DE69105793T2 - Löt-Polymer-Komposit-Paste und Verfahren zu ihrer Verwendung. - Google Patents

Löt-Polymer-Komposit-Paste und Verfahren zu ihrer Verwendung.

Info

Publication number
DE69105793T2
DE69105793T2 DE69105793T DE69105793T DE69105793T2 DE 69105793 T2 DE69105793 T2 DE 69105793T2 DE 69105793 T DE69105793 T DE 69105793T DE 69105793 T DE69105793 T DE 69105793T DE 69105793 T2 DE69105793 T2 DE 69105793T2
Authority
DE
Germany
Prior art keywords
solder
polymer composite
composite paste
paste
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69105793T
Other languages
English (en)
Other versions
DE69105793D1 (de
Inventor
Wu-Song Huang
Igor Yan Khandros
Ravi Saraf
Leathen Shi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69105793D1 publication Critical patent/DE69105793D1/de
Publication of DE69105793T2 publication Critical patent/DE69105793T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
DE69105793T 1990-03-30 1991-02-06 Löt-Polymer-Komposit-Paste und Verfahren zu ihrer Verwendung. Expired - Lifetime DE69105793T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/502,090 US5062896A (en) 1990-03-30 1990-03-30 Solder/polymer composite paste and method

Publications (2)

Publication Number Publication Date
DE69105793D1 DE69105793D1 (de) 1995-01-26
DE69105793T2 true DE69105793T2 (de) 1995-06-29

Family

ID=23996296

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69105793T Expired - Lifetime DE69105793T2 (de) 1990-03-30 1991-02-06 Löt-Polymer-Komposit-Paste und Verfahren zu ihrer Verwendung.

Country Status (4)

Country Link
US (1) US5062896A (de)
EP (1) EP0450278B1 (de)
JP (1) JPH0739039B2 (de)
DE (1) DE69105793T2 (de)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5150832A (en) * 1991-06-28 1992-09-29 At&T Bell Laboratories Solder paste
FR2688727B1 (fr) * 1992-03-19 1996-03-15 Fujitsu Ltd Procedes pour rendre spherique une particule metallique et pour eliminer un film d'oxyde, pate a souder et procede de soudure.
US5221038A (en) * 1992-10-05 1993-06-22 Motorola, Inc. Method for forming tin-indium or tin-bismuth solder connection having increased melting temperature
US5328087A (en) * 1993-03-29 1994-07-12 Microelectronics And Computer Technology Corporation Thermally and electrically conductive adhesive material and method of bonding with same
US5445308A (en) * 1993-03-29 1995-08-29 Nelson; Richard D. Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal
US5346558A (en) * 1993-06-28 1994-09-13 W. R. Grace & Co.-Conn. Solderable anisotropically conductive composition and method of using same
WO1995013901A1 (en) * 1993-11-19 1995-05-26 Cts Corporation Metallurgically bonded polymer vias
TW301843B (en) * 1994-11-15 1997-04-01 Ibm Electrically conductive paste and composite and their use as an electrically conductive connector
US5837119A (en) * 1995-03-31 1998-11-17 International Business Machines Corporation Methods of fabricating dendritic powder materials for high conductivity paste applications
US5958590A (en) * 1995-03-31 1999-09-28 International Business Machines Corporation Dendritic powder materials for high conductivity paste applications
JP3810505B2 (ja) 1997-02-28 2006-08-16 独立行政法人科学技術振興機構 導電性プラスチック、それによる導電回路及びその導電回路の形成方法
US5928404A (en) * 1997-03-28 1999-07-27 Ford Motor Company Electrical solder and method of manufacturing
US6059952A (en) * 1997-07-10 2000-05-09 International Business Machines Corporation Method of fabricating coated powder materials and their use for high conductivity paste applications
US6337522B1 (en) 1997-07-10 2002-01-08 International Business Machines Corporation Structure employing electrically conductive adhesives
US6297559B1 (en) * 1997-07-10 2001-10-02 International Business Machines Corporation Structure, materials, and applications of ball grid array interconnections
US6120885A (en) * 1997-07-10 2000-09-19 International Business Machines Corporation Structure, materials, and methods for socketable ball grid
US6158644A (en) * 1998-04-30 2000-12-12 International Business Machines Corporation Method for enhancing fatigue life of ball grid arrays
US6322685B1 (en) * 1998-05-13 2001-11-27 International Business Machines Corporation Apparatus and method for plating coatings on to fine powder materials and use of the powder therefrom
US6592943B2 (en) 1998-12-01 2003-07-15 Fujitsu Limited Stencil and method for depositing solder
US6054761A (en) 1998-12-01 2000-04-25 Fujitsu Limited Multi-layer circuit substrates and electrical assemblies having conductive composition connectors
JP3204451B2 (ja) * 1999-01-26 2001-09-04 インターナショナル・ビジネス・マシーンズ・コーポレーション 接合材料及びバンプ
US6326555B1 (en) 1999-02-26 2001-12-04 Fujitsu Limited Method and structure of z-connected laminated substrate for high density electronic packaging
JP3423930B2 (ja) * 1999-12-27 2003-07-07 富士通株式会社 バンプ形成方法、電子部品、および半田ペースト
US6534564B2 (en) * 2000-05-31 2003-03-18 Hoeganaes Corporation Method of making metal-based compacted components and metal-based powder compositions suitable for cold compaction
JP2002240192A (ja) * 2001-02-15 2002-08-28 Minebea Co Ltd 片面紙フェノール樹脂銅張積層板
US7311967B2 (en) * 2001-10-18 2007-12-25 Intel Corporation Thermal interface material and electronic assembly having such a thermal interface material
US6946190B2 (en) * 2002-02-06 2005-09-20 Parker-Hannifin Corporation Thermal management materials
US7036573B2 (en) * 2002-02-08 2006-05-02 Intel Corporation Polymer with solder pre-coated fillers for thermal interface materials
US6926955B2 (en) * 2002-02-08 2005-08-09 Intel Corporation Phase change material containing fusible particles as thermally conductive filler
US7147367B2 (en) 2002-06-11 2006-12-12 Saint-Gobain Performance Plastics Corporation Thermal interface material with low melting alloy
US6791839B2 (en) * 2002-06-25 2004-09-14 Dow Corning Corporation Thermal interface materials and methods for their preparation and use
US20050056365A1 (en) * 2003-09-15 2005-03-17 Albert Chan Thermal interface adhesive
US20050228097A1 (en) * 2004-03-30 2005-10-13 General Electric Company Thermally conductive compositions and methods of making thereof
TW200615074A (en) * 2004-08-25 2006-05-16 Matsushita Electric Ind Co Ltd Solder composition, connecting process with soldering, and connection structure with soldering
CN101005917A (zh) * 2004-08-25 2007-07-25 松下电器产业株式会社 焊料组合物、利用焊接的连接方法和利用焊接的连接结构
JP3964911B2 (ja) * 2004-09-03 2007-08-22 松下電器産業株式会社 バンプ付き基板の製造方法
US7452568B2 (en) * 2005-02-04 2008-11-18 International Business Machines Corporation Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation
CN101894774B (zh) * 2005-03-17 2012-02-15 松下电器产业株式会社 电子部件安装方法和电子部件安装装置
US20070226995A1 (en) * 2006-03-30 2007-10-04 Gregory Alan Bone System and method for adhering large semiconductor applications to pcb
US7812437B2 (en) * 2006-05-19 2010-10-12 Fairchild Semiconductor Corporation Flip chip MLP with folded heat sink
EP2188834A4 (de) * 2007-09-11 2014-03-19 Dow Corning Verbundstoff, thermisches zwischenmaterial mit dem verbundstoff sowie verfahren zu seiner herstellung und verwendung
CN101803010B (zh) * 2007-09-11 2014-01-29 陶氏康宁公司 热界面材料，包含该热界面材料的电子器件和其制备和使用的方法
JP5247571B2 (ja) * 2008-04-24 2013-07-24 パナソニック株式会社 配線基板と配線基板の接続方法
EP2334728B1 (de) 2008-09-26 2018-03-21 Alpha Assembly Solutions Inc. Leitfähige zusammensetzungen und verfahren zu ihrer verwendung
US9006887B2 (en) * 2009-03-04 2015-04-14 Intel Corporation Forming sacrificial composite materials for package-on-package architectures and structures formed thereby
US8896986B2 (en) * 2010-05-26 2014-11-25 Kemet Electronics Corporation Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitors
US9748043B2 (en) 2010-05-26 2017-08-29 Kemet Electronics Corporation Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitors
US9682447B2 (en) 2010-08-20 2017-06-20 Henkel IP & Holding GmbH Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes
US8551367B2 (en) 2012-01-19 2013-10-08 E I Du Pont De Nemours And Company Polymer thick film solder alloy conductor composition
US8557146B1 (en) 2012-03-26 2013-10-15 E I Du Pont De Nemours And Company Polymer thick film solder alloy/metal conductor compositions
CN103212921B (zh) * 2012-06-26 2015-03-18 深圳市堃琦鑫华股份有限公司 一种还原剂组合物及其制备方法、一种焊接方法
US9034417B2 (en) 2012-08-20 2015-05-19 E I Du Pont De Nemours And Company Photonic sintering of polymer thick film conductor compositions
US8696860B1 (en) 2012-10-10 2014-04-15 E I Du Pont De Nemours And Company Lamination of polymer thick film conductor compositions
US8986579B2 (en) 2012-10-10 2015-03-24 E I Du Pont De Nemours And Company Lamination of polymer thick film conductor compositions
CN103289650B (zh) * 2013-06-09 2014-01-08 北京依米康科技发展有限公司 一种低熔点金属导热膏
US9437566B2 (en) 2014-05-12 2016-09-06 Invensas Corporation Conductive connections, structures with such connections, and methods of manufacture
US9793198B2 (en) 2014-05-12 2017-10-17 Invensas Corporation Conductive connections, structures with such connections, and methods of manufacture
US20160276303A1 (en) 2015-03-17 2016-09-22 E I Du Pont De Nemours And Company Electronic component
WO2016171623A1 (en) * 2015-04-20 2016-10-27 Agency For Science, Technology And Research Conductive polymer composite as plastic solder
EP3506196A4 (de) 2016-08-24 2019-09-18 Nec Corporation Irisbildgebungsvorrichtung, irisbildgebungsverfahren und aufzeichnungsmedium
EP3488962A1 (de) 2017-11-28 2019-05-29 Vestel Elektronik Sanayi ve Ticaret A.S. Lötzusammensetzung und verfahren zum löten
US10800948B2 (en) * 2018-08-02 2020-10-13 Xerox Corporation Conductive adhesive compositions and method for the same
CN116174996B (zh) * 2023-01-18 2023-11-03 宁成新材料科技(苏州)有限责任公司 一种消渣剂及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE631915A (de) * 1962-05-10
FR2155014A5 (en) * 1971-10-04 1973-05-18 Pk Soldering paste - contg polyorganosiloxane binder
NZ188341A (en) * 1977-09-16 1980-05-08 Johnson Matthey Co Ltd Brazing composition:brazing alloy and thermoplastic materi
US4545926A (en) * 1980-04-21 1985-10-08 Raychem Corporation Conductive polymer compositions and devices
US4496475A (en) * 1980-09-15 1985-01-29 Potters Industries, Inc. Conductive paste, electroconductive body and fabrication of same
US4419279A (en) * 1980-09-15 1983-12-06 Potters Industries, Inc. Conductive paste, electroconductive body and fabrication of same
US4518735A (en) * 1981-10-29 1985-05-21 National Semiconductor Corporation High temperature stable adhesive for semiconductor device packages, low-cost semiconductor device package and process
JPS60130494A (ja) * 1983-12-16 1985-07-11 Kitsudo:Kk ダイボンディング用導電性ペ−スト
US4557860A (en) * 1984-07-06 1985-12-10 Stauffer Chemical Company Solventless, polyimide-modified epoxy composition
US4619715A (en) * 1984-09-11 1986-10-28 Scm Corporation Fusible powdered metal paste

Also Published As

Publication number Publication date
EP0450278B1 (de) 1994-12-14
US5062896A (en) 1991-11-05
JPH04228288A (ja) 1992-08-18
JPH0739039B2 (ja) 1995-05-01
EP0450278A1 (de) 1991-10-09
DE69105793D1 (de) 1995-01-26

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Legal Events

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8364 No opposition during term of opposition
8330 Complete disclaimer
8330 Complete disclaimer