DE68918975D1 - Verfahren für die Herstellung von Leiterplatten. - Google Patents

Verfahren für die Herstellung von Leiterplatten.

Info

Publication number
DE68918975D1
DE68918975D1 DE68918975T DE68918975T DE68918975D1 DE 68918975 D1 DE68918975 D1 DE 68918975D1 DE 68918975 T DE68918975 T DE 68918975T DE 68918975 T DE68918975 T DE 68918975T DE 68918975 D1 DE68918975 D1 DE 68918975D1
Authority
DE
Germany
Prior art keywords
production
printed circuit
circuit boards
boards
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68918975T
Other languages
English (en)
Other versions
DE68918975T2 (de
Inventor
Kanji Murakami
Mineo Kawamoto
Akio Tadokoro
Haruo Akahoshi
Toshikazu Narahara
Ritsuji Toba
Toshiaki Ishimaru
Nobuyuki Hayashi
Motoyo Wajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Publication of DE68918975D1 publication Critical patent/DE68918975D1/de
Application granted granted Critical
Publication of DE68918975T2 publication Critical patent/DE68918975T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0591—Organic non-polymeric coating, e.g. for inhibiting corrosion thereby preserving solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
DE68918975T 1988-04-13 1989-04-13 Verfahren für die Herstellung von Leiterplatten. Expired - Fee Related DE68918975T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63089083A JPH0783168B2 (ja) 1988-04-13 1988-04-13 プリント板の製造方法

Publications (2)

Publication Number Publication Date
DE68918975D1 true DE68918975D1 (de) 1994-12-01
DE68918975T2 DE68918975T2 (de) 1995-03-02

Family

ID=13960971

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68918975T Expired - Fee Related DE68918975T2 (de) 1988-04-13 1989-04-13 Verfahren für die Herstellung von Leiterplatten.

Country Status (5)

Country Link
US (1) US5028513A (de)
EP (1) EP0337465B1 (de)
JP (1) JPH0783168B2 (de)
KR (1) KR970004999B1 (de)
DE (1) DE68918975T2 (de)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2920854B2 (ja) * 1991-08-01 1999-07-19 富士通株式会社 ビィアホール構造及びその形成方法
DE4231535C2 (de) * 1991-09-20 1997-12-11 Hitachi Ltd Verfahren zur Erzeugung eines leitenden Schaltungsmusters
US5352383A (en) * 1991-10-18 1994-10-04 Centrax International Corp. Corrosion inhibitor and sealable thread protector end cap for tubular goods
US5358825A (en) * 1993-03-24 1994-10-25 Amp-Akzo Corporation Manufacture of printed circuit conductors by a partially additive process
JPH07235755A (ja) * 1994-02-25 1995-09-05 Hitachi Ltd プリント配線基板の製法
US5802714A (en) * 1994-07-19 1998-09-08 Hitachi, Ltd. Method of finishing a printed wiring board with a soft etching solution and a preserving treatment or a solder-leveling treatment
US5545440A (en) * 1994-12-05 1996-08-13 At&T Global Information Solutions Company (Aka Ncr Corporation) Method and apparatus for polymer coating of substrates
US5597469A (en) * 1995-02-13 1997-01-28 International Business Machines Corporation Process for selective application of solder to circuit packages
WO1996029849A1 (fr) * 1995-03-20 1996-09-26 Hitachi, Ltd. Procede et dispositif de fabrication d'une plaquette a circuits imprimes
JP2725665B2 (ja) * 1996-01-29 1998-03-11 日本電気株式会社 プリント配線板製造方法
AU5561696A (en) * 1996-04-18 1997-11-07 International Business Machines Corporation Organic-metallic composite coating for copper surface protection
US5993945A (en) * 1996-05-30 1999-11-30 International Business Machines Corporation Process for high resolution photoimageable dielectric
US6322904B1 (en) 1996-06-17 2001-11-27 Mitsui Mining & Smelting Co., Ltd. Copper foil for printed circuit boards
US6022670A (en) * 1997-05-08 2000-02-08 International Business Machines Corporation Process for high resolution photoimageable dielectric
US6632292B1 (en) 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
US6331490B1 (en) * 1998-03-13 2001-12-18 Semitool, Inc. Process for etching thin-film layers of a workpiece used to form microelectric circuits or components
TW436990B (en) * 1998-11-24 2001-05-28 Motorola Inc Process for forming a semiconductor device
US6540524B1 (en) * 2000-02-14 2003-04-01 Advantest Corp. Contact structure and production method thereof
US6297164B1 (en) * 1998-11-30 2001-10-02 Advantest Corp. Method for producing contact structures
US6156642A (en) * 1999-03-23 2000-12-05 United Microelectronics Corp. Method of fabricating a dual damascene structure in an integrated circuit
US6815126B2 (en) * 2002-04-09 2004-11-09 International Business Machines Corporation Printed wiring board with conformally plated circuit traces
US6822332B2 (en) * 2002-09-23 2004-11-23 International Business Machines Corporation Fine line circuitization
US7060364B2 (en) * 2002-12-26 2006-06-13 Mitsui Mining & Smelting Co., Ltd. Film carrier tape for mounting electronic devices thereon
US20050067378A1 (en) * 2003-09-30 2005-03-31 Harry Fuerhaupter Method for micro-roughening treatment of copper and mixed-metal circuitry
US20050227049A1 (en) * 2004-03-22 2005-10-13 Boyack James R Process for fabrication of printed circuit boards
TW200541434A (en) * 2004-04-30 2005-12-16 Hitachi Via Mechanics Ltd Printed circuit board and method for processing printed circuit board and method for manufacturing printed circuit board
JP4298597B2 (ja) 2004-07-01 2009-07-22 日東電工株式会社 配線回路基板および配線回路基板の製造方法
US7160583B2 (en) * 2004-12-03 2007-01-09 3M Innovative Properties Company Microfabrication using patterned topography and self-assembled monolayers
DE102005041533B3 (de) * 2005-08-31 2007-02-08 Atotech Deutschland Gmbh Lösung und Verfahren zum Entfernen von ionischen Verunreinigungen von einem Werkstück
KR100797699B1 (ko) * 2006-04-28 2008-01-23 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR100797692B1 (ko) * 2006-06-20 2008-01-23 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP4933296B2 (ja) * 2007-02-15 2012-05-16 ダイヤテックス株式会社 導電性接着剤組成物、導電性接着シート及び導電性接着テープ
JP2009260216A (ja) * 2008-03-19 2009-11-05 Shinko Electric Ind Co Ltd 配線基板の製造方法
JP2016035992A (ja) * 2014-08-04 2016-03-17 住友電工プリントサーキット株式会社 プリント配線板の製造方法及びプリント配線板
US9401336B2 (en) 2014-11-04 2016-07-26 International Business Machines Corporation Dual layer stack for contact formation
KR102124324B1 (ko) * 2018-11-14 2020-06-18 와이엠티 주식회사 도금 적층체 및 인쇄회로기판

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3622334A (en) * 1969-12-31 1971-11-23 Du Pont Photopolymerizable compositions and elements containing heterocyclic nitrogen-containing compounds
US3854973A (en) * 1970-01-26 1974-12-17 Macdermid Inc Method of making additive printed circuit boards
US3873316A (en) * 1970-06-11 1975-03-25 Kalle Ag Process for the production of a light-sensitive copying material having a copper-containing support, and copying material so produced
JPS509177A (de) * 1973-05-29 1975-01-30
US4358479A (en) * 1980-12-01 1982-11-09 International Business Machines Corporation Treatment of copper and use thereof
DE3447669A1 (de) * 1983-12-29 1985-07-18 Hitachi, Ltd., Tokio/Tokyo Verbundstruktur aus metall und kunstharz sowie verfahren zu deren herstellung
JPS61176192A (ja) * 1985-01-31 1986-08-07 株式会社日立製作所 銅と樹脂との接着方法

Also Published As

Publication number Publication date
EP0337465A3 (de) 1991-07-31
EP0337465A2 (de) 1989-10-18
KR890016886A (ko) 1989-11-30
JPH0783168B2 (ja) 1995-09-06
US5028513A (en) 1991-07-02
JPH01261888A (ja) 1989-10-18
EP0337465B1 (de) 1994-10-26
KR970004999B1 (ko) 1997-04-10
DE68918975T2 (de) 1995-03-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee