DE68918975T2 - Verfahren für die Herstellung von Leiterplatten. - Google Patents
Verfahren für die Herstellung von Leiterplatten.Info
- Publication number
- DE68918975T2 DE68918975T2 DE68918975T DE68918975T DE68918975T2 DE 68918975 T2 DE68918975 T2 DE 68918975T2 DE 68918975 T DE68918975 T DE 68918975T DE 68918975 T DE68918975 T DE 68918975T DE 68918975 T2 DE68918975 T2 DE 68918975T2
- Authority
- DE
- Germany
- Prior art keywords
- production
- printed circuit
- circuit boards
- boards
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0591—Organic non-polymeric coating, e.g. for inhibiting corrosion thereby preserving solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
- H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63089083A JPH0783168B2 (ja) | 1988-04-13 | 1988-04-13 | プリント板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68918975D1 DE68918975D1 (de) | 1994-12-01 |
DE68918975T2 true DE68918975T2 (de) | 1995-03-02 |
Family
ID=13960971
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68918975T Expired - Fee Related DE68918975T2 (de) | 1988-04-13 | 1989-04-13 | Verfahren für die Herstellung von Leiterplatten. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5028513A (de) |
EP (1) | EP0337465B1 (de) |
JP (1) | JPH0783168B2 (de) |
KR (1) | KR970004999B1 (de) |
DE (1) | DE68918975T2 (de) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2920854B2 (ja) * | 1991-08-01 | 1999-07-19 | 富士通株式会社 | ビィアホール構造及びその形成方法 |
US5294291A (en) * | 1991-09-20 | 1994-03-15 | Hitachi, Ltd. | Process for the formation of a conductive circuit pattern |
US5352383A (en) * | 1991-10-18 | 1994-10-04 | Centrax International Corp. | Corrosion inhibitor and sealable thread protector end cap for tubular goods |
US5358825A (en) * | 1993-03-24 | 1994-10-25 | Amp-Akzo Corporation | Manufacture of printed circuit conductors by a partially additive process |
JPH07235755A (ja) * | 1994-02-25 | 1995-09-05 | Hitachi Ltd | プリント配線基板の製法 |
US5802714A (en) * | 1994-07-19 | 1998-09-08 | Hitachi, Ltd. | Method of finishing a printed wiring board with a soft etching solution and a preserving treatment or a solder-leveling treatment |
US5545440A (en) * | 1994-12-05 | 1996-08-13 | At&T Global Information Solutions Company (Aka Ncr Corporation) | Method and apparatus for polymer coating of substrates |
US5597469A (en) * | 1995-02-13 | 1997-01-28 | International Business Machines Corporation | Process for selective application of solder to circuit packages |
WO1996029849A1 (fr) * | 1995-03-20 | 1996-09-26 | Hitachi, Ltd. | Procede et dispositif de fabrication d'une plaquette a circuits imprimes |
JP2725665B2 (ja) * | 1996-01-29 | 1998-03-11 | 日本電気株式会社 | プリント配線板製造方法 |
WO1997039610A1 (en) * | 1996-04-18 | 1997-10-23 | International Business Machines Corporation | Organic-metallic composite coating for copper surface protection |
US5993945A (en) * | 1996-05-30 | 1999-11-30 | International Business Machines Corporation | Process for high resolution photoimageable dielectric |
US6322904B1 (en) | 1996-06-17 | 2001-11-27 | Mitsui Mining & Smelting Co., Ltd. | Copper foil for printed circuit boards |
US6022670A (en) * | 1997-05-08 | 2000-02-08 | International Business Machines Corporation | Process for high resolution photoimageable dielectric |
US6331490B1 (en) * | 1998-03-13 | 2001-12-18 | Semitool, Inc. | Process for etching thin-film layers of a workpiece used to form microelectric circuits or components |
US6632292B1 (en) | 1998-03-13 | 2003-10-14 | Semitool, Inc. | Selective treatment of microelectronic workpiece surfaces |
TW436990B (en) * | 1998-11-24 | 2001-05-28 | Motorola Inc | Process for forming a semiconductor device |
US6540524B1 (en) * | 2000-02-14 | 2003-04-01 | Advantest Corp. | Contact structure and production method thereof |
US6297164B1 (en) * | 1998-11-30 | 2001-10-02 | Advantest Corp. | Method for producing contact structures |
US6156642A (en) * | 1999-03-23 | 2000-12-05 | United Microelectronics Corp. | Method of fabricating a dual damascene structure in an integrated circuit |
US6815126B2 (en) | 2002-04-09 | 2004-11-09 | International Business Machines Corporation | Printed wiring board with conformally plated circuit traces |
US6822332B2 (en) * | 2002-09-23 | 2004-11-23 | International Business Machines Corporation | Fine line circuitization |
US7060364B2 (en) * | 2002-12-26 | 2006-06-13 | Mitsui Mining & Smelting Co., Ltd. | Film carrier tape for mounting electronic devices thereon |
US20050067378A1 (en) * | 2003-09-30 | 2005-03-31 | Harry Fuerhaupter | Method for micro-roughening treatment of copper and mixed-metal circuitry |
WO2005092043A2 (en) * | 2004-03-22 | 2005-10-06 | Epic Research Company, Inc. | Process for fabrication of printed circuit boards |
TW200541434A (en) * | 2004-04-30 | 2005-12-16 | Hitachi Via Mechanics Ltd | Printed circuit board and method for processing printed circuit board and method for manufacturing printed circuit board |
JP4298597B2 (ja) | 2004-07-01 | 2009-07-22 | 日東電工株式会社 | 配線回路基板および配線回路基板の製造方法 |
US7160583B2 (en) * | 2004-12-03 | 2007-01-09 | 3M Innovative Properties Company | Microfabrication using patterned topography and self-assembled monolayers |
DE102005041533B3 (de) * | 2005-08-31 | 2007-02-08 | Atotech Deutschland Gmbh | Lösung und Verfahren zum Entfernen von ionischen Verunreinigungen von einem Werkstück |
KR100797699B1 (ko) * | 2006-04-28 | 2008-01-23 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
KR100797692B1 (ko) * | 2006-06-20 | 2008-01-23 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
JP4933296B2 (ja) * | 2007-02-15 | 2012-05-16 | ダイヤテックス株式会社 | 導電性接着剤組成物、導電性接着シート及び導電性接着テープ |
JP2009260216A (ja) * | 2008-03-19 | 2009-11-05 | Shinko Electric Ind Co Ltd | 配線基板の製造方法 |
JP2016035992A (ja) * | 2014-08-04 | 2016-03-17 | 住友電工プリントサーキット株式会社 | プリント配線板の製造方法及びプリント配線板 |
US9401336B2 (en) | 2014-11-04 | 2016-07-26 | International Business Machines Corporation | Dual layer stack for contact formation |
KR102124324B1 (ko) * | 2018-11-14 | 2020-06-18 | 와이엠티 주식회사 | 도금 적층체 및 인쇄회로기판 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3622334A (en) * | 1969-12-31 | 1971-11-23 | Du Pont | Photopolymerizable compositions and elements containing heterocyclic nitrogen-containing compounds |
US3854973A (en) * | 1970-01-26 | 1974-12-17 | Macdermid Inc | Method of making additive printed circuit boards |
US3873316A (en) * | 1970-06-11 | 1975-03-25 | Kalle Ag | Process for the production of a light-sensitive copying material having a copper-containing support, and copying material so produced |
JPS509177A (de) * | 1973-05-29 | 1975-01-30 | ||
US4358479A (en) * | 1980-12-01 | 1982-11-09 | International Business Machines Corporation | Treatment of copper and use thereof |
KR920003400B1 (ko) * | 1983-12-29 | 1992-04-30 | 가부시기가이샤 히다찌세이사꾸쇼 | 금속과 수지와의 복합체 및 그 제조방법 |
JPS61176192A (ja) * | 1985-01-31 | 1986-08-07 | 株式会社日立製作所 | 銅と樹脂との接着方法 |
-
1988
- 1988-04-13 JP JP63089083A patent/JPH0783168B2/ja not_active Expired - Lifetime
-
1989
- 1989-04-13 KR KR1019890004915A patent/KR970004999B1/ko not_active IP Right Cessation
- 1989-04-13 US US07/336,771 patent/US5028513A/en not_active Expired - Lifetime
- 1989-04-13 EP EP89106641A patent/EP0337465B1/de not_active Expired - Lifetime
- 1989-04-13 DE DE68918975T patent/DE68918975T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0783168B2 (ja) | 1995-09-06 |
EP0337465B1 (de) | 1994-10-26 |
DE68918975D1 (de) | 1994-12-01 |
EP0337465A3 (de) | 1991-07-31 |
JPH01261888A (ja) | 1989-10-18 |
KR970004999B1 (ko) | 1997-04-10 |
US5028513A (en) | 1991-07-02 |
EP0337465A2 (de) | 1989-10-18 |
KR890016886A (ko) | 1989-11-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |