DE68917231T2 - Sondenkarte, Verfahren zur Messung eines zu messenden Teiles mit derselben und elektrischer Schaltungsteil. - Google Patents

Sondenkarte, Verfahren zur Messung eines zu messenden Teiles mit derselben und elektrischer Schaltungsteil.

Info

Publication number
DE68917231T2
DE68917231T2 DE68917231T DE68917231T DE68917231T2 DE 68917231 T2 DE68917231 T2 DE 68917231T2 DE 68917231 T DE68917231 T DE 68917231T DE 68917231 T DE68917231 T DE 68917231T DE 68917231 T2 DE68917231 T2 DE 68917231T2
Authority
DE
Germany
Prior art keywords
measuring
measured
same
electrical circuit
probe card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68917231T
Other languages
English (en)
Other versions
DE68917231D1 (de
Inventor
Tetsuo Yoshizawa
Masaaki Imaizumi
Hideyuki Nishida
Hiroshi Kondo
Takashi Sakaki
Yasuteru Ichida
Masaki Konishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63119243A external-priority patent/JPH01291168A/ja
Priority claimed from JP63119242A external-priority patent/JPH01291167A/ja
Priority claimed from JP13339988A external-priority patent/JPH01302171A/ja
Priority claimed from JP63133402A external-priority patent/JPH01302833A/ja
Priority claimed from JP63133403A external-priority patent/JPH01302834A/ja
Priority claimed from JP13340088A external-priority patent/JPH01302172A/ja
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE68917231D1 publication Critical patent/DE68917231D1/de
Application granted granted Critical
Publication of DE68917231T2 publication Critical patent/DE68917231T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
DE68917231T 1988-05-18 1989-05-17 Sondenkarte, Verfahren zur Messung eines zu messenden Teiles mit derselben und elektrischer Schaltungsteil. Expired - Fee Related DE68917231T2 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP63119243A JPH01291168A (ja) 1988-05-18 1988-05-18 プローブカードおよびそれを用いた被測定部品の測定法
JP63119242A JPH01291167A (ja) 1988-05-18 1988-05-18 プローブカードおよびそれを用いた被測定部品の測定法
JP13339988A JPH01302171A (ja) 1988-05-31 1988-05-31 プローブカード及びそれを用いた被測定部品の測定法
JP63133402A JPH01302833A (ja) 1988-05-31 1988-05-31 電気回路部材
JP63133403A JPH01302834A (ja) 1988-05-31 1988-05-31 電気的接続部材の製造方法及び電気回路部材
JP13340088A JPH01302172A (ja) 1988-05-31 1988-05-31 プローブカード及びそれを用いた被測定部品の測定法

Publications (2)

Publication Number Publication Date
DE68917231D1 DE68917231D1 (de) 1994-09-08
DE68917231T2 true DE68917231T2 (de) 1994-12-15

Family

ID=27552550

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68917231T Expired - Fee Related DE68917231T2 (de) 1988-05-18 1989-05-17 Sondenkarte, Verfahren zur Messung eines zu messenden Teiles mit derselben und elektrischer Schaltungsteil.

Country Status (3)

Country Link
US (1) US5606263A (de)
EP (1) EP0355273B1 (de)
DE (1) DE68917231T2 (de)

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DE4007221A1 (de) * 1990-03-07 1991-09-12 Gao Ges Automation Org Pruefkopf fuer kontaktflaechen von wertkarten mit eingelagertem halbleiterchip
JP3253069B2 (ja) * 1990-07-25 2002-02-04 キヤノン株式会社 電気的接続部材を用いた被測定部品の検査方法
US5311119A (en) * 1990-09-12 1994-05-10 Hewlett-Packard Company Probe contact through small amplitude vibration for bed of nails testing
DE69233684D1 (de) 1991-02-22 2007-04-12 Canon Kk Elektrischer Verbindungskörper und Herstellungsverfahren dafür
US6741085B1 (en) 1993-11-16 2004-05-25 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
JP2796070B2 (ja) * 1995-04-28 1998-09-10 松下電器産業株式会社 プローブカードの製造方法
AU6635296A (en) * 1995-05-26 1996-12-18 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates wi th spring contacts
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
JP3604233B2 (ja) * 1996-05-24 2004-12-22 株式会社日本マイクロニクス 検査用ヘッド
US6060891A (en) * 1997-02-11 2000-05-09 Micron Technology, Inc. Probe card for semiconductor wafers and method and system for testing wafers
US6798224B1 (en) * 1997-02-11 2004-09-28 Micron Technology, Inc. Method for testing semiconductor wafers
US5894161A (en) 1997-02-24 1999-04-13 Micron Technology, Inc. Interconnect with pressure sensing mechanism for testing semiconductor wafers
JPH10319044A (ja) * 1997-05-15 1998-12-04 Mitsubishi Electric Corp プローブカード
US6550116B2 (en) * 1997-07-11 2003-04-22 Matsushita Electric Industrial Co., Ltd. Method for manufacturing a bimorph piezoelectric device for acceleration sensor
US6246245B1 (en) 1998-02-23 2001-06-12 Micron Technology, Inc. Probe card, test method and test system for semiconductor wafers
US6130546A (en) * 1998-05-11 2000-10-10 Lsi Logic Corporation Area array (flip chip) probe card
JP2000258495A (ja) * 1999-03-12 2000-09-22 Oki Electric Ind Co Ltd 半導体デバイス試験装置
JP2002139540A (ja) * 2000-10-30 2002-05-17 Nec Corp プローブ構造体とその製造方法
US6683466B2 (en) * 2002-05-17 2004-01-27 International Business Machines Corporation Piston for module test
US7321234B2 (en) * 2003-12-18 2008-01-22 Lecroy Corporation Resistive test probe tips and applications therefor
EP1695100A4 (de) * 2003-12-18 2009-12-30 Lecroy Corp Widerstands-sondenspitzen
JP4723195B2 (ja) * 2004-03-05 2011-07-13 株式会社オクテック プローブの製造方法
US7218128B2 (en) * 2005-02-14 2007-05-15 International Business Machines Corporation Method and apparatus for locating and testing a chip
KR100920228B1 (ko) * 2007-11-21 2009-10-05 삼성전기주식회사 열가소성 수지를 이용한 프로브 카드
JP4677493B2 (ja) * 2008-01-22 2011-04-27 キヤノン株式会社 圧電振動型力センサ
JP2010123910A (ja) * 2008-10-21 2010-06-03 Renesas Electronics Corp Ｔｃｐ型半導体装置及びそのテスト方法
JP5553504B2 (ja) 2008-12-26 2014-07-16 キヤノン株式会社 半導体装置の製造方法及び半導体装置
US9529014B1 (en) * 2013-03-15 2016-12-27 Insight Photonic Solutions, Inc. System and method for acquiring electrical measurements of an electronic device

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US3786559A (en) * 1972-05-22 1974-01-22 Hewlett Packard Co Cold diffusion welds in a microcircuit package assembly
DE2344239B2 (de) * 1973-09-01 1977-11-03 Luther, Erich, 3050 Wunstorf; Maelzer, Fritz; Maelzer, Martin; 7910 Reutti Post Neu-Ulm; Türkkan, Tamer, 3011 Laatzen Kontaktvorrichtung zum anschliessen einer gedruckten schaltung an ein pruefgeraet
US4038599A (en) * 1974-12-30 1977-07-26 International Business Machines Corporation High density wafer contacting and test system
US4242719A (en) * 1979-06-01 1980-12-30 Interconnection Technology, Inc. Solder-weld P.C. board apparatus
US4402561A (en) * 1981-03-27 1983-09-06 Amp Incorporated Socket for integrated circuit package with extended leads
US4465972A (en) * 1982-04-05 1984-08-14 Allied Corporation Connection arrangement for printed circuit board testing apparatus
US4404059A (en) * 1982-05-26 1983-09-13 Livshits Vladimir I Process for manufacturing panels to be used in microelectronic systems
US4585991A (en) * 1982-06-03 1986-04-29 Texas Instruments Incorporated Solid state multiprobe testing apparatus
US4766371A (en) * 1982-07-24 1988-08-23 Risho Kogyo Co., Ltd. Test board for semiconductor packages
US4504783A (en) * 1982-09-30 1985-03-12 Storage Technology Partners Test fixture for providing electrical access to each I/O pin of a VLSI chip having a large number of I/O pins
US4649339A (en) * 1984-04-25 1987-03-10 Honeywell Inc. Integrated circuit interface
DK291184D0 (da) * 1984-06-13 1984-06-13 Boeegh Petersen Allan Fremgangsmaade og indretning til test af kredsloebsplader
US4565640A (en) * 1984-12-24 1986-01-21 Merck & Co., Inc. Aqueous compositions containing cyanuric acid
US4757256A (en) * 1985-05-10 1988-07-12 Micro-Probe, Inc. High density probe card
US5014161A (en) * 1985-07-22 1991-05-07 Digital Equipment Corporation System for detachably mounting semiconductors on conductor substrate
US4643499A (en) * 1985-09-04 1987-02-17 At&T Bell Laboratories Component mounting apparatus
GB2189657B (en) * 1986-04-25 1990-02-14 Plessey Co Plc Improvements in or relating to electrical contactors
EP0256368B1 (de) * 1986-08-07 1992-09-30 Siemens Aktiengesellschaft Prüfeinrichtung für beidseitige, zweistufige Kontaktierung bestückter Leiterplatten
US4891585A (en) * 1986-09-05 1990-01-02 Tektronix, Inc. Multiple lead probe for integrated circuits in wafer form
US4820976A (en) * 1987-11-24 1989-04-11 Advanced Micro Devices, Inc. Test fixture capable of electrically testing an integrated circuit die having a planar array of contacts
US4862075A (en) * 1988-09-01 1989-08-29 Photon Dynamics, Inc. High frequency test head using electro-optics
US4922192A (en) * 1988-09-06 1990-05-01 Unisys Corporation Elastic membrane probe
US4992850A (en) * 1989-02-15 1991-02-12 Micron Technology, Inc. Directly bonded simm module

Also Published As

Publication number Publication date
US5606263A (en) 1997-02-25
EP0355273B1 (de) 1994-08-03
DE68917231D1 (de) 1994-09-08
EP0355273A1 (de) 1990-02-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee