DE69017810D1 - Vorrichtung zur chemischen Dampfphasenabscheidung. - Google Patents

Vorrichtung zur chemischen Dampfphasenabscheidung.

Info

Publication number
DE69017810D1
DE69017810D1 DE69017810T DE69017810T DE69017810D1 DE 69017810 D1 DE69017810 D1 DE 69017810D1 DE 69017810 T DE69017810 T DE 69017810T DE 69017810 T DE69017810 T DE 69017810T DE 69017810 D1 DE69017810 D1 DE 69017810D1
Authority
DE
Germany
Prior art keywords
vapor deposition
chemical vapor
deposition device
chemical
vapor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69017810T
Other languages
English (en)
Inventor
Tatsushi Hara
Nobuhiro Misawa
Toshiya Suzuki
Takayuki Ohba
Fumitake Mieno
Akio Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE69017810D1 publication Critical patent/DE69017810D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45517—Confinement of gases to vicinity of substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45587—Mechanical means for changing the gas flow
    • C23C16/45591—Fixed means, e.g. wings, baffles
DE69017810T 1989-08-18 1990-08-16 Vorrichtung zur chemischen Dampfphasenabscheidung. Expired - Lifetime DE69017810D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1213477A JP2506451B2 (ja) 1989-08-18 1989-08-18 化学気相成長装置及び化学気相成長法

Publications (1)

Publication Number Publication Date
DE69017810D1 true DE69017810D1 (de) 1995-04-20

Family

ID=16639851

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69017810T Expired - Lifetime DE69017810D1 (de) 1989-08-18 1990-08-16 Vorrichtung zur chemischen Dampfphasenabscheidung.

Country Status (5)

Country Link
US (1) US5264038A (de)
EP (1) EP0418554B1 (de)
JP (1) JP2506451B2 (de)
KR (1) KR940001645B1 (de)
DE (1) DE69017810D1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5421888A (en) * 1992-05-12 1995-06-06 Sony Corporation Low pressure CVD apparatus comprising gas distribution collimator
US5290358A (en) * 1992-09-30 1994-03-01 International Business Machines Corporation Apparatus for directional low pressure chemical vapor deposition (DLPCVD)
JPH0745530A (ja) * 1993-07-27 1995-02-14 Shin Etsu Handotai Co Ltd 縦型気相成長装置
US5595936A (en) * 1993-08-04 1997-01-21 Hyundai Electronics Industries Co., Ltd. Method for forming contacts in semiconductor device
US6035100A (en) * 1997-05-16 2000-03-07 Applied Materials, Inc. Reflector cover for a semiconductor processing chamber
JP3917237B2 (ja) * 1997-05-20 2007-05-23 東京エレクトロン株式会社 レジスト膜形成方法
JP3403357B2 (ja) 1999-06-03 2003-05-06 株式会社半導体先端テクノロジーズ 配線形成方法及び配線形成装置
US6499426B1 (en) 1999-12-10 2002-12-31 Saint-Gobain Industrial Ceramics, Inc. System and method for coating non-planar surfaces of objects with diamond film
US6547876B2 (en) 2001-02-07 2003-04-15 Emcore Corporation Apparatus for growing epitaxial layers on wafers by chemical vapor deposition
US7049226B2 (en) 2001-09-26 2006-05-23 Applied Materials, Inc. Integration of ALD tantalum nitride for copper metallization
US7780785B2 (en) 2001-10-26 2010-08-24 Applied Materials, Inc. Gas delivery apparatus for atomic layer deposition
US6916398B2 (en) 2001-10-26 2005-07-12 Applied Materials, Inc. Gas delivery apparatus and method for atomic layer deposition
JP2005514762A (ja) * 2001-12-20 2005-05-19 東京エレクトロン株式会社 加工物をプラズマ処理するための磁気フィルタを備える方法および装置
JP2007242850A (ja) * 2006-03-08 2007-09-20 Nec Corp 半導体製造装置及び半導体製造方法
KR102135409B1 (ko) * 2016-11-09 2020-07-17 주식회사 원익아이피에스 로드락챔버 및 이를 포함하는 기판처리장치
KR20200135666A (ko) 2019-05-24 2020-12-03 삼성전자주식회사 기판 처리 장치

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3098763A (en) * 1961-05-29 1963-07-23 Raytheon Co Chemical reactor
US4340462A (en) * 1981-02-13 1982-07-20 Lam Research Corporation Adjustable electrode plasma processing chamber
JPS59207631A (ja) * 1983-05-11 1984-11-24 Semiconductor Res Found 光化学を用いたドライプロセス装置
JPS6091631A (ja) * 1983-10-25 1985-05-23 Toshiba Corp 半導体装置の製造方法
JPS61127119A (ja) * 1984-11-22 1986-06-14 Sanyo Electric Co Ltd シリコン結晶の成長方法
JPS6376876A (ja) * 1986-09-19 1988-04-07 Fujitsu Ltd 気相成長法
US4774416A (en) * 1986-09-24 1988-09-27 Plaser Corporation Large cross-sectional area molecular beam source for semiconductor processing
JPH0772351B2 (ja) * 1986-12-01 1995-08-02 株式会社日立製作所 金属薄膜選択成長方法
US4838201A (en) * 1986-12-12 1989-06-13 Daido Sanso K. K. Apparatus and process for vacuum chemical epitaxy
JPS63153273A (ja) * 1986-12-16 1988-06-25 Matsushita Electric Ind Co Ltd 金属薄膜の選択堆積方法
US5000113A (en) * 1986-12-19 1991-03-19 Applied Materials, Inc. Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process
JPS63227011A (ja) * 1987-03-17 1988-09-21 Fujitsu Ltd 化学気相成長装置
US4980204A (en) * 1987-11-27 1990-12-25 Fujitsu Limited Metal organic chemical vapor deposition method with controlled gas flow rate
JPH0757033B2 (ja) * 1988-06-20 1995-06-14 日通工株式会社 局線インタフェース回路

Also Published As

Publication number Publication date
EP0418554B1 (de) 1995-03-15
JP2506451B2 (ja) 1996-06-12
US5264038A (en) 1993-11-23
KR940001645B1 (ko) 1994-02-28
EP0418554A2 (de) 1991-03-27
EP0418554A3 (en) 1991-07-17
JPH0376220A (ja) 1991-04-02
KR910005380A (ko) 1991-03-30

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