DE69106240T2 - Mikropumpe und Verfahren zur Herstellung einer Mikropumpe. - Google Patents

Mikropumpe und Verfahren zur Herstellung einer Mikropumpe.

Info

Publication number
DE69106240T2
DE69106240T2 DE69106240T DE69106240T DE69106240T2 DE 69106240 T2 DE69106240 T2 DE 69106240T2 DE 69106240 T DE69106240 T DE 69106240T DE 69106240 T DE69106240 T DE 69106240T DE 69106240 T2 DE69106240 T2 DE 69106240T2
Authority
DE
Germany
Prior art keywords
micropump
making
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69106240T
Other languages
English (en)
Other versions
DE69106240D1 (de
Inventor
Shinichi Kamisuki
Yasuto Nose
Nobuo Shimizu
Shinichi Yotsuya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP17506090A external-priority patent/JPH0463973A/ja
Priority claimed from JP17871390A external-priority patent/JPH0466788A/ja
Priority claimed from JP17870990A external-priority patent/JPH0466786A/ja
Priority claimed from JP17871090A external-priority patent/JPH0466787A/ja
Priority claimed from JP17870890A external-priority patent/JPH0466785A/ja
Priority claimed from JP24652790A external-priority patent/JPH04128388A/ja
Priority claimed from JP25226590A external-priority patent/JPH04132887A/ja
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of DE69106240D1 publication Critical patent/DE69106240D1/de
Publication of DE69106240T2 publication Critical patent/DE69106240T2/de
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0002—Arrangements for avoiding sticking of the flexible or moving parts
    • B81B3/0005—Anti-stiction coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B43/00—Machines, pumps, or pumping installations having flexible working members
    • F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
    • F04B43/04—Pumps having electric drive
    • F04B43/043—Micropumps
    • F04B43/046—Micropumps with piezoelectric drive
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B53/00—Component parts, details or accessories not provided for in, or of interest apart from, groups F04B1/00 - F04B23/00 or F04B39/00 - F04B47/00
    • F04B53/10—Valves; Arrangement of valves
    • F04B53/102—Disc valves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
    • H01L21/3083—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/03—Microengines and actuators
    • B81B2201/036—Micropumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/05—Microfluidics
    • B81B2201/054—Microvalves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
DE69106240T 1990-07-02 1991-07-02 Mikropumpe und Verfahren zur Herstellung einer Mikropumpe. Expired - Fee Related DE69106240T2 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP17506090A JPH0463973A (ja) 1990-07-02 1990-07-02 マイクロポンプの製造方法
JP17871390A JPH0466788A (ja) 1990-07-06 1990-07-06 流体制御装置の製造方法
JP17870890A JPH0466785A (ja) 1990-07-06 1990-07-06 マイクロポンプおよびその製造方法
JP17871090A JPH0466787A (ja) 1990-07-06 1990-07-06 流体制御装置
JP17870990A JPH0466786A (ja) 1990-07-06 1990-07-06 マイクロポンプおよびその製造方法
JP24652790A JPH04128388A (ja) 1990-09-17 1990-09-17 シリコン基板の加工方法
JP25226590A JPH04132887A (ja) 1990-09-21 1990-09-21 マイクロポンプの製造方法
JP27363590 1990-10-12

Publications (2)

Publication Number Publication Date
DE69106240D1 DE69106240D1 (de) 1995-02-09
DE69106240T2 true DE69106240T2 (de) 1995-05-11

Family

ID=27573331

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69106240T Expired - Fee Related DE69106240T2 (de) 1990-07-02 1991-07-02 Mikropumpe und Verfahren zur Herstellung einer Mikropumpe.

Country Status (4)

Country Link
US (1) US5259737A (de)
EP (1) EP0465229B1 (de)
DE (1) DE69106240T2 (de)
HK (1) HK102097A (de)

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* Cited by examiner, † Cited by third party
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DE69106240D1 (de) 1995-02-09
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EP0465229B1 (de) 1994-12-28
US5259737A (en) 1993-11-09

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