DE69120989D1 - Ausrichtungsmarke, insbesondere für Halbleiter - Google Patents

Ausrichtungsmarke, insbesondere für Halbleiter

Info

Publication number
DE69120989D1
DE69120989D1 DE69120989T DE69120989T DE69120989D1 DE 69120989 D1 DE69120989 D1 DE 69120989D1 DE 69120989 T DE69120989 T DE 69120989T DE 69120989 T DE69120989 T DE 69120989T DE 69120989 D1 DE69120989 D1 DE 69120989D1
Authority
DE
Germany
Prior art keywords
semiconductors
alignment mark
mark
alignment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69120989T
Other languages
English (en)
Inventor
Shoichiro Kawashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE69120989D1 publication Critical patent/DE69120989D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
DE69120989T 1990-03-12 1991-03-12 Ausrichtungsmarke, insbesondere für Halbleiter Expired - Lifetime DE69120989D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6059390 1990-03-12

Publications (1)

Publication Number Publication Date
DE69120989D1 true DE69120989D1 (de) 1996-08-29

Family

ID=13146690

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69120989T Expired - Lifetime DE69120989D1 (de) 1990-03-12 1991-03-12 Ausrichtungsmarke, insbesondere für Halbleiter

Country Status (4)

Country Link
US (1) US5528372A (de)
EP (1) EP0446857B1 (de)
KR (1) KR950002171B1 (de)
DE (1) DE69120989D1 (de)

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JP3239976B2 (ja) * 1994-09-30 2001-12-17 株式会社東芝 アライメントマーク、半導体装置の製造方法および半導体装置
DE4442596C1 (de) * 1994-11-30 1996-04-04 Heidelberg Instruments Mikrotechnik Gmbh Verfahren zur Korrektur von Positionsmeßfehlern
US5538924A (en) * 1995-09-05 1996-07-23 Vanguard International Semiconductor Co. Method of forming a moisture guard ring for integrated circuit applications
JP2870461B2 (ja) * 1995-12-18 1999-03-17 日本電気株式会社 フォトマスクの目合わせマーク及び半導体装置
US6759628B1 (en) * 1996-06-20 2004-07-06 Sony Corporation Laser annealing apparatus
US6501188B1 (en) 1997-07-03 2002-12-31 Micron Technology, Inc. Method for improving a stepper signal in a planarized surface over alignment topography
US5933743A (en) * 1997-07-03 1999-08-03 Micron Technology, Inc. Method of improving alignment signal strength by reducing refraction index at interface of materials in semiconductors
JP3081994B2 (ja) * 1997-10-22 2000-08-28 セイコーインスツルメンツ株式会社 半導体装置
TW335527B (en) * 1997-11-08 1998-07-01 United Microelectronics Corp The rework testing method of semiconductor device
US6160622A (en) * 1997-12-29 2000-12-12 Asm Lithography, B.V. Alignment device and lithographic apparatus comprising such a device
JP3650281B2 (ja) * 1999-05-07 2005-05-18 セイコーインスツル株式会社 半導体装置
JP2002043427A (ja) * 2000-07-21 2002-02-08 Mitsubishi Electric Corp 半導体装置のトリミング方法と半導体装置のトリミング装置および半導体装置のトリミングテーブルの作成方法
JP3970546B2 (ja) 2001-04-13 2007-09-05 沖電気工業株式会社 半導体装置及び半導体装置の製造方法
JP2003150027A (ja) * 2001-11-08 2003-05-21 Sankyo Seiki Mfg Co Ltd 金属蒸着型熱転写用ホログラムシートおよびその加工方法
US6815838B2 (en) 2002-02-20 2004-11-09 International Business Machines Corporation Laser alignment target and method
US20040032030A1 (en) * 2002-08-13 2004-02-19 Texas Instruments Incorporated Laser alignment structure
JP2004120515A (ja) * 2002-09-27 2004-04-15 Oki Electric Ind Co Ltd フェーズロックループ回路
US20040145066A1 (en) * 2003-01-24 2004-07-29 Swanson Leland S. Laser alignment structure for integrated circuits
JP4412922B2 (ja) * 2003-06-27 2010-02-10 株式会社ルネサステクノロジ 半導体装置
US7265850B2 (en) * 2003-10-23 2007-09-04 International Business Machines Corporation Fortified, compensated and uncompensated process-sensitive scatterometry targets
US7052968B1 (en) * 2004-04-07 2006-05-30 Advanced Micro Devices, Inc. Method and system for aligning IC die to package substrate
US8110775B2 (en) * 2004-06-18 2012-02-07 Electro Scientific Industries, Inc. Systems and methods for distinguishing reflections of multiple laser beams for calibration for semiconductor structure processing
US8049135B2 (en) * 2004-06-18 2011-11-01 Electro Scientific Industries, Inc. Systems and methods for alignment of laser beam(s) for semiconductor link processing
US7583834B2 (en) * 2005-03-04 2009-09-01 Eastman Kodak Company Laser etched fiducials in roll-roll display
US20070052114A1 (en) * 2005-09-07 2007-03-08 Shih-Chieh Huang Alignment checking structure and process using thereof
JP4938782B2 (ja) * 2005-10-18 2012-05-23 ジーエスアイ・グループ・コーポレーション 光学的基準を利用する方法および装置
KR100809708B1 (ko) * 2006-10-17 2008-03-06 삼성전자주식회사 레이저 얼라인먼트 모니터링 퓨즈 구조 및 이를 구비한반도체 소자 및 레이저 얼라인먼트 모니터링회로
KR101330706B1 (ko) * 2006-11-03 2013-11-19 삼성전자주식회사 얼라인먼트 마크
US20080221559A1 (en) * 2007-03-06 2008-09-11 Phuoc Khanh Nguyen Calibration and Quality Assurance System For Use With Ophthalmic Surgical Devices and Associated Methods
JP4967904B2 (ja) * 2007-07-31 2012-07-04 富士電機株式会社 半導体装置
US8379204B1 (en) 2007-08-17 2013-02-19 Gsi Group Corporation System and method for automatic laser beam alignment
JP5175616B2 (ja) * 2008-05-23 2013-04-03 シャープ株式会社 半導体装置およびその製造方法
US7916295B2 (en) * 2008-09-03 2011-03-29 Macronix International Co., Ltd. Alignment mark and method of getting position reference for wafer
US9076798B2 (en) 2009-05-11 2015-07-07 Taiwan Semiconductor Manufacturing Company, Ltd. Dicing structures for semiconductor substrates and methods of fabrication thereof
KR102052307B1 (ko) * 2011-11-09 2019-12-04 스카이워크스 솔루션즈, 인코포레이티드 전계 효과 트랜지스터 구조 및 관련된 무선-주파수 스위치
KR101724459B1 (ko) * 2015-07-13 2017-04-07 현대자동차 주식회사 레이저 가공 장치 및 이를 이용한 식별 마크 형성 방법
TWI606530B (zh) * 2017-03-29 2017-11-21 台灣愛司帝科技股份有限公司 位置偵測與晶片分離裝置
CN113555345B (zh) * 2020-04-23 2024-02-06 长鑫存储技术有限公司 半导体标记及其形成方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1816816A1 (de) * 1967-12-28 1969-08-14 Tokyo Shibaura Electric Co Position- und Richtungsermittlungseinrichtung unter Verwendung von Kennzeichen oder Mustern
US3660157A (en) * 1969-08-18 1972-05-02 Computervision Corp Enhanced contrast semiconductor wafer alignment target
US4240094A (en) * 1978-03-20 1980-12-16 Harris Corporation Laser-configured logic array
JPS5649516A (en) * 1979-09-28 1981-05-06 Nec Corp Semiconductor wafer
JPS5649537A (en) * 1979-09-28 1981-05-06 Nec Corp Semiconductor wafer
JPS5651838A (en) * 1979-10-05 1981-05-09 Nec Corp Semiconductor device
JPS56122128A (en) * 1980-02-29 1981-09-25 Telmec Co Ltd Positioning system for printing device of semiconductor or the like
JPS5890728A (ja) * 1981-11-25 1983-05-30 Nippon Telegr & Teleph Corp <Ntt> 半導体ウエファ上の位置合せ用マ−クの製法
JPS59100257A (ja) * 1982-11-30 1984-06-09 Nippon Piston Ring Co Ltd 回転式流体コンプレツサ
US4632557A (en) * 1985-01-23 1986-12-30 Harris Corporation Alignment target image enhancement for microlithography process
US4769523A (en) * 1985-03-08 1988-09-06 Nippon Kogaku K.K. Laser processing apparatus
US4635345A (en) * 1985-03-14 1987-01-13 Harris Corporation Method of making an intergrated vertical NPN and vertical oxide fuse programmable memory cell
US4880309A (en) * 1987-04-14 1989-11-14 General Signal Corporation Dark field target design system for alignment of semiconductor wafers
JPS6450528A (en) * 1987-08-21 1989-02-27 Oki Electric Ind Co Ltd Wafer alignment mark and manufacture thereof
JPH01169926A (ja) * 1987-12-24 1989-07-05 Toshiba Corp アライメント方法

Also Published As

Publication number Publication date
EP0446857A3 (en) 1992-08-05
EP0446857B1 (de) 1996-07-24
US5528372A (en) 1996-06-18
KR950002171B1 (ko) 1995-03-14
EP0446857A2 (de) 1991-09-18

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Legal Events

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8332 No legal effect for de