DE69110208D1 - Kupferplattieren von Tiefdruckzylindern. - Google Patents

Kupferplattieren von Tiefdruckzylindern.

Info

Publication number: DE69110208D1
Authority: DE; Germany
Prior art keywords: copper plating; gravure cylinders; gravure; cylinders; plating
Prior art date: 1990-08-03
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

DE69110208T

Other languages

English (en)

Other versions

DE69110208T2 (de

Inventor

C Richard Frisby

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Atotech Deutschland GmbH and Co KG

Original Assignee

Mcgean Rohco Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1990-08-03

Filing date

1991-06-26

Publication date

1995-07-13

1991-06-26 Application filed by Mcgean Rohco Inc filed Critical Mcgean Rohco Inc

1995-07-13 Publication of DE69110208D1 publication Critical patent/DE69110208D1/de

1995-10-19 Application granted granted Critical

1995-10-19 Publication of DE69110208T2 publication Critical patent/DE69110208T2/de

2011-06-27 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Links

RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
229910052802 copper Inorganic materials 0.000 title 1
239000010949 copper Substances 0.000 title 1
238000007747 plating Methods 0.000 title 1

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper

DE69110208T 1990-08-03 1991-06-26 Kupferplattieren von Tiefdruckzylindern. Expired - Fee Related DE69110208T2 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US56239890A	1990-08-03	1990-08-03

Publications (2)

Publication Number	Publication Date
DE69110208D1 true DE69110208D1 (de)	1995-07-13
DE69110208T2 DE69110208T2 (de)	1995-10-19

Family

ID=24246141

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE69110208T Expired - Fee Related DE69110208T2 (de)	1990-08-03	1991-06-26	Kupferplattieren von Tiefdruckzylindern.

Country Status (4)

Country	Link
US (1)	US5417841A (de)
EP (1)	EP0469724B1 (de)
JP (1)	JPH05214586A (de)
DE (1)	DE69110208T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5730854A (en) *	1996-05-30	1998-03-24	Enthone-Omi, Inc.	Alkoxylated dimercaptans as copper additives and de-polarizing additives
US7556722B2 (en) *	1996-11-22	2009-07-07	Metzger Hubert F	Electroplating apparatus
US8298395B2 (en) *	1999-06-30	2012-10-30	Chema Technology, Inc.	Electroplating apparatus
US6406609B1 (en) *	2000-02-25	2002-06-18	Agere Systems Guardian Corp.	Method of fabricating an integrated circuit
EP1148156A3 (de) *	2000-04-11	2004-02-04	Shipley Company LLC	Elektroplattierung von Kupfer
DE50106133D1 (de) *	2000-09-20	2005-06-09	Schloetter Fa Dr Ing Max	Elektrolyt und verfahren zur abscheidung von zinn-kupfer-legierungsschichten
US6676823B1 (en)	2002-03-18	2004-01-13	Taskem, Inc.	High speed acid copper plating
US20050284766A1 (en) *	2004-06-25	2005-12-29	Herdman Roderick D	Pulse reverse electrolysis of acidic copper electroplating solutions
US7329334B2 (en) *	2004-09-16	2008-02-12	Herdman Roderick D	Controlling the hardness of electrodeposited copper coatings by variation of current profile
US7153408B1 (en)	2006-04-13	2006-12-26	Herdman Roderick D	Copper electroplating of printing cylinders
EP2358924A2 (de) *	2008-11-17	2011-08-24	Basf Se	Saure wässrige thiodiglykolethoxlat zusammensetzung und ihre verwendung in einem beizverfahren von metallischen oberflächen
GR1007354B (el)	2009-12-15	2011-07-20	Icr Ιωαννου Αβεε,	Κατασκευη κυλινδρου βαθυτυπιας με βαση απο αλουμινιο
EP2719544B1 (de)	2012-10-10	2015-12-16	Artio Sarl	Verfahren zur Herstellung eines Rotationstiefdruckzylinders
US9539844B2 (en)	2013-01-08	2017-01-10	Paramount International Services Ltd	Method of refurbishing rotogravure cylinders, rotogravure cylinders and their use
JP6142165B2 (ja) *	2013-03-25	2017-06-07	石原ケミカル株式会社	電気銅メッキ浴、電気銅メッキ方法並びに当該メッキ浴を用いて銅皮膜を形成した電子部品の製造方法
WO2015028064A1 (en) *	2013-08-29	2015-03-05	Artio Sarl	Method of manufacturing rotogravure cylinders
JP6402399B2 (ja) *	2014-05-09	2018-10-10	藤倉ゴム工業株式会社	Ｃｆｒｐ円筒のメッキ方法及び外面メッキ層を有するｃｆｒｐ円筒
US10440434B2 (en)	2016-10-28	2019-10-08	International Business Machines Corporation	Experience-directed dynamic steganographic content switching
CN106637312A (zh) *	2017-03-07	2017-05-10	龙游运申制版有限公司	一种版辊镀铜液及其制备方法
CN110870590B (zh) *	2018-08-14	2022-04-29	常州市派腾电子技术服务有限公司	发烟装置、电子烟及控制方法
WO2020096906A1 (en)	2018-11-07	2020-05-14	Coventya, Inc.	Satin copper bath and method of depositing a satin copper layer

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2424887A (en)	1941-10-11	1947-07-29	Houdaille Hershey Corp	Method and electrolyte for the electrodeposition of metals
US3328273A (en) *	1966-08-15	1967-06-27	Udylite Corp	Electro-deposition of copper from acidic baths
US3542655A (en) *	1968-04-29	1970-11-24	M & T Chemicals Inc	Electrodeposition of copper
US3682788A (en) *	1970-07-28	1972-08-08	M & T Chemicals Inc	Copper electroplating
US3798138A (en) *	1971-07-21	1974-03-19	Lea Ronal Inc	Electrodeposition of copper
US3751289A (en) *	1971-08-20	1973-08-07	M & T Chemicals Inc	Method of preparing surfaces for electroplating
US4229268A (en) *	1979-07-09	1980-10-21	Rohco, Inc.	Acid zinc plating baths and methods for electrodepositing bright zinc deposits
US4334966A (en)	1981-05-19	1982-06-15	Mcgean Chemical Company, Inc.	Method of copper plating gravure cylinders
US4384930A (en) *	1981-08-21	1983-05-24	Mcgean-Rohco, Inc.	Electroplating baths, additives therefor and methods for the electrodeposition of metals
US4781801A (en)	1987-02-03	1988-11-01	Mcgean-Rohco, Inc.	Method of copper plating gravure rolls
US4832802A (en) *	1988-06-10	1989-05-23	Mcgean-Rohco, Inc.	Acid zinc-nickel plating baths and methods for electrodepositing bright and ductile zinc-nickel alloys and additive composition therefor

1991
- 1991-06-26 EP EP91306024A patent/EP0469724B1/de not_active Expired - Lifetime
- 1991-06-26 DE DE69110208T patent/DE69110208T2/de not_active Expired - Fee Related
- 1991-07-31 JP JP3192148A patent/JPH05214586A/ja not_active Withdrawn
1994
- 1994-10-25 US US08/328,612 patent/US5417841A/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
EP0469724B1 (de)	1995-06-07
DE69110208T2 (de)	1995-10-19
US5417841A (en)	1995-05-23
EP0469724A1 (de)	1992-02-05
JPH05214586A (ja)	1993-08-24

Legal Events

Date	Code	Title	Description
1996-07-04	8364	No opposition during term of opposition
2002-04-04	8327	Change in the person/name/address of the patent owner	Owner name: ATOTECH DEUTSCHLAND GMBH, 10553 BERLIN, DE
2011-04-21	8339	Ceased/non-payment of the annual fee

Publication	Publication Date	Title
DE69110208D1 (de)	1995-07-13	Kupferplattieren von Tiefdruckzylindern.
DE69020796T2 (de)	1996-03-14	Direkt-Elektroplattieren von Durchgangslöchern.
DE68909069D1 (de)	1993-10-21	Hydraulische Schaltung für Zylinder.
FR2660125B1 (fr)	1995-02-24	Verin electromagnetique.
DE69129297D1 (de)	1998-05-28	Hydraulikkreislauf
DE69017601D1 (de)	1995-04-13	Schaltungsanordnung.
DE69008464D1 (de)	1994-06-01	Schaltungsanordnung.
ES2021612B3 (es)	1991-11-16	Cilindro.
DE69106522T2 (de)	1995-07-20	Elektroplattierung.
DE68902551D1 (de)	1992-10-01	Stromlose kupferplattierloesung.
DE58900959D1 (de)	1992-04-16	Zylinderkurbelgehaeuse.
IT1242105B (it)	1994-02-16	Cilindro di elettroplaccatura.
DE69029904D1 (de)	1997-03-20	Hydraulische schaltungsanordnung
DE69008930T2 (de)	1995-05-11	Boostschaltung.
DE69028291D1 (de)	1996-10-02	Hydraulische schaltung
DE59105753D1 (de)	1995-07-27	Galvanisierungsverfahren.
DE69109002D1 (de)	1995-05-24	Zylinderblock.
DE59100764D1 (de)	1994-02-10	Zylinder-Kurbelgehäuse.
IT1159975B (it)	1987-03-04	Procedimento di elettroplaccatura particolarmente cromatura
FI905118A0 (fi)	1990-10-17	Cylinder foer slagkolvfoerbraenningsmotormaskin.
DE58907963D1 (de)	1994-08-04	Hydraulische schaltungsanordnung.
FI864598A (fi)	1987-07-10	Sprutsystem foer insprutning av braensle i en cylinder i en kolvfoerbraenningsmaskin.
DE69121597D1 (de)	1996-10-02	Plattierungsverfahren
DE3869284D1 (de)	1992-04-23	Hauptzylinder.
DE59105615D1 (de)	1995-07-06	Elektrolytkondensator.