DE69012373D1 - Verfahren und Vorrichtung zum Trocknen von Substraten nach Behandlung in einer Flüssigkeit. - Google Patents
Verfahren und Vorrichtung zum Trocknen von Substraten nach Behandlung in einer Flüssigkeit.Info
- Publication number
- DE69012373D1 DE69012373D1 DE69012373T DE69012373T DE69012373D1 DE 69012373 D1 DE69012373 D1 DE 69012373D1 DE 69012373 T DE69012373 T DE 69012373T DE 69012373 T DE69012373 T DE 69012373T DE 69012373 D1 DE69012373 D1 DE 69012373D1
- Authority
- DE
- Germany
- Prior art keywords
- treatment
- liquid
- drying substrates
- substrates
- drying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL8900480A NL8900480A (nl) | 1989-02-27 | 1989-02-27 | Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof. |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69012373D1 true DE69012373D1 (de) | 1994-10-20 |
DE69012373T2 DE69012373T2 (de) | 1995-04-20 |
Family
ID=19854214
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69012373T Expired - Lifetime DE69012373T2 (de) | 1989-02-27 | 1990-02-21 | Verfahren und Vorrichtung zum Trocknen von Substraten nach Behandlung in einer Flüssigkeit. |
Country Status (7)
Country | Link |
---|---|
US (4) | US6012472A (de) |
EP (1) | EP0385536B1 (de) |
JP (1) | JP3009699B2 (de) |
KR (1) | KR0173449B1 (de) |
CN (1) | CN1023450C (de) |
DE (1) | DE69012373T2 (de) |
NL (1) | NL8900480A (de) |
Families Citing this family (100)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8900480A (nl) * | 1989-02-27 | 1990-09-17 | Philips Nv | Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof. |
JPH06103686B2 (ja) * | 1989-11-24 | 1994-12-14 | シー エフ エム テクノロジーズ,インコーポレイテッド | 表面乾燥処理方法および装置 |
NL9000484A (nl) * | 1990-03-01 | 1991-10-01 | Philips Nv | Werkwijze voor het in een centrifuge verwijderen van een vloeistof van een oppervlak van een substraat. |
JPH04215878A (ja) * | 1990-03-14 | 1992-08-06 | Seiko Epson Corp | 液中ジェット洗浄方法及び洗浄装置 |
ATE258084T1 (de) | 1991-10-04 | 2004-02-15 | Cfmt Inc | Superreinigung von komplizierten mikroteilchen |
JP2639771B2 (ja) * | 1991-11-14 | 1997-08-13 | 大日本スクリーン製造株式会社 | 基板の洗浄・乾燥処理方法並びにその処理装置 |
JPH06196472A (ja) * | 1992-12-22 | 1994-07-15 | Soltec:Kk | ウェットエッチング方法及びウェット洗浄方法 |
JP3347814B2 (ja) * | 1993-05-17 | 2002-11-20 | 大日本スクリーン製造株式会社 | 基板の洗浄・乾燥処理方法並びにその処理装置 |
US5464480A (en) * | 1993-07-16 | 1995-11-07 | Legacy Systems, Inc. | Process and apparatus for the treatment of semiconductor wafers in a fluid |
US5911837A (en) * | 1993-07-16 | 1999-06-15 | Legacy Systems, Inc. | Process for treatment of semiconductor wafers in a fluid |
WO1995008406A1 (en) † | 1993-09-22 | 1995-03-30 | Legacy Systems, Inc. | Process and apparatus for the treatment of semiconductor wafers in a fluid |
JP2888409B2 (ja) * | 1993-12-14 | 1999-05-10 | 信越半導体株式会社 | ウェーハ洗浄槽 |
DE4413077C2 (de) * | 1994-04-15 | 1997-02-06 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zur chemischen Behandlung von Substraten |
DE4428169C2 (de) * | 1994-08-09 | 1996-07-11 | Steag Micro Tech Gmbh | Träger für Substrate |
US5772784A (en) | 1994-11-14 | 1998-06-30 | Yieldup International | Ultra-low particle semiconductor cleaner |
US5571337A (en) * | 1994-11-14 | 1996-11-05 | Yieldup International | Method for cleaning and drying a semiconductor wafer |
US5958146A (en) * | 1994-11-14 | 1999-09-28 | Yieldup International | Ultra-low particle semiconductor cleaner using heated fluids |
US5849104A (en) * | 1996-09-19 | 1998-12-15 | Yieldup International | Method and apparatus for cleaning wafers using multiple tanks |
US5634978A (en) * | 1994-11-14 | 1997-06-03 | Yieldup International | Ultra-low particle semiconductor method |
DE19549488C2 (de) * | 1995-01-05 | 2001-08-02 | Steag Micro Tech Gmbh | Anlage zur chemischen Naßbehandlung |
DE19546990C2 (de) * | 1995-01-05 | 1997-07-03 | Steag Micro Tech Gmbh | Anlage zur chemischen Naßbehandlung |
JPH08211592A (ja) * | 1995-02-07 | 1996-08-20 | Nikon Corp | 洗浄乾燥方法及び洗浄乾燥装置 |
DE19517573C2 (de) * | 1995-05-12 | 2000-11-02 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zur Naßbehandlung von Substraten in einem Behälter |
US5714203A (en) * | 1995-08-23 | 1998-02-03 | Ictop Entwicklungs Gmbh | Procedure for the drying of silicon |
DE19531031C2 (de) * | 1995-08-23 | 1997-08-21 | Ictop Entwicklungsgesellschaft | Verfahren zum Trocknen von Silizium |
DE19541436C2 (de) * | 1995-11-07 | 1998-10-08 | Steag Micro Tech Gmbh | Anlage zur Behandlung von Gegenständen in einem Prozeßtank |
TW310452B (de) * | 1995-12-07 | 1997-07-11 | Tokyo Electron Co Ltd | |
US5845660A (en) * | 1995-12-07 | 1998-12-08 | Tokyo Electron Limited | Substrate washing and drying apparatus, substrate washing method, and substrate washing apparatus |
EP0784336A3 (de) | 1995-12-15 | 1998-05-13 | Texas Instruments Incorporated | Verbesserungen bei der Herstellung und Bearbeitung von Halbleitervorrichtungen |
DE19800584C2 (de) * | 1998-01-09 | 2002-06-20 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zum Trocknen von Substraten |
DE19613620C2 (de) * | 1996-04-04 | 1998-04-16 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zum Trocknen von Substraten |
DE19637875C2 (de) * | 1996-04-17 | 1999-07-22 | Steag Micro Tech Gmbh | Anlage zur Naßbehandlung von Substraten |
DE19703646C2 (de) * | 1996-04-22 | 1998-04-09 | Steag Micro Tech Gmbh | Vorrichtung und Verfahren zum Behandeln von Substraten in einem Fluid-Behälter |
JP4421686B2 (ja) | 1996-06-24 | 2010-02-24 | インテルウニフェルシテール ミクロエレクトロニカ セントルム フェライニジンク ゾンダ ウィンストベヤーク | 平坦な基材を湿式でクリーニングまたはエッチングするための装置および方法 |
US6045624A (en) * | 1996-09-27 | 2000-04-04 | Tokyo Electron Limited | Apparatus for and method of cleaning objects to be processed |
DE19640848C2 (de) * | 1996-10-03 | 1998-07-16 | Steag Microtech Gmbh Pliezhaus | Verfahren und Vorrichtung zum Behandeln von Substraten |
DE19706072C1 (de) | 1997-02-17 | 1998-06-04 | Steag Microtech Gmbh Pliezhaus | Vorrichtung und Verfahren zum Behandeln von Substraten in einem Fluid-Behälter |
US6350322B1 (en) | 1997-03-21 | 2002-02-26 | Micron Technology, Inc. | Method of reducing water spotting and oxide growth on a semiconductor structure |
US6164297A (en) * | 1997-06-13 | 2000-12-26 | Tokyo Electron Limited | Cleaning and drying apparatus for objects to be processed |
JP3151613B2 (ja) | 1997-06-17 | 2001-04-03 | 東京エレクトロン株式会社 | 洗浄・乾燥処理方法及びその装置 |
JPH1126423A (ja) * | 1997-07-09 | 1999-01-29 | Sugai:Kk | 半導体ウエハ等の処理方法並びにその処理装置 |
KR100707107B1 (ko) * | 1997-07-17 | 2007-12-27 | 동경 엘렉트론 주식회사 | 세정.건조처리방법및장치 |
US5884640A (en) * | 1997-08-07 | 1999-03-23 | Applied Materials, Inc. | Method and apparatus for drying substrates |
US6261377B1 (en) * | 1997-09-24 | 2001-07-17 | Interuniversitair Microelektronica Centrum (Imec) | Method of removing particles and a liquid from a surface of substrate |
US5807439A (en) * | 1997-09-29 | 1998-09-15 | Siemens Aktiengesellschaft | Apparatus and method for improved washing and drying of semiconductor wafers |
JP3043709B2 (ja) | 1997-11-19 | 2000-05-22 | 株式会社カイジョー | 基板の乾燥装置 |
JPH11176798A (ja) * | 1997-12-08 | 1999-07-02 | Toshiba Corp | 基板洗浄・乾燥装置及び方法 |
EP1044465A4 (de) * | 1997-12-10 | 2001-07-18 | Cfmt Inc | Verfahren zur nassbehandlung für die herstellung elektronischer komponente |
DE19800949A1 (de) * | 1998-01-13 | 1999-07-15 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zum Trocknen eines Gegenstandes |
DE19800951A1 (de) * | 1998-01-13 | 1999-07-15 | Steag Micro Tech Gmbh | Vorrichtung zur Naßbehandlung von Substraten |
DE19802579A1 (de) * | 1998-01-23 | 1999-07-29 | Steag Micro Tech Gmbh | Vorrichtung und Verfahren zur Behandlung von Substraten |
SG81975A1 (en) | 1998-04-14 | 2001-07-24 | Kaijo Kk | Method and apparatus for drying washed objects |
US6047717A (en) * | 1998-04-29 | 2000-04-11 | Scd Mountain View, Inc. | Mandrel device and method for hard disks |
US6273100B1 (en) | 1998-08-27 | 2001-08-14 | Micron Technology, Inc. | Surface cleaning apparatus and method |
US6216709B1 (en) | 1998-09-04 | 2001-04-17 | Komag, Inc. | Method for drying a substrate |
US6571806B2 (en) | 1998-09-04 | 2003-06-03 | Komag, Inc. | Method for drying a substrate |
DE19859468C2 (de) * | 1998-12-22 | 2002-01-17 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln und Handhaben von Substraten |
US6955516B2 (en) | 2001-11-02 | 2005-10-18 | Applied Materials, Inc. | Single wafer dryer and drying methods |
US6328814B1 (en) | 1999-03-26 | 2001-12-11 | Applied Materials, Inc. | Apparatus for cleaning and drying substrates |
US6495215B1 (en) | 1999-05-26 | 2002-12-17 | Tokyo Electron Limited | Method and apparatus for processing substrate |
DE19924302A1 (de) * | 1999-05-27 | 2000-12-07 | Steag Micro Tech Gmbh | Vorrichtung und Verfahren zum Trocknen von Substraten |
US6192600B1 (en) * | 1999-09-09 | 2001-02-27 | Semitool, Inc. | Thermocapillary dryer |
US6355111B1 (en) | 1999-11-24 | 2002-03-12 | International Business Machines Corporation | Method for removing contaminants from a workpiece using a chemically reactive additive |
DE19960241A1 (de) * | 1999-12-14 | 2001-07-05 | Steag Micro Tech Gmbh | Vorrichtung und Verfahren zum Behandeln von Substraten |
US6293616B1 (en) * | 2000-01-10 | 2001-09-25 | Ford Global Technologies, Inc. | Modular rail for roof and windshield |
JP2001291698A (ja) * | 2000-04-10 | 2001-10-19 | Nec Corp | 処理装置および処理方法 |
US7364625B2 (en) * | 2000-05-30 | 2008-04-29 | Fsi International, Inc. | Rinsing processes and equipment |
ATE452419T1 (de) * | 2000-06-27 | 2010-01-15 | Imec | Verfahren und vorrichtung zum reinigen und trocknen eines substrats |
US6508014B2 (en) | 2001-02-16 | 2003-01-21 | International Business Machines Corporation | Method of drying substrates |
DE10122669A1 (de) * | 2001-05-10 | 2002-12-12 | Mattson Wet Products Gmbh | Vorrichtung zum Nassreinigen von scheibenförmigen Substraten |
US7513062B2 (en) * | 2001-11-02 | 2009-04-07 | Applied Materials, Inc. | Single wafer dryer and drying methods |
US20030136429A1 (en) * | 2002-01-22 | 2003-07-24 | Semitool, Inc. | Vapor cleaning and liquid rinsing process vessel |
DE10215283B4 (de) * | 2002-04-05 | 2004-06-03 | Astec Halbleitertechnologie Gmbh | Vorrichtung zur Aufnahme von Substraten |
US20040031167A1 (en) * | 2002-06-13 | 2004-02-19 | Stein Nathan D. | Single wafer method and apparatus for drying semiconductor substrates using an inert gas air-knife |
KR100480606B1 (ko) * | 2002-08-01 | 2005-04-06 | 삼성전자주식회사 | 아이피에이 증기 건조 방식을 이용한 반도체 웨이퍼 건조장치 |
US6875289B2 (en) * | 2002-09-13 | 2005-04-05 | Fsi International, Inc. | Semiconductor wafer cleaning systems and methods |
US20040129297A1 (en) * | 2003-01-03 | 2004-07-08 | Settlemyer Kenneth T. | Method and system for reducing effects of halfpitch wafer spacing during wet processes |
KR20050015411A (ko) * | 2003-08-05 | 2005-02-21 | 삼성전자주식회사 | 세정 장치 및 이를 이용한 세정 방법 |
US6977215B2 (en) * | 2003-10-28 | 2005-12-20 | Nec Electronics America, Inc. | Tungsten plug corrosion prevention method using gas sparged water |
DE10359320A1 (de) * | 2003-12-17 | 2005-07-21 | Scp Germany Gmbh | Vorrichtung und Verfahren zum Trocknen von Substraten |
JP2006080420A (ja) * | 2004-09-13 | 2006-03-23 | Ses Co Ltd | 基板処理法及び基板処理装置 |
DE102004058386B4 (de) * | 2004-12-03 | 2007-06-21 | Alfing Montagetechnik Gmbh | Vorrichtung und Verfahren zum Unterkühlen von Montageteilen |
DE102004060980A1 (de) * | 2004-12-17 | 2006-07-06 | Infineon Technologies Ag | Vorrichtung und Verfahren zur Trocknung von Substraten |
US8070884B2 (en) * | 2005-04-01 | 2011-12-06 | Fsi International, Inc. | Methods for rinsing microelectronic substrates utilizing cool rinse fluid within a gas enviroment including a drying enhancement substance |
TWI364524B (en) * | 2005-05-13 | 2012-05-21 | Lam Res Ag | Method for drying a surface |
KR20080023264A (ko) * | 2005-06-28 | 2008-03-12 | 아사히 테크 가부시끼가이샤 | 표면 개질된 부재, 표면 처리 방법 및 표면 처리 장치 |
WO2007047163A2 (en) | 2005-10-04 | 2007-04-26 | Applied Materials, Inc. | Methods and apparatus for drying a substrate |
US8388762B2 (en) * | 2007-05-02 | 2013-03-05 | Lam Research Corporation | Substrate cleaning technique employing multi-phase solution |
US20110195579A1 (en) * | 2010-02-11 | 2011-08-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Scribe-line draining during wet-bench etch and clean processes |
US20120306139A1 (en) | 2011-06-03 | 2012-12-06 | Arthur Keigler | Parallel single substrate processing system holder |
US9396912B2 (en) * | 2011-10-31 | 2016-07-19 | Lam Research Corporation | Methods for mixed acid cleaning of showerhead electrodes |
DE102013102545A1 (de) | 2012-04-27 | 2013-10-31 | Awt Advanced Wet Technologies Gmbh | Verfahren zum Behandeln von zumindest einem Substrat in einem flüssigen Medium |
DE102014207266A1 (de) * | 2014-04-15 | 2015-10-15 | Siltronic Ag | Verfahren zum Trocknen von scheibenförmigen Substraten undScheibenhalter zur Durchführung des Verfahrens |
JP6489524B2 (ja) * | 2015-08-18 | 2019-03-27 | 株式会社Screenホールディングス | 基板処理装置 |
JP7241568B2 (ja) * | 2019-03-04 | 2023-03-17 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法および記憶媒体 |
JP7281925B2 (ja) * | 2019-03-07 | 2023-05-26 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法および記憶媒体 |
CN110544654B (zh) * | 2019-08-27 | 2022-04-15 | 西安奕斯伟材料科技有限公司 | 一种硅片处理装置和处理方法 |
EP3840023B1 (de) | 2019-12-18 | 2022-10-19 | Siltronic AG | Verbesserte vorrichtung zum trocknen von halbleitersubstraten |
EP3840021B1 (de) | 2019-12-18 | 2022-10-19 | Siltronic AG | Verbesserte vorrichtung zum trocknen von halbleitersubstraten |
EP3840022B1 (de) | 2019-12-18 | 2022-10-05 | Siltronic AG | Verbesserte vorrichtung zum trocknen von halbleitersubstraten |
Family Cites Families (22)
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US4463774A (en) * | 1983-01-28 | 1984-08-07 | The Boeing Company | Fuselage-mounted valve for condensate drainage and cabin-air pressurization |
JPS60223130A (ja) * | 1984-04-19 | 1985-11-07 | Sharp Corp | 基板の洗滌乾燥方法及びその装置 |
JPH0673352B2 (ja) * | 1984-05-18 | 1994-09-14 | 松下電器産業株式会社 | 高圧ジェット洗浄方法 |
US4633893A (en) * | 1984-05-21 | 1987-01-06 | Cfm Technologies Limited Partnership | Apparatus for treating semiconductor wafers |
US4577650A (en) * | 1984-05-21 | 1986-03-25 | Mcconnell Christopher F | Vessel and system for treating wafers with fluids |
US4911761A (en) * | 1984-05-21 | 1990-03-27 | Cfm Technologies Research Associates | Process and apparatus for drying surfaces |
US4778532A (en) * | 1985-06-24 | 1988-10-18 | Cfm Technologies Limited Partnership | Process and apparatus for treating wafers with process fluids |
JPS6263422A (ja) * | 1985-09-13 | 1987-03-20 | Toshiba Ceramics Co Ltd | シリコンウエ−ハ処理用治具 |
US4746397A (en) * | 1986-01-17 | 1988-05-24 | Matsushita Electric Industrial Co., Ltd. | Treatment method for plate-shaped substrate |
US4722752A (en) * | 1986-06-16 | 1988-02-02 | Robert F. Orr | Apparatus and method for rinsing and drying silicon wafers |
JPH0789547B2 (ja) * | 1986-07-02 | 1995-09-27 | 松下電器産業株式会社 | 乾燥方法 |
JPS6315048U (de) * | 1986-07-16 | 1988-02-01 | ||
JPS6327576A (ja) * | 1986-07-22 | 1988-02-05 | Toshiba Ceramics Co Ltd | 研磨プレ−ト用接着剤 |
NL8601939A (nl) * | 1986-07-28 | 1988-02-16 | Philips Nv | Werkwijze voor het verwijderen van ongewenste deeltjes van een oppervlak van een substraat. |
JPS6356921A (ja) * | 1986-08-28 | 1988-03-11 | Tokyo Ohka Kogyo Co Ltd | 基板の処理方法 |
JPH0695514B2 (ja) * | 1986-12-25 | 1994-11-24 | 株式会社トクヤマ | 乾燥方法 |
JPS63182818A (ja) * | 1987-01-26 | 1988-07-28 | Hitachi Ltd | 乾燥装置 |
US5105556A (en) * | 1987-08-12 | 1992-04-21 | Hitachi, Ltd. | Vapor washing process and apparatus |
US4828751A (en) * | 1987-08-28 | 1989-05-09 | Pcr, Inc. | Solvent composition for cleaning silicon wafers |
US4902350A (en) * | 1987-09-09 | 1990-02-20 | Robert F. Orr | Method for rinsing, cleaning and drying silicon wafers |
US5129955A (en) * | 1989-01-11 | 1992-07-14 | Dainippon Screen Mfg. Co., Ltd. | Wafer cleaning method |
NL8900480A (nl) * | 1989-02-27 | 1990-09-17 | Philips Nv | Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof. |
-
1989
- 1989-02-27 NL NL8900480A patent/NL8900480A/nl not_active Application Discontinuation
-
1990
- 1990-02-21 DE DE69012373T patent/DE69012373T2/de not_active Expired - Lifetime
- 1990-02-21 EP EP90200409A patent/EP0385536B1/de not_active Expired - Lifetime
- 1990-02-22 JP JP2042302A patent/JP3009699B2/ja not_active Expired - Lifetime
- 1990-02-23 KR KR1019900002291A patent/KR0173449B1/ko not_active IP Right Cessation
- 1990-02-24 CN CN90100958A patent/CN1023450C/zh not_active Expired - Lifetime
-
1992
- 1992-07-15 US US07/914,654 patent/US6012472A/en not_active Expired - Lifetime
-
1998
- 1998-07-30 US US09/126,621 patent/US6139645A/en not_active Expired - Fee Related
-
2000
- 2000-01-14 US US09/502,724 patent/US6170495B1/en not_active Expired - Fee Related
- 2000-11-13 US US09/711,231 patent/US6533872B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6139645A (en) | 2000-10-31 |
US6533872B1 (en) | 2003-03-18 |
NL8900480A (nl) | 1990-09-17 |
CN1045539A (zh) | 1990-09-26 |
US6012472A (en) | 2000-01-11 |
JPH02291128A (ja) | 1990-11-30 |
DE69012373T2 (de) | 1995-04-20 |
JP3009699B2 (ja) | 2000-02-14 |
US6170495B1 (en) | 2001-01-09 |
EP0385536A1 (de) | 1990-09-05 |
EP0385536B1 (de) | 1994-09-14 |
CN1023450C (zh) | 1994-01-12 |
KR0173449B1 (ko) | 1999-04-01 |
KR900013597A (ko) | 1990-09-06 |
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