DE69009216D1 - Epitaxialstruktur für lichtemittierende Halbleiteranordnungen und lichtemittierende Halbleiteranordnung mit dieser Struktur. - Google Patents
Epitaxialstruktur für lichtemittierende Halbleiteranordnungen und lichtemittierende Halbleiteranordnung mit dieser Struktur.Info
- Publication number
- DE69009216D1 DE69009216D1 DE69009216T DE69009216T DE69009216D1 DE 69009216 D1 DE69009216 D1 DE 69009216D1 DE 69009216 T DE69009216 T DE 69009216T DE 69009216 T DE69009216 T DE 69009216T DE 69009216 D1 DE69009216 D1 DE 69009216D1
- Authority
- DE
- Germany
- Prior art keywords
- light emitting
- semiconductor light
- emitting device
- emitting devices
- epitaxial structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
- H01L33/32—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02433—Crystal orientation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02458—Nitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02579—P-type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02658—Pretreatments
- H01L21/02661—In-situ cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/16—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3202—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth
- H01S5/32025—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth non-polar orientation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
- H01S2304/04—MOCVD or MOVPE
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
- H01S5/0213—Sapphire, quartz or diamond based substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/0234—Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1033279A JP2704181B2 (ja) | 1989-02-13 | 1989-02-13 | 化合物半導体単結晶薄膜の成長方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69009216D1 true DE69009216D1 (de) | 1994-07-07 |
| DE69009216T2 DE69009216T2 (de) | 1995-03-02 |
Family
ID=12382091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69009216T Expired - Lifetime DE69009216T2 (de) | 1989-02-13 | 1990-02-10 | Epitaxialstruktur für lichtemittierende Halbleiteranordnungen und lichtemittierende Halbleiteranordnung mit dieser Struktur. |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5006908A (de) |
| EP (1) | EP0383215B1 (de) |
| JP (1) | JP2704181B2 (de) |
| DE (1) | DE69009216T2 (de) |
Families Citing this family (74)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69126152T2 (de) * | 1990-02-28 | 1997-11-13 | Toyoda Gosei Kk | Lichtemittierende Halbleitervorrichtung mit Gallium-Nitrid-Verbindung |
| US6362017B1 (en) | 1990-02-28 | 2002-03-26 | Toyoda Gosei Co., Ltd. | Light-emitting semiconductor device using gallium nitride group compound |
| US6830992B1 (en) | 1990-02-28 | 2004-12-14 | Toyoda Gosei Co., Ltd. | Method for manufacturing a gallium nitride group compound semiconductor |
| US5278433A (en) * | 1990-02-28 | 1994-01-11 | Toyoda Gosei Co., Ltd. | Light-emitting semiconductor device using gallium nitride group compound with double layer structures for the n-layer and/or the i-layer |
| JP2593960B2 (ja) * | 1990-11-29 | 1997-03-26 | シャープ株式会社 | 化合物半導体発光素子とその製造方法 |
| JPH089518B2 (ja) * | 1990-12-28 | 1996-01-31 | 名古屋大学長 | 化合物半導体単結晶の作製方法 |
| US5173751A (en) * | 1991-01-21 | 1992-12-22 | Pioneer Electronic Corporation | Semiconductor light emitting device |
| JP3098773B2 (ja) * | 1991-03-18 | 2000-10-16 | トラスティーズ・オブ・ボストン・ユニバーシティ | 高絶縁性単結晶窒化ガリウム薄膜の作製及びドープ方法 |
| US5633192A (en) * | 1991-03-18 | 1997-05-27 | Boston University | Method for epitaxially growing gallium nitride layers |
| US7235819B2 (en) * | 1991-03-18 | 2007-06-26 | The Trustees Of Boston University | Semiconductor device having group III nitride buffer layer and growth layers |
| JP3352712B2 (ja) * | 1991-12-18 | 2002-12-03 | 浩 天野 | 窒化ガリウム系半導体素子及びその製造方法 |
| JP2778349B2 (ja) * | 1992-04-10 | 1998-07-23 | 日亜化学工業株式会社 | 窒化ガリウム系化合物半導体の電極 |
| EP1313153A3 (de) * | 1992-07-23 | 2005-05-04 | Toyoda Gosei Co., Ltd. | Lichtemittierende Vorrichtung aus einer Verbindung der Galliumnitridgruppe |
| US6440823B1 (en) | 1994-01-27 | 2002-08-27 | Advanced Technology Materials, Inc. | Low defect density (Ga, Al, In)N and HVPE process for making same |
| US5909040A (en) * | 1994-03-09 | 1999-06-01 | Kabushiki Kaisha Toshiba | Semiconductor device including quaternary buffer layer with pinholes |
| US6130147A (en) * | 1994-04-07 | 2000-10-10 | Sdl, Inc. | Methods for forming group III-V arsenide-nitride semiconductor materials |
| JP2698796B2 (ja) * | 1994-04-20 | 1998-01-19 | 豊田合成株式会社 | ３族窒化物半導体発光素子 |
| US6136626A (en) * | 1994-06-09 | 2000-10-24 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light-emitting device and production method thereof |
| EP1473781A3 (de) * | 1994-07-21 | 2007-02-21 | Matsushita Electric Industrial Co., Ltd. | Lichtemittierende Halbleitervorrichtung und Herstellungsverfahren |
| KR960007835A (ko) * | 1994-08-22 | 1996-03-22 | 강박광 | 청색 발광성 질화갈륨 적층막의 제조방법 |
| US6996150B1 (en) | 1994-09-14 | 2006-02-07 | Rohm Co., Ltd. | Semiconductor light emitting device and manufacturing method therefor |
| US5787104A (en) | 1995-01-19 | 1998-07-28 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light emitting element and method for fabricating the same |
| JP3557011B2 (ja) | 1995-03-30 | 2004-08-25 | 株式会社東芝 | 半導体発光素子、及びその製造方法 |
| US5625202A (en) * | 1995-06-08 | 1997-04-29 | University Of Central Florida | Modified wurtzite structure oxide compounds as substrates for III-V nitride compound semiconductor epitaxial thin film growth |
| JP3564811B2 (ja) * | 1995-07-24 | 2004-09-15 | 豊田合成株式会社 | ３族窒化物半導体発光素子 |
| KR100267839B1 (ko) * | 1995-11-06 | 2000-10-16 | 오가와 에이지 | 질화물 반도체 장치 |
| KR100474791B1 (ko) * | 1996-05-10 | 2005-06-27 | 스미또모 가가꾸 가부시키가이샤 | 화합물반도체의제조방법 |
| JP3106956B2 (ja) * | 1996-05-23 | 2000-11-06 | 住友化学工業株式会社 | 化合物半導体用電極材料 |
| TW383508B (en) | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
| WO1998019375A1 (fr) * | 1996-10-30 | 1998-05-07 | Hitachi, Ltd. | Machine de traitement optique de l'information et dispositif a semi-conducteur emetteur de lumiere afferent |
| JPH10335750A (ja) * | 1997-06-03 | 1998-12-18 | Sony Corp | 半導体基板および半導体装置 |
| AU747260B2 (en) | 1997-07-25 | 2002-05-09 | Nichia Chemical Industries, Ltd. | Nitride semiconductor device |
| JPH11220170A (ja) * | 1998-01-29 | 1999-08-10 | Rohm Co Ltd | 発光ダイオード素子 |
| AU4708399A (en) | 1998-06-23 | 2000-01-10 | Trustees Of Boston University | Crystallographic wet chemical etching of iii-nitride material |
| JP3770014B2 (ja) | 1999-02-09 | 2006-04-26 | 日亜化学工業株式会社 | 窒化物半導体素子 |
| DE60043536D1 (de) * | 1999-03-04 | 2010-01-28 | Nichia Corp | Nitridhalbleiterlaserelement |
| GB2350927A (en) | 1999-06-12 | 2000-12-13 | Sharp Kk | A method growing nitride semiconductor layer by molecular beam epitaxy |
| US6590336B1 (en) | 1999-08-31 | 2003-07-08 | Murata Manufacturing Co., Ltd. | Light emitting device having a polar plane piezoelectric film and manufacture thereof |
| JP4897133B2 (ja) * | 1999-12-09 | 2012-03-14 | ソニー株式会社 | 半導体発光素子、その製造方法および配設基板 |
| US6586819B2 (en) | 2000-08-14 | 2003-07-01 | Nippon Telegraph And Telephone Corporation | Sapphire substrate, semiconductor device, electronic component, and crystal growing method |
| AU2002253834A1 (en) * | 2000-10-20 | 2002-08-19 | Emcore Corporation | Improved light extraction efficiency of gan based leds |
| JP3988018B2 (ja) * | 2001-01-18 | 2007-10-10 | ソニー株式会社 | 結晶膜、結晶基板および半導体装置 |
| US6794684B2 (en) | 2001-02-01 | 2004-09-21 | Cree, Inc. | Reflective ohmic contacts for silicon carbide including a layer consisting essentially of nickel, methods of fabricating same, and light emitting devices including the same |
| US6791119B2 (en) * | 2001-02-01 | 2004-09-14 | Cree, Inc. | Light emitting diodes including modifications for light extraction |
| US6576932B2 (en) | 2001-03-01 | 2003-06-10 | Lumileds Lighting, U.S., Llc | Increasing the brightness of III-nitride light emitting devices |
| JP2002335015A (ja) * | 2001-05-09 | 2002-11-22 | Rohm Co Ltd | 半導体発光素子 |
| JP3912044B2 (ja) * | 2001-06-06 | 2007-05-09 | 豊田合成株式会社 | Ｉｉｉ族窒化物系化合物半導体発光素子の製造方法 |
| US7211833B2 (en) * | 2001-07-23 | 2007-05-01 | Cree, Inc. | Light emitting diodes including barrier layers/sublayers |
| US6740906B2 (en) * | 2001-07-23 | 2004-05-25 | Cree, Inc. | Light emitting diodes including modifications for submount bonding |
| WO2003041234A1 (fr) * | 2001-11-05 | 2003-05-15 | Nichia Corporation | Element semi-conducteur |
| US20030090103A1 (en) * | 2001-11-09 | 2003-05-15 | Thomas Becker | Direct mailing device |
| US6635503B2 (en) | 2002-01-28 | 2003-10-21 | Cree, Inc. | Cluster packaging of light emitting diodes |
| JP4233268B2 (ja) * | 2002-04-23 | 2009-03-04 | シャープ株式会社 | 窒化物系半導体発光素子およびその製造方法 |
| US6958498B2 (en) * | 2002-09-27 | 2005-10-25 | Emcore Corporation | Optimized contact design for flip-chip LED |
| US7009199B2 (en) * | 2002-10-22 | 2006-03-07 | Cree, Inc. | Electronic devices having a header and antiparallel connected light emitting diodes for producing light from AC current |
| US7138648B2 (en) * | 2003-12-17 | 2006-11-21 | Palo Alto Research Center Incorporated | Ultraviolet group III-nitride-based quantum well laser diodes |
| WO2006099138A2 (en) | 2005-03-10 | 2006-09-21 | The Regents Of The University Of California | Technique for the growth of planar semi-polar gallium nitride |
| US8901699B2 (en) | 2005-05-11 | 2014-12-02 | Cree, Inc. | Silicon carbide junction barrier Schottky diodes with suppressed minority carrier injection |
| CN100372137C (zh) * | 2005-05-27 | 2008-02-27 | 晶能光电（江西）有限公司 | 具有上下电极结构的铟镓铝氮发光器件及其制造方法 |
| WO2006130696A2 (en) | 2005-06-01 | 2006-12-07 | The Regents Of The University Of California | Technique for the growth and fabrication of semipolar (ga,al,in,b)n thin films, heterostructures, and devices |
| TWI404122B (zh) * | 2005-09-09 | 2013-08-01 | Univ California | 增進半-極性（Ａｌ，Ｉｎ，Ｇａ，Ｂ）Ｎ藉由金屬有機化學氣相沈積生長之方法 |
| WO2007084782A2 (en) * | 2006-01-20 | 2007-07-26 | The Regents Of The University Of California | Method for improved growth of semipolar (al,in,ga,b)n |
| EP1977441A4 (de) * | 2006-01-20 | 2010-12-01 | Univ California | Verfahren für verstärktes wachstum semipolarer (ai,in,ga,b)n mittels metallorganischer chemischer dampfabscheidung |
| US20070200119A1 (en) * | 2006-02-26 | 2007-08-30 | Yun-Li Li | Flip-chip led package and led chip |
| EP3848970A1 (de) | 2007-01-22 | 2021-07-14 | Cree, Inc. | Emitter mit mehreren leuchtdioden |
| TW200837943A (en) * | 2007-01-22 | 2008-09-16 | Led Lighting Fixtures Inc | Fault tolerant light emitters, systems incorporating fault tolerant light emitters and methods of fabricating fault tolerant light emitters |
| JP4462289B2 (ja) | 2007-05-18 | 2010-05-12 | ソニー株式会社 | 半導体層の成長方法および半導体発光素子の製造方法 |
| JP5353113B2 (ja) * | 2008-01-29 | 2013-11-27 | 豊田合成株式会社 | Ｉｉｉ族窒化物系化合物半導体の製造方法 |
| TWI362769B (en) * | 2008-05-09 | 2012-04-21 | Univ Nat Chiao Tung | Light emitting device and fabrication method therefor |
| JP2011523931A (ja) * | 2008-05-28 | 2011-08-25 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 低濃度アルカリ金属保有の六方晶系ウルツ鉱型エピタキシャル層およびその生成方法 |
| WO2011019920A1 (en) * | 2009-08-12 | 2011-02-17 | Georgia State University Research Foundation, Inc. | High pressure chemical vapor deposition apparatuses, methods, and compositions produced therewith |
| WO2011086620A1 (ja) * | 2010-01-18 | 2011-07-21 | パナソニック株式会社 | 窒化物系半導体素子およびその製造方法 |
| JP5759690B2 (ja) * | 2010-08-30 | 2015-08-05 | 株式会社日立国際電気 | 膜の形成方法、半導体装置の製造方法及び基板処理装置 |
| JP5707928B2 (ja) * | 2010-12-21 | 2015-04-30 | セイコーエプソン株式会社 | 照明装置、その製造方法、及び電子機器 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3740622A (en) * | 1972-07-10 | 1973-06-19 | Rca Corp | Electroluminescent semiconductor device for generating ultra violet radiation |
| JPS5815480B2 (ja) * | 1975-08-19 | 1983-03-25 | 松下電器産業株式会社 | チツカガリウムタンケツシヨウノ セイチヨウホウホウ |
| SU773795A1 (ru) * | 1977-04-01 | 1980-10-23 | Предприятие П/Я А-1172 | Светоизлучающий прибор |
| JPS553834A (en) * | 1978-06-23 | 1980-01-11 | Yasuko Shiomi | Hand shower with water-stop valve |
| JPS54119400A (en) * | 1978-07-11 | 1979-09-17 | Sumitomo Electric Ind Ltd | Production of nitrogen compound of 3b group element |
| US4396929A (en) * | 1979-10-19 | 1983-08-02 | Matsushita Electric Industrial Company, Ltd. | Gallium nitride light-emitting element and method of manufacturing the same |
| JPS6055996B2 (ja) * | 1979-12-05 | 1985-12-07 | 松下電器産業株式会社 | 電場発光半導体装置 |
| JPS5710280A (en) * | 1980-06-23 | 1982-01-19 | Futaba Corp | Gan light emitting element |
| JPS5948794B2 (ja) * | 1982-09-27 | 1984-11-28 | 工業技術院長 | 窒化ガリウム単結晶膜の製造法 |
| JPS6026079A (ja) * | 1983-07-23 | 1985-02-08 | Nitto Electric Ind Co Ltd | 感圧接着剤の改質方法 |
| JPS6118184A (ja) * | 1984-07-04 | 1986-01-27 | Agency Of Ind Science & Technol | 発光素子 |
| US4614961A (en) * | 1984-10-09 | 1986-09-30 | Honeywell Inc. | Tunable cut-off UV detector based on the aluminum gallium nitride material system |
| JPS61179527A (ja) * | 1985-02-04 | 1986-08-12 | Nippon Telegr & Teleph Corp <Ntt> | 化合物半導体単結晶膜の成長方法および装置 |
| US4616248A (en) * | 1985-05-20 | 1986-10-07 | Honeywell Inc. | UV photocathode using negative electron affinity effect in Alx Ga1 N |
| JPS6230696A (ja) * | 1985-07-31 | 1987-02-09 | Sharp Corp | 広禁制帯幅半導体結晶の製造方法 |
| JPS62119196A (ja) * | 1985-11-18 | 1987-05-30 | Univ Nagoya | 化合物半導体の成長方法 |
| JPS62119940A (ja) * | 1985-11-19 | 1987-06-01 | Sharp Corp | 半導体基板 |
| US4740606A (en) * | 1986-07-01 | 1988-04-26 | Morton Thiokol, Inc. | Gallium hydride/trialkylamine adducts, and their use in deposition of III-V compound films |
| JPS63188938A (ja) * | 1987-01-31 | 1988-08-04 | Toyoda Gosei Co Ltd | 窒化ガリウム系化合物半導体の気相成長方法 |
| EP0277597B1 (de) * | 1987-01-31 | 1994-07-13 | Toyoda Gosei Co., Ltd. | Gallium-Nitrid Halbleiter-Lumisneszenzdiode sowie Verfahren zu deren Herstellung |
| JPH0614564B2 (ja) * | 1987-07-13 | 1994-02-23 | 日本電信電話株式会社 | 半導体発光素子 |
-
1989
- 1989-02-13 JP JP1033279A patent/JP2704181B2/ja not_active Expired - Lifetime
-
1990
- 1990-02-10 DE DE69009216T patent/DE69009216T2/de not_active Expired - Lifetime
- 1990-02-10 EP EP90102634A patent/EP0383215B1/de not_active Expired - Lifetime
- 1990-02-12 US US07/479,068 patent/US5006908A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2704181B2 (ja) | 1998-01-26 |
| JPH02211620A (ja) | 1990-08-22 |
| EP0383215A2 (de) | 1990-08-22 |
| US5006908A (en) | 1991-04-09 |
| EP0383215A3 (de) | 1991-01-09 |
| DE69009216T2 (de) | 1995-03-02 |
| EP0383215B1 (de) | 1994-06-01 |
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| 8332 | No legal effect for de | ||
| 8370 | Indication of lapse of patent is to be deleted | ||
| 8364 | No opposition during term of opposition |