarn binder and uses thereof
AU2003252667A1 (en) * 2003-07-22 2005-02-04 Matsushita Electric Works, Ltd. Resin composition for printed wiring board, prepreg, laminate and printed wiring board using the same
US7078816B2 (en) 2004-03-31 2006-07-18 Endicott Interconnect Technologies, Inc. Circuitized substrate
US7270845B2 (en) * 2004-03-31 2007-09-18 Endicott Interconnect Technologies, Inc. Dielectric composition for forming dielectric layer for use in circuitized substrates
US7145221B2 (en) * 2004-03-31 2006-12-05 Endicott Interconnect Technologies, Inc. Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
JP2006312751A (ja) * 2006-08-10 2006-11-16 Sumitomo Bakelite Co Ltd 樹脂組成物、プリプレグ及びそれを用いた銅張積層板
JP5303826B2 (ja) * 2006-08-11 2013-10-02 住友ベークライト株式会社 樹脂組成物、プリプレグ及びそれを用いたプリント配線板
CN101522812B (zh) * 2006-10-06 2013-07-03 住友电木株式会社 树脂组合物、带基材的绝缘片、半固化片、多层印刷布线板以及半导体装置
JP5322531B2 (ja) * 2008-05-27 2013-10-23 新光電気工業株式会社 配線基板の製造方法
JP5136573B2 (ja) 2009-02-24 2013-02-06 日立化成工業株式会社 ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板
KR101003591B1 (ko) 2009-05-28 2010-12-22 삼성전기주식회사 메탈 적층판 및 이를 이용한 발광 다이오드 패키지의 제조 방법
TW201204548A (en) * 2010-02-05 2012-02-01 Sumitomo Bakelite Co Prepreg, laminate, printed wiring board, and semiconductor device
CN102770474B (zh) * 2010-02-24 2016-06-22 日立化成工业株式会社 清漆、预浸料片、含有树脂的膜、被覆金属箔的层叠板、印制电路布线板
US8309210B1 (en) * 2010-09-13 2012-11-13 Rockell Collins, Inc. Printed wiring board pad cratering inhibitor
MY155995A (en) * 2011-01-24 2015-12-31 Sumitomo Bakelite Co Prepreg, laminate, printed wiring board, and semiconductor device
DE102011009892A1 (de) 2011-01-31 2012-08-02 Benteler Sgl Gmbh & Co. Kg Kraftfahrzeugbauteil und Verfahren zur Herstellung des Kraftfahrzeugbauteils
JP2011236430A (ja) * 2011-06-20 2011-11-24 Hitachi Chem Co Ltd ワニス組成物、それを用いたプリプレグ及び金属箔張積層板
IT201600071279A1 (it) * 2016-07-08 2018-01-08 Microtex Composites S R L Procedimento per la realizzazione di prodotti rigidi ignifughi

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49348B1 (de) * 1970-12-25 1974-01-07
JPS59227931A (ja) * 1983-06-10 1984-12-21 Mitsubishi Rayon Co Ltd プリプレグ
JPS60113665U (ja) * 1984-01-05 1985-08-01 昭和電工株式会社 混成集積回路用基板
US4615763A (en) * 1985-01-02 1986-10-07 International Business Machines Corporation Roughening surface of a substrate
US4772496A (en) * 1985-06-15 1988-09-20 Showa Denko Kabushiki Kaisha Molded product having printed circuit board
US4751146A (en) * 1985-07-09 1988-06-14 Showa Denko Kabushiki Kaisha Printed circuit boards
DE3711238A1 (de) * 1986-04-04 1987-10-15 Nippon Sheet Glass Co Ltd Gedruckte leiterplatte
JP2632197B2 (ja) * 1988-10-14 1997-07-23 富士写真フイルム株式会社 磁気記録媒体

Also Published As

Publication number Publication date
EP0468476A3 (en) 1992-10-28
US5368921A (en) 1994-11-29
JPH0484489A (ja) 1992-03-17
DE69122919T2 (de) 1997-03-27
JP2993065B2 (ja) 1999-12-20
EP0468476A2 (de) 1992-01-29
EP0468476B1 (de) 1996-10-30

Similar Documents

Publication Publication Date Title
DE69122919T2 (de) Metallfolienbedeckte Schichtstoffe mit einer glatten Oberfläche
DE69434823D1 (de) Hygienevorlage mit einer formzwischenschicht
DE69505405D1 (de) Laminate mit einer fluorpolymerschicht
ATA196290A (de) Ski mit einer räumlich profilierten oberseite
DE69524784D1 (de) Wegwerfwindel mit einer feuchtigkeitsübertragenden fläche
ATE128853T1 (de) Absorbierendes kissen mit einer zurückhaltenden form.
DE59307530D1 (de) Formmasse mit matter Oberfläche
DE69132921D1 (de) Gussform mit einer dünnen Trennbeschichtung
DE69107847T2 (de) Sog mit einer feuchtigkeitsundurchlässigen deckenden schutzschicht.
DE69130152D1 (de) Mikrorechner mit eingebautem d/a-wandler
BR9105444A (pt) Laminado eletrico revestido com metal
DE69000770D1 (de) Geschichtete stahlblechabdichtung mit einer breiten abdichtungsflaeche.
DE59205040D1 (de) Motorrad mit einer achsschenkellenkung
DE69411644T2 (de) Bügeleisen mit einer Antihaftschichtbeschichtung
DE69211724T2 (de) Photovoltaische Vorrichtung mit einer Germanium enthaltenden Schichtzone
DE69118945D1 (de) Verarbeitungsmethode mit einer Metall-Schiefablagerung
DE69107253D1 (de) Geschichtete Stahlblechabdichtung mit einer breiten Abdichtungsfläche.
DE69427549D1 (de) Hygienevorlage mit einer gefaltenen aufrichtbaren zwischenschicht
MX159408A (es) Mejoras en un laminado de plastico/metal
DE9407645U1 (de) Schaltleiste mit einer Folienleiterplatte
DE69204901D1 (de) Katamaran mit einer tauchenden Tragfläche.
DE69101027T2 (de) Bügeleisensohle mit einer Antihaftschicht.
DE69228878T2 (de) Handschuhe mit texturierter äusserer oberfläche
DE59101186D1 (de) Zarge mit einer Verkleidung.
DE59209111D1 (de) Gegenstand mit einer zumindest teilweise amorphen Glasmetallfolie

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee