DE69115058T2 - Epoxyharzzusammensetzung und damit verkapselte Halbleiteranordnung. - Google Patents
Epoxyharzzusammensetzung und damit verkapselte Halbleiteranordnung.Info
- Publication number
- DE69115058T2 DE69115058T2 DE69115058T DE69115058T DE69115058T2 DE 69115058 T2 DE69115058 T2 DE 69115058T2 DE 69115058 T DE69115058 T DE 69115058T DE 69115058 T DE69115058 T DE 69115058T DE 69115058 T2 DE69115058 T2 DE 69115058T2
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- resin composition
- epoxy resin
- encapsulated semiconductor
- encapsulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/04—Epoxynovolacs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1559690 | 1990-01-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69115058D1 DE69115058D1 (de) | 1996-01-18 |
DE69115058T2 true DE69115058T2 (de) | 1996-08-08 |
Family
ID=11893100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69115058T Expired - Fee Related DE69115058T2 (de) | 1990-01-25 | 1991-01-24 | Epoxyharzzusammensetzung und damit verkapselte Halbleiteranordnung. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5190995A (de) |
EP (1) | EP0439171B1 (de) |
KR (1) | KR950009152B1 (de) |
DE (1) | DE69115058T2 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2780559B2 (ja) * | 1991-01-25 | 1998-07-30 | 信越化学工業株式会社 | アリル基又はプロペニル基を持つナフタレン誘導体 |
JPH04300915A (ja) * | 1991-03-29 | 1992-10-23 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JPH04300914A (ja) * | 1991-03-29 | 1992-10-23 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2526747B2 (ja) * | 1991-05-21 | 1996-08-21 | 信越化学工業株式会社 | エポキシ樹脂組成物及び半導体装置 |
JP2669247B2 (ja) * | 1992-02-13 | 1997-10-27 | 信越化学工業株式会社 | 熱硬化性樹脂組成物 |
US5908881A (en) * | 1996-11-29 | 1999-06-01 | Sumitomo Bakelite Company Limited | Heat-conductive paste |
JPH10245473A (ja) * | 1997-03-03 | 1998-09-14 | Yuka Shell Epoxy Kk | エポキシ樹脂組成物 |
DE19804595A1 (de) * | 1998-02-05 | 1999-08-12 | Siemens Ag | Thermisch härtbare Ein-Komponenten-Underfill-Masse |
KR100562454B1 (ko) * | 1998-07-21 | 2006-03-21 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 반도체 봉지용 에폭시 수지 조성물 및 반도체 장치 |
US6784024B2 (en) * | 2000-01-18 | 2004-08-31 | Micron Technology, Inc. | Die attach curing method for semiconductor device |
JP2005527113A (ja) * | 2002-05-23 | 2005-09-08 | スリーエム イノベイティブ プロパティズ カンパニー | ナノ粒子充填アンダーフィル |
US7943706B2 (en) * | 2005-03-24 | 2011-05-17 | Shin-Etsu Chemical Co., Ltd. | Semiconductor encapsulating epoxy resin composition and semiconductor device |
WO2007144425A1 (en) * | 2006-06-16 | 2007-12-21 | Huntsman Advanced Materials (Switzerland) Gmbh | Coating system |
TWI492339B (zh) * | 2009-06-01 | 2015-07-11 | Shinetsu Chemical Co | A dam material composition for a bottom layer filler material for a multilayer semiconductor device, and a manufacturing method of a multilayer semiconductor device using the dam material composition |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3290269A (en) * | 1963-04-01 | 1966-12-06 | Koppers Co Inc | Naphthyldimethylene spaced phenyl glycidyl ethers |
US4418383A (en) * | 1980-06-30 | 1983-11-29 | International Business Machines Corporation | Data flow component for processor and microprocessor systems |
US4376147A (en) * | 1981-08-31 | 1983-03-08 | Clopay Corporation | Plastic film having a matte finish |
JPS59230017A (ja) * | 1983-05-25 | 1984-12-24 | Agency Of Ind Science & Technol | 新規ポリグリシジルエ−テル及びその製法 |
JPS60260611A (ja) * | 1984-06-08 | 1985-12-23 | Mitsubishi Petrochem Co Ltd | 高分子量クレゾ−ルノボラツク樹脂の製造方法 |
JPS61141724A (ja) * | 1984-12-12 | 1986-06-28 | Agency Of Ind Science & Technol | ポリグリシジルエ−テル組成物 |
US4720515A (en) * | 1985-05-17 | 1988-01-19 | Denki Kagaku Kogyo Kabushiki Kaisha | Epoxy resin composition for encapsulating semiconductor |
US4902732A (en) * | 1985-09-30 | 1990-02-20 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin-based curable compositions |
DE3689022T2 (de) * | 1985-10-07 | 1994-04-21 | Shinetsu Chemical Co | Epoxyharzzusammensetzung. |
JPS63226951A (ja) * | 1987-03-16 | 1988-09-21 | Shin Etsu Chem Co Ltd | 樹脂封止型半導体装置 |
US4908424A (en) * | 1987-10-09 | 1990-03-13 | Shell Oil Company | Bis-anthrols and bis-naphthols and diglycidyl ethers thereof |
MY104894A (en) * | 1988-12-08 | 1994-06-30 | Sumitomo Bakelite Co | Epoxy resin composition for semiconductor sealing. |
JPH0617440B2 (ja) * | 1989-05-30 | 1994-03-09 | 新日鐵化学株式会社 | 新規エポキシ樹脂及びその製造法 |
JPH0390075A (ja) * | 1989-09-01 | 1991-04-16 | Nippon Steel Chem Co Ltd | エポキシ樹脂及びその中間体並びにその製造法 |
-
1991
- 1991-01-24 KR KR1019910001178A patent/KR950009152B1/ko not_active IP Right Cessation
- 1991-01-24 US US07/645,498 patent/US5190995A/en not_active Expired - Lifetime
- 1991-01-24 DE DE69115058T patent/DE69115058T2/de not_active Expired - Fee Related
- 1991-01-24 EP EP91100908A patent/EP0439171B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR910014459A (ko) | 1991-08-31 |
EP0439171B1 (de) | 1995-12-06 |
US5190995A (en) | 1993-03-02 |
KR950009152B1 (ko) | 1995-08-16 |
EP0439171A2 (de) | 1991-07-31 |
EP0439171A3 (en) | 1992-07-08 |
DE69115058D1 (de) | 1996-01-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69821573D1 (de) | Epoxidharzzusammensetzung und damit eingekapselte Halbleiteranordnungen | |
DE69221440D1 (de) | Harzverkapselte Halbleiteranordnung | |
DE69202608D1 (de) | Epoxydharzzusammensetzungen und damit eingekapselte Halbleiteranordnungen. | |
DE69722106D1 (de) | Epoxidharzzusammensetzung und damit eingekapselte Halbleiteranordnungen | |
DE69011414T2 (de) | In Kunststoff eingekapseltes Halbleiterelement. | |
DE69840353D1 (de) | Epoxidharzzusammensetzung geeignet zur Verkapselung von Halbleiteranordnungen und harzverkapselte Halbleiteranordnungen | |
DE69231790D1 (de) | Wärmeabführendes Bauteil und damit versehene Halbleitervorrichtung | |
DE3884648T2 (de) | Epoxyharz-Zusammensetzung und eine harzumhüllte Halbleiteranordnung. | |
DE69922577D1 (de) | Epoxydharzzusammensetzungen und damit eingekapselte Halbleiteranordnungen | |
EP0484157A3 (en) | Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition | |
DE69427995D1 (de) | Im Harz versiegelte Halbleitervorrichtung | |
DE69603531D1 (de) | Epoxyharz, Harzzusammensetzung und Harz-verkapselte Halbleitervorrichtung | |
DE69115058D1 (de) | Epoxyharzzusammensetzung und damit verkapselte Halbleiteranordnung. | |
DE69323025T2 (de) | In Harz versiegeltes Halbleiterbauelement | |
DE69114554T2 (de) | Halbleiteranordnung des Harzverkapselungstyps. | |
DE69115074T2 (de) | Epoxyharzzusammensetzungen zum Einkapseln von Halbleiterelementen. | |
KR890004425A (ko) | 수지 캡슐화 반도체장치 | |
DE69126835D1 (de) | Epoxydharz, Epoxydharzzusammensetzung und damit hergestellte gehärtete Gegenstände | |
DE69828737D1 (de) | Polyfunktionelle Cyanatharzzusammensetzung und eine damit verkapselte Halbleiteranordnung | |
DE69817054D1 (de) | Epoxidharzzusammensetzung und eine harzverkapselte Halbleiteranordnung | |
KR960010764A (ko) | 에폭시 수지 조성물 및 수지 봉지형 반도체 장치 | |
DE69224694T2 (de) | Polyhydrisches Phenol und damit hergestelltes Epoxydharz und Epoxydharzzusammensetzung | |
DE69026880T2 (de) | Wärmehärtbare Harzzusammensetzung und damit hergestellte Gegenstände | |
EP0506359A3 (en) | Epoxy resin compositions and semiconductor devices encapsulated therewith | |
DE69502641D1 (de) | Mit Harz eingekapseltes Halbleiterbauelement |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |