DE69018818D1 - Hornförmiger elektrischer Kontakt. - Google Patents
Hornförmiger elektrischer Kontakt.Info
- Publication number
- DE69018818D1 DE69018818D1 DE69018818T DE69018818T DE69018818D1 DE 69018818 D1 DE69018818 D1 DE 69018818D1 DE 69018818 T DE69018818 T DE 69018818T DE 69018818 T DE69018818 T DE 69018818T DE 69018818 D1 DE69018818 D1 DE 69018818D1
- Authority
- DE
- Germany
- Prior art keywords
- horn
- electrical contact
- shaped electrical
- shaped
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/209—Auto-mechanical connection between a component and a PCB or between two PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/520,335 US5118299A (en) | 1990-05-07 | 1990-05-07 | Cone electrical contact |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69018818D1 true DE69018818D1 (de) | 1995-05-24 |
DE69018818T2 DE69018818T2 (de) | 1995-11-23 |
Family
ID=24072164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69018818T Expired - Fee Related DE69018818T2 (de) | 1990-05-07 | 1990-12-28 | Hornförmiger elektrischer Kontakt. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5118299A (de) |
EP (1) | EP0455891B1 (de) |
JP (1) | JPH0789502B2 (de) |
DE (1) | DE69018818T2 (de) |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5105537A (en) * | 1990-10-12 | 1992-04-21 | International Business Machines Corporation | Method for making a detachable electrical contact |
US5660570A (en) * | 1991-04-09 | 1997-08-26 | Northeastern University | Micro emitter based low contact force interconnection device |
US5245248A (en) * | 1991-04-09 | 1993-09-14 | Northeastern University | Micro-emitter-based low-contact-force interconnection device |
US5220725A (en) * | 1991-04-09 | 1993-06-22 | Northeastern University | Micro-emitter-based low-contact-force interconnection device |
US5230632A (en) * | 1991-12-19 | 1993-07-27 | International Business Machines Corporation | Dual element electrical contact and connector assembly utilizing same |
CA2110472C (en) * | 1993-03-01 | 1999-08-10 | Anilkumar Chinuprasad Bhatt | Method and apparatus for in-situ testing of integrated circuit chips |
US5420520A (en) | 1993-06-11 | 1995-05-30 | International Business Machines Corporation | Method and apparatus for testing of integrated circuit chips |
US5499924A (en) * | 1993-07-12 | 1996-03-19 | Kel Comporation | Butt joint connector assembly |
US5368491A (en) * | 1993-12-17 | 1994-11-29 | The Whitaker Corporation | High density electrical connector |
US5949029A (en) * | 1994-08-23 | 1999-09-07 | Thomas & Betts International, Inc. | Conductive elastomers and methods for fabricating the same |
US5600099A (en) * | 1994-12-02 | 1997-02-04 | Augat Inc. | Chemically grafted electrical devices |
US5527591A (en) * | 1994-12-02 | 1996-06-18 | Augat Inc. | Electrical contact having a particulate surface |
US5613296A (en) * | 1995-04-13 | 1997-03-25 | Texas Instruments Incorporated | Method for concurrent formation of contact and via holes |
US6292780B1 (en) * | 1995-08-25 | 2001-09-18 | Micra Soundcards, Inc. | Talking trading card player system |
US5709336A (en) * | 1996-05-31 | 1998-01-20 | International Business Machines Corporation | Method of forming a solderless electrical connection with a wirebond chip |
US5939786A (en) * | 1996-11-08 | 1999-08-17 | International Business Machines Corporation | Uniform plating of dendrites |
US6037786A (en) | 1996-12-13 | 2000-03-14 | International Business Machines Corporation | Testing integrated circuit chips |
SE516011C2 (sv) * | 1996-12-19 | 2001-11-05 | Ericsson Telefon Ab L M | Tätpackade elektriska kontaktdon |
US6137299A (en) * | 1997-06-27 | 2000-10-24 | International Business Machines Corporation | Method and apparatus for testing integrated circuit chips |
US6036502A (en) | 1997-11-03 | 2000-03-14 | Intercon Systems, Inc. | Flexible circuit compression connector system and method of manufacture |
US5899757A (en) * | 1997-11-03 | 1999-05-04 | Intercon Systems, Inc. | Compression connector |
US6027346A (en) * | 1998-06-29 | 2000-02-22 | Xandex, Inc. | Membrane-supported contactor for semiconductor test |
US6176985B1 (en) | 1998-10-23 | 2001-01-23 | International Business Machines Corporation | Laminated electroplating rack and connection system for optimized plating |
US6347901B1 (en) | 1999-11-01 | 2002-02-19 | International Business Machines Corporation | Solder interconnect techniques |
US20030136505A1 (en) * | 2002-01-18 | 2003-07-24 | Wimmer Phillip L. | Method of preparing a surface for adhesion |
KR100481172B1 (ko) * | 2002-07-04 | 2005-04-07 | 삼성전자주식회사 | 고용량 터미널 연결고정장치 |
US20050012212A1 (en) * | 2003-07-17 | 2005-01-20 | Cookson Electronics, Inc. | Reconnectable chip interface and chip package |
KR100585104B1 (ko) * | 2003-10-24 | 2006-05-30 | 삼성전자주식회사 | 초박형 플립칩 패키지의 제조방법 |
US7402994B2 (en) * | 2004-08-09 | 2008-07-22 | Electro Scientific Industries, Inc. | Self-cleaning lower contact |
DE102005049235B4 (de) * | 2004-10-20 | 2009-07-09 | Panasonic Corp., Kadoma | Schalter und Verfahren zum Herstellen desselben |
US7905471B2 (en) * | 2004-11-22 | 2011-03-15 | Electro Scientific Industries, Inc. | Vacuum ring designs for electrical contacting improvement |
US7452214B2 (en) * | 2006-12-08 | 2008-11-18 | Verigy (Singapore) Pte. Ltd. | Interconnect assemblies, and methods of forming interconnects, between conductive contact bumps and conductive contact pads |
JP2008293746A (ja) * | 2007-05-23 | 2008-12-04 | Japan Aviation Electronics Industry Ltd | コネクタ |
JP5380800B2 (ja) * | 2007-07-12 | 2014-01-08 | ヤマハ株式会社 | 電子部品の製造方法 |
US7699635B2 (en) * | 2008-09-23 | 2010-04-20 | The Boeing Company | Randomly-accessible electrical busbar with protective cover and associated mating connector |
TWI397004B (zh) * | 2009-02-06 | 2013-05-21 | Acer Inc | 整合按鍵的液晶顯示面板及整合按鍵於液晶顯示面板的方法 |
JP5333029B2 (ja) * | 2009-08-10 | 2013-11-06 | Jsr株式会社 | 電気接続部材および電気接続部材の製造方法 |
US7927911B2 (en) * | 2009-08-28 | 2011-04-19 | International Business Machines Corporation | Wafer bonded access device for multi-layer phase change memory using lock-and-key alignment |
US8283650B2 (en) * | 2009-08-28 | 2012-10-09 | International Business Machines Corporation | Flat lower bottom electrode for phase change memory cell |
US8283202B2 (en) | 2009-08-28 | 2012-10-09 | International Business Machines Corporation | Single mask adder phase change memory element |
US8012790B2 (en) * | 2009-08-28 | 2011-09-06 | International Business Machines Corporation | Chemical mechanical polishing stop layer for fully amorphous phase change memory pore cell |
US8233317B2 (en) * | 2009-11-16 | 2012-07-31 | International Business Machines Corporation | Phase change memory device suitable for high temperature operation |
US8129268B2 (en) | 2009-11-16 | 2012-03-06 | International Business Machines Corporation | Self-aligned lower bottom electrode |
US7943420B1 (en) * | 2009-11-25 | 2011-05-17 | International Business Machines Corporation | Single mask adder phase change memory element |
WO2011088164A2 (en) | 2010-01-14 | 2011-07-21 | Laird Technologies, Inc. | Electrical contacts with laser defined geometries |
CA2719927C (en) | 2010-11-05 | 2014-04-29 | Ibm Canada Limited - Ibm Canada Limitee | Laser ashing of polyimide for semiconductor manufacturing |
DE102013203273B4 (de) * | 2013-02-27 | 2017-02-23 | S-Y Systems Technologies Europe Gmbh | Kontaktelement |
US9653194B2 (en) * | 2013-08-12 | 2017-05-16 | Te Connectivity Corporation | Low resistance insert |
DE102014207714B4 (de) * | 2014-04-24 | 2023-06-07 | Te Connectivity Germany Gmbh | Kontaktanordnung mit ein Formgehemme bildenden Kontaktelementen |
US9876298B2 (en) * | 2014-08-04 | 2018-01-23 | Te Connectivity Corporation | Flexible connector and methods of manufacture |
US9692147B1 (en) * | 2015-12-22 | 2017-06-27 | Intel Corporation | Small form factor sockets and connectors |
US9859624B2 (en) * | 2016-04-29 | 2018-01-02 | Deere & Company | Electrical connector assembly |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1170621A (fr) * | 1957-04-04 | 1959-01-16 | Kienzle Uhrenfabriken Ag | Dispositif de contact électrique |
US3346350A (en) * | 1965-05-25 | 1967-10-10 | Engelhard Ind Inc | Electrical contact tape |
US3344316A (en) * | 1965-08-17 | 1967-09-26 | John P Stelmak | Electrical connection of components to printed circuits |
NL7003475A (de) * | 1969-03-28 | 1970-09-30 | ||
US3725845A (en) * | 1971-03-30 | 1973-04-03 | Hughes Aircraft Co | Environment proof connector |
US3881799A (en) * | 1972-09-11 | 1975-05-06 | George H Elliott | Resilient multi-micro point metallic junction |
US3922814A (en) * | 1973-12-27 | 1975-12-02 | Kelley Co Inc | Control switching for automatic load operators |
JPS5273394A (en) * | 1975-12-17 | 1977-06-20 | Seiko Epson Corp | Connector |
US4050756A (en) * | 1975-12-22 | 1977-09-27 | International Telephone And Telegraph Corporation | Conductive elastomer connector and method of making same |
US4116517A (en) * | 1976-04-15 | 1978-09-26 | International Telephone And Telegraph Corporation | Flexible printed circuit and electrical connection therefor |
US4100856A (en) * | 1977-02-17 | 1978-07-18 | General Electric Company | Fuze encoder |
FR2387529A1 (fr) * | 1977-04-15 | 1978-11-10 | Ibm | Contacts et connexions electriques a dendrites |
IT1112620B (it) * | 1977-04-15 | 1986-01-20 | Ibm | Connettore elettrico perfezionato |
US4328410A (en) * | 1978-08-24 | 1982-05-04 | Slivinsky Sandra H | Laser skiving system |
US4240198A (en) * | 1979-02-21 | 1980-12-23 | International Telephone And Telegraph Corporation | Method of making conductive elastomer connector |
US4254431A (en) * | 1979-06-20 | 1981-03-03 | International Business Machines Corporation | Restorable backbond for LSI chips using liquid metal coated dendrites |
JPS6067506A (ja) * | 1983-09-22 | 1985-04-17 | Nippon Oil Co Ltd | ポリオレフインの製造方法 |
US4508749A (en) * | 1983-12-27 | 1985-04-02 | International Business Machines Corporation | Patterning of polyimide films with ultraviolet light |
EP0164564A1 (de) * | 1984-05-18 | 1985-12-18 | Siemens Aktiengesellschaft | Anordnung zur Sacklocherzeugung in einem laminierten Aufbau |
US4751563A (en) * | 1984-11-05 | 1988-06-14 | International Business Machines, Corp. | Microminiaturized electrical interconnection device and its method of fabrication |
US4604644A (en) * | 1985-01-28 | 1986-08-05 | International Business Machines Corporation | Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making |
US4813129A (en) * | 1987-06-19 | 1989-03-21 | Hewlett-Packard Company | Interconnect structure for PC boards and integrated circuits |
EP0347561B1 (de) * | 1988-06-21 | 1994-03-16 | International Business Machines Corporation | Lösbare elektrische Verbindung |
US4976626A (en) * | 1988-12-21 | 1990-12-11 | International Business Machines Corporation | Connector for connecting flexible film circuit carrier to board or card |
US4892487A (en) * | 1989-06-15 | 1990-01-09 | Ibm Corporation | Connector assembly with movable carriage |
-
1990
- 1990-05-07 US US07/520,335 patent/US5118299A/en not_active Expired - Fee Related
- 1990-12-28 DE DE69018818T patent/DE69018818T2/de not_active Expired - Fee Related
- 1990-12-28 EP EP90125727A patent/EP0455891B1/de not_active Expired - Lifetime
-
1991
- 1991-05-02 JP JP3128290A patent/JPH0789502B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0455891B1 (de) | 1995-04-19 |
US5118299A (en) | 1992-06-02 |
EP0455891A1 (de) | 1991-11-13 |
JPH04262373A (ja) | 1992-09-17 |
JPH0789502B2 (ja) | 1995-09-27 |
DE69018818T2 (de) | 1995-11-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |