DE69020796D1 - Direkt-Elektroplattieren von Durchgangslöchern. - Google Patents

Direkt-Elektroplattieren von Durchgangslöchern.

Info

Publication number
DE69020796D1
DE69020796D1 DE69020796T DE69020796T DE69020796D1 DE 69020796 D1 DE69020796 D1 DE 69020796D1 DE 69020796 T DE69020796 T DE 69020796T DE 69020796 T DE69020796 T DE 69020796T DE 69020796 D1 DE69020796 D1 DE 69020796D1
Authority
DE
Germany
Prior art keywords
holes
direct electroplating
electroplating
direct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69020796T
Other languages
English (en)
Other versions
DE69020796T2 (de
Inventor
Bernd K Appel
Perminder Bindra
Robert D Edwards
James R Loomis
Joe M Park
Jonathan D Reid
Lisa J Smith
James R White
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69020796D1 publication Critical patent/DE69020796D1/de
Publication of DE69020796T2 publication Critical patent/DE69020796T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0716—Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
DE69020796T 1989-05-08 1990-04-09 Direkt-Elektroplattieren von Durchgangslöchern. Expired - Fee Related DE69020796T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/348,844 US4969979A (en) 1989-05-08 1989-05-08 Direct electroplating of through holes

Publications (2)

Publication Number Publication Date
DE69020796D1 true DE69020796D1 (de) 1995-08-17
DE69020796T2 DE69020796T2 (de) 1996-03-14

Family

ID=23369797

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69020796T Expired - Fee Related DE69020796T2 (de) 1989-05-08 1990-04-09 Direkt-Elektroplattieren von Durchgangslöchern.

Country Status (4)

Country Link
US (1) US4969979A (de)
EP (1) EP0398019B1 (de)
JP (1) JPH0671140B2 (de)
DE (1) DE69020796T2 (de)

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US5268088A (en) * 1991-12-12 1993-12-07 Eric F. Harnden Simplified method for direct electroplating of acrylic or epoxy containing dielectric substrates
DE4211152C1 (de) * 1992-03-31 1993-11-25 Schering Ag Verfahren zur Metallisierung von Nichtleitern und Anwendung des Verfahrens
US6303181B1 (en) 1993-05-17 2001-10-16 Electrochemicals Inc. Direct metallization process employing a cationic conditioner and a binder
US5476580A (en) * 1993-05-17 1995-12-19 Electrochemicals Inc. Processes for preparing a non-conductive substrate for electroplating
US6171468B1 (en) 1993-05-17 2001-01-09 Electrochemicals Inc. Direct metallization process
US5725807A (en) * 1993-05-17 1998-03-10 Electrochemicals Inc. Carbon containing composition for electroplating
US6710259B2 (en) 1993-05-17 2004-03-23 Electrochemicals, Inc. Printed wiring boards and methods for making them
US5690805A (en) * 1993-05-17 1997-11-25 Electrochemicals Inc. Direct metallization process
US5387332A (en) * 1993-07-14 1995-02-07 Straus; Martin Cleaner/conditioner for the direct metallization of non-conductors and printed circuit boards
US5376232A (en) * 1993-08-23 1994-12-27 Parlex Corporation Method of manufacturing a printed circuit board
US5362534A (en) * 1993-08-23 1994-11-08 Parlex Corporation Multiple layer printed circuit boards and method of manufacture
US5421989A (en) * 1993-08-31 1995-06-06 Atotech Deutschland Gmbh Process for the metallization of nonconductive substrates with elimination of electroless metallization
US5484518A (en) * 1994-03-04 1996-01-16 Shipley Company Inc. Electroplating process
DE4412463C3 (de) * 1994-04-08 2000-02-10 Atotech Deutschland Gmbh Verfahren zur Herstellung einer Palladium-Kolloid-Lösung und ihre Verwendung
US5545429A (en) * 1994-07-01 1996-08-13 International Business Machines Corporation Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess
JPH08204339A (ja) * 1995-01-30 1996-08-09 Nec Toyama Ltd 印刷配線板の製造方法
EP0762813A1 (de) * 1995-08-25 1997-03-12 Macdermid Incorporated Verfahren zur Herstellung von Leiterplatten
US5626736A (en) 1996-01-19 1997-05-06 Shipley Company, L.L.C. Electroplating process
US5762777A (en) * 1996-05-02 1998-06-09 Persee Chemical Co. Ltd. Process of directly electroplating onto a nonconductive substrate
US6136513A (en) * 1997-06-13 2000-10-24 International Business Machines Corporation Method of uniformly depositing seed and a conductor and the resultant printed circuit structure
US5997997A (en) * 1997-06-13 1999-12-07 International Business Machines Corp. Method for reducing seed deposition in electroless plating
DE19731184C2 (de) * 1997-07-10 1999-10-07 Atotech Deutschland Gmbh Vorrichtung zur analytischen Überwachung eines Bades zur galvanotechnischen Behandlung von Substratoberflächen
US6375731B1 (en) * 2000-01-06 2002-04-23 Electrochemicals Inc. Conditioning of through holes and glass
US6776893B1 (en) 2000-11-20 2004-08-17 Enthone Inc. Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
US6770558B2 (en) * 2002-02-25 2004-08-03 International Business Machines Corporation Selective filling of electrically conductive vias for three dimensional device structures
EP1609206B1 (de) 2003-03-04 2010-07-28 Rohm and Haas Electronic Materials, L.L.C. Koaxiale wellenleitermikrostrukturen und verfahern zu ihrer bildung
WO2008056403A1 (en) * 2006-11-06 2008-05-15 C. Uyemura & Co., Ltd. Direct plating method and solution for palladium conductor layer formation
EP1939137B1 (de) 2006-12-30 2016-08-24 Nuvotronics, LLC Dreidimensionale Mikrostrukturen und Herstellungsverfahren dafür
KR20080063217A (ko) * 2006-12-30 2008-07-03 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. 3차원 미세구조 및 그 형성방법
EP1973189B1 (de) 2007-03-20 2012-12-05 Nuvotronics, LLC Mikrostrukturen einer koaxialen Übertragungsleitung und Herstellungsverfahren dafür
EP1973190A1 (de) 2007-03-20 2008-09-24 Rohm and Haas Electronic Materials LLC Integrierte elektronische Komponenten und Herstellungsverfahren dafür
US8659371B2 (en) * 2009-03-03 2014-02-25 Bae Systems Information And Electronic Systems Integration Inc. Three-dimensional matrix structure for defining a coaxial transmission line channel
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
JP5639194B2 (ja) 2010-01-22 2014-12-10 ヌボトロニクス，エルエルシー 熱制御
US8917150B2 (en) 2010-01-22 2014-12-23 Nuvotronics, Llc Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels
JP5602584B2 (ja) * 2010-10-28 2014-10-08 新光電気工業株式会社 配線基板及びその製造方法
US8866300B1 (en) 2011-06-05 2014-10-21 Nuvotronics, Llc Devices and methods for solder flow control in three-dimensional microstructures
US8814601B1 (en) 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
WO2013010108A1 (en) 2011-07-13 2013-01-17 Nuvotronics, Llc Methods of fabricating electronic and mechanical structures
US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
WO2015109208A2 (en) 2014-01-17 2015-07-23 Nuvotronics, Llc Wafer scale test interface unit: low loss and high isolation devices and methods for high speed and high density mixed signal interconnects and contactors
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
US10511073B2 (en) 2014-12-03 2019-12-17 Cubic Corporation Systems and methods for manufacturing stacked circuits and transmission lines
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
US10986738B2 (en) * 2018-05-08 2021-04-20 Macdermid Enthone Inc. Carbon-based direct plating process

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US3267007A (en) * 1966-08-16 Bonding metal deposits to electrically non-conductive material
GB493485A (en) * 1937-01-13 1938-10-10 Langbein Pfanhauser Werke Ag Process for the electrolytic production of metal coatings on objects with a non-conducting surface
US2897409A (en) * 1954-10-06 1959-07-28 Sprague Electric Co Plating process
US3163588A (en) * 1955-02-14 1964-12-29 Technograph Printed Electronic Method of interconnecting pathway patterns of printed circuit products
US3099608A (en) * 1959-12-30 1963-07-30 Ibm Method of electroplating on a dielectric base
US3619382A (en) * 1970-01-27 1971-11-09 Gen Electric Process of reducing metal compounds to metal in a matrix
US3775176A (en) * 1971-02-23 1973-11-27 Amicon Corp Method of forming an electroplatable microporous film with exposed metal particles within the pores
US3793159A (en) * 1972-05-05 1974-02-19 Phillips Petroleum Co Electroplating plastics
US4090984A (en) * 1977-02-28 1978-05-23 Owens-Corning Fiberglas Corporation Semi-conductive coating for glass fibers
JPS53115069A (en) * 1977-03-18 1978-10-07 Nippon Mining Co Method of producing printed circuit board
DE2746938A1 (de) * 1977-10-17 1979-04-19 Schering Ag Saures galvanisches kupferbad
US4325780A (en) * 1980-09-16 1982-04-20 Schulz Sr Robert M Method of making a printed circuit board
US4634619A (en) * 1981-10-13 1987-01-06 Surface Technology, Inc. Process for electroless metal deposition
US4701350B2 (en) * 1980-11-06 1997-08-05 Surface Technology Corp Process for electroless metal deposition
JPS5812392A (ja) * 1981-07-15 1983-01-24 株式会社日立製作所 平坦化配線
DE3323476A1 (de) * 1982-07-01 1984-01-05 Kollmorgen Technologies Corp., 75201 Dallas, Tex. Verbessertes verfahren zur galvanischen metallabscheidung auf nichtmetallischen oberflaechen
US4478883A (en) * 1982-07-14 1984-10-23 International Business Machines Corporation Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate
US4454168A (en) * 1982-09-29 1984-06-12 E. I. Du Pont De Nemours And Company Printed circuits prepared from metallized photoadhesive layers
US4683036A (en) * 1983-06-10 1987-07-28 Kollmorgen Technologies Corporation Method for electroplating non-metallic surfaces
US4554182A (en) * 1983-10-11 1985-11-19 International Business Machines Corporation Method for conditioning a surface of a dielectric substrate for electroless plating
US4581301A (en) * 1984-04-10 1986-04-08 Michaelson Henry W Additive adhesive based process for the manufacture of printed circuit boards
US4790912A (en) * 1985-06-06 1988-12-13 Techno-Instruments Investments Ltd. Selective plating process for the electrolytic coating of circuit boards without an electroless metal coating
US4724005A (en) * 1985-11-29 1988-02-09 Olin Hunt Specialty Products Inc. Liquid carbon black dispersion
US4691091A (en) * 1985-12-31 1987-09-01 At&T Technologies Direct writing of conductive patterns
US4735676A (en) * 1986-01-14 1988-04-05 Asahi Chemical Research Laboratory Co., Ltd. Method for forming electric circuits on a base board
US4622108A (en) * 1986-05-05 1986-11-11 Olin Hunt Specialty Products, Inc. Process for preparing the through hole walls of a printed wiring board for electroplating
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US4718993A (en) * 1987-05-29 1988-01-12 Olin Hunt Specialty Products Inc. Process for preparing the through hole walls of a printed wiring board for electroplating
US4806159A (en) * 1987-07-16 1989-02-21 Sprague Electric Company Electro-nickel plating activator composition, a method for using and a capacitor made therewith
US4874477A (en) * 1989-04-21 1989-10-17 Olin Hunt Specialty Products Inc. Process for preparing the through hole walls of a printed wiring board for electroplating

Also Published As

Publication number Publication date
DE69020796T2 (de) 1996-03-14
US4969979A (en) 1990-11-13
EP0398019B1 (de) 1995-07-12
EP0398019A1 (de) 1990-11-22
JPH0671140B2 (ja) 1994-09-07
JPH0327587A (ja) 1991-02-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee