DE69117785T2 - Dünnschicht-Halbleiterbauelement - Google Patents

Dünnschicht-Halbleiterbauelement

Info

Publication number
DE69117785T2
DE69117785T2 DE69117785T DE69117785T DE69117785T2 DE 69117785 T2 DE69117785 T2 DE 69117785T2 DE 69117785 T DE69117785 T DE 69117785T DE 69117785 T DE69117785 T DE 69117785T DE 69117785 T2 DE69117785 T2 DE 69117785T2
Authority
DE
Germany
Prior art keywords
thin film
film semiconductor
semiconductor device
layer
protective layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69117785T
Other languages
English (en)
Other versions
DE69117785D1 (de
Inventor
Masato Yamanobe
Takayuki Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2078403A external-priority patent/JPH03278437A/ja
Priority claimed from JP2078406A external-priority patent/JPH03278477A/ja
Priority claimed from JP2078404A external-priority patent/JPH03278467A/ja
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE69117785D1 publication Critical patent/DE69117785D1/de
Application granted granted Critical
Publication of DE69117785T2 publication Critical patent/DE69117785T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
    • H01L31/101Devices sensitive to infrared, visible or ultraviolet radiation
    • H01L31/112Devices sensitive to infrared, visible or ultraviolet radiation characterised by field-effect operation, e.g. junction field-effect phototransistor
    • H01L31/113Devices sensitive to infrared, visible or ultraviolet radiation characterised by field-effect operation, e.g. junction field-effect phototransistor being of the conductor-insulator-semiconductor type, e.g. metal-insulator-semiconductor field-effect transistor
    • H01L31/1136Devices sensitive to infrared, visible or ultraviolet radiation characterised by field-effect operation, e.g. junction field-effect phototransistor being of the conductor-insulator-semiconductor type, e.g. metal-insulator-semiconductor field-effect transistor the device being a metal-insulator-semiconductor field-effect transistor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14643Photodiode arrays; MOS imagers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78651Silicon transistors
    • H01L29/7866Non-monocrystalline silicon transistors
    • H01L29/78663Amorphous silicon transistors
    • H01L29/78669Amorphous silicon transistors with inverted-type structure, e.g. with bottom gate
DE69117785T 1990-03-27 1991-03-26 Dünnschicht-Halbleiterbauelement Expired - Fee Related DE69117785T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2078403A JPH03278437A (ja) 1990-03-27 1990-03-27 薄膜半導体装置及びその製造方法
JP2078406A JPH03278477A (ja) 1990-03-27 1990-03-27 薄膜半導体装置及びこの薄膜半導体装置を用いた光電変換装置
JP2078404A JPH03278467A (ja) 1990-03-27 1990-03-27 薄膜半導体装置

Publications (2)

Publication Number Publication Date
DE69117785D1 DE69117785D1 (de) 1996-04-18
DE69117785T2 true DE69117785T2 (de) 1997-02-06

Family

ID=27302704

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69117785T Expired - Fee Related DE69117785T2 (de) 1990-03-27 1991-03-26 Dünnschicht-Halbleiterbauelement

Country Status (4)

Country Link
US (2) US5576555A (de)
EP (1) EP0449598B1 (de)
AT (1) ATE135496T1 (de)
DE (1) DE69117785T2 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5796116A (en) 1994-07-27 1998-08-18 Sharp Kabushiki Kaisha Thin-film semiconductor device including a semiconductor film with high field-effect mobility
KR0145900B1 (ko) * 1995-02-11 1998-09-15 김광호 박막 트랜지스터 액정디스플레이 소자 및 그 제조방법
JPH09270519A (ja) * 1996-03-31 1997-10-14 Furontetsuku:Kk 薄膜トランジスタの製造方法
US6010923A (en) * 1997-03-31 2000-01-04 Sanyo Electric Co., Ltd. Manufacturing method of semiconductor device utilizing annealed semiconductor layer as channel region
US5834356A (en) * 1997-06-27 1998-11-10 Vlsi Technology, Inc. Method of making high resistive structures in salicided process semiconductor devices
TW400554B (en) * 1997-07-25 2000-08-01 United Microelectronics Corp The removing method for the thin film layer involved in the semiconductor device
US6166417A (en) 1998-06-30 2000-12-26 Intel Corporation Complementary metal gates and a process for implementation
US6130123A (en) 1998-06-30 2000-10-10 Intel Corporation Method for making a complementary metal gate electrode technology
EP1118126B1 (de) * 1999-08-02 2009-02-25 Casio Computer Co., Ltd. Photosensor und photosensorsystem
KR100776514B1 (ko) * 2000-12-30 2007-11-16 엘지.필립스 엘시디 주식회사 액정표시장치 및 그 제조방법
JP3990167B2 (ja) * 2002-03-04 2007-10-10 Nec液晶テクノロジー株式会社 液晶表示装置の駆動方法およびその駆動方法を用いた液晶表示装置
JP4378137B2 (ja) * 2003-09-04 2009-12-02 キヤノン株式会社 読み出し回路、固体撮像装置、及びこれを用いたカメラシステム
JP5157161B2 (ja) * 2006-12-27 2013-03-06 カシオ計算機株式会社 フォトセンサ
US7863112B2 (en) * 2008-01-08 2011-01-04 International Business Machines Corporation Method and structure to protect FETs from plasma damage during FEOL processing
JP5615605B2 (ja) * 2010-07-05 2014-10-29 三菱電機株式会社 Ffsモード液晶装置
US8679905B2 (en) * 2011-06-08 2014-03-25 Cbrite Inc. Metal oxide TFT with improved source/drain contacts
US9035932B2 (en) * 2012-08-31 2015-05-19 Apple Inc. Thermally compensated pixels for liquid crystal displays (LCDS)
US9201112B2 (en) 2013-12-09 2015-12-01 International Business Machines Corporation Atom probe tomography sample preparation for three-dimensional (3D) semiconductor devices

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5961964A (ja) * 1982-10-01 1984-04-09 Fujitsu Ltd 薄膜トランジスタの製造方法
JPS60101940A (ja) * 1983-11-07 1985-06-06 Ricoh Co Ltd イメ−ジセンサ
JPH0682839B2 (ja) * 1984-08-21 1994-10-19 セイコー電子工業株式会社 表示用パネルの製造方法
US4882295A (en) * 1985-07-26 1989-11-21 Energy Conversion Devices, Inc. Method of making a double injection field effect transistor
JPS639157A (ja) * 1986-06-30 1988-01-14 Canon Inc 薄膜トランジスタの製造方法
US5306648A (en) * 1986-01-24 1994-04-26 Canon Kabushiki Kaisha Method of making photoelectric conversion device
US4843265A (en) * 1986-02-10 1989-06-27 Dallas Semiconductor Corporation Temperature compensated monolithic delay circuit
JPS62253785A (ja) * 1986-04-28 1987-11-05 Tokyo Univ 間欠的エツチング方法
US5308996A (en) * 1986-09-25 1994-05-03 Canon Kabushiki Kaisha TFT device
JP2702131B2 (ja) * 1987-06-12 1998-01-21 キヤノン株式会社 画像読取装置及び該装置を有する画像情報読取装置
JPH01137674A (ja) * 1987-11-25 1989-05-30 Matsushita Electric Ind Co Ltd 薄膜トランジスタ
JPH01302769A (ja) * 1988-05-30 1989-12-06 Seikosha Co Ltd 逆スタガー型シリコン薄膜トランジスタの製造方法
GB2220792B (en) * 1988-07-13 1991-12-18 Seikosha Kk Silicon thin film transistor and method for producing the same
JPH0816756B2 (ja) * 1988-08-10 1996-02-21 シャープ株式会社 透過型アクティブマトリクス液晶表示装置
US5202572A (en) * 1988-09-21 1993-04-13 Fuji Xerox Co., Ltd. Thin film transistor
US4874459A (en) * 1988-10-17 1989-10-17 The Regents Of The University Of California Low damage-producing, anisotropic, chemically enhanced etching method and apparatus
DE68921567T2 (de) * 1988-11-30 1995-07-06 Nec Corp Flüssigkristallanzeigetafel mit verminderten Pixeldefekten.
ATE143175T1 (de) * 1990-03-27 1996-10-15 Canon Kk Dünnschicht-halbleiterbauelement
US5198694A (en) * 1990-10-05 1993-03-30 General Electric Company Thin film transistor structure with improved source/drain contacts

Also Published As

Publication number Publication date
EP0449598A2 (de) 1991-10-02
US5705411A (en) 1998-01-06
EP0449598A3 (en) 1992-01-08
US5576555A (en) 1996-11-19
DE69117785D1 (de) 1996-04-18
ATE135496T1 (de) 1996-03-15
EP0449598B1 (de) 1996-03-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee