DE68916068T2 - Hochleistungsleiterplatten. - Google Patents
Hochleistungsleiterplatten.Info
- Publication number
- DE68916068T2 DE68916068T2 DE68916068T DE68916068T DE68916068T2 DE 68916068 T2 DE68916068 T2 DE 68916068T2 DE 68916068 T DE68916068 T DE 68916068T DE 68916068 T DE68916068 T DE 68916068T DE 68916068 T2 DE68916068 T2 DE 68916068T2
- Authority
- DE
- Germany
- Prior art keywords
- high performance
- circuit boards
- performance circuit
- boards
- performance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/165,011 US4868350A (en) | 1988-03-07 | 1988-03-07 | High performance circuit boards |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68916068D1 DE68916068D1 (de) | 1994-07-21 |
DE68916068T2 true DE68916068T2 (de) | 1995-01-05 |
Family
ID=22597031
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68916068T Expired - Fee Related DE68916068T2 (de) | 1988-03-07 | 1989-02-03 | Hochleistungsleiterplatten. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4868350A (de) |
EP (1) | EP0331909B1 (de) |
JP (1) | JPH01239996A (de) |
DE (1) | DE68916068T2 (de) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5010641A (en) * | 1989-06-30 | 1991-04-30 | Unisys Corp. | Method of making multilayer printed circuit board |
US5948533A (en) * | 1990-02-09 | 1999-09-07 | Ormet Corporation | Vertically interconnected electronic assemblies and compositions useful therefor |
US5046238A (en) * | 1990-03-15 | 1991-09-10 | Rogers Corporation | Method of manufacturing a multilayer circuit board |
US5129142A (en) * | 1990-10-30 | 1992-07-14 | International Business Machines Corporation | Encapsulated circuitized power core alignment and lamination |
US5142775A (en) * | 1990-10-30 | 1992-09-01 | International Business Machines Corporation | Bondable via |
JP2874329B2 (ja) * | 1990-11-05 | 1999-03-24 | 日本電気株式会社 | 多層印刷配線板の製造方法 |
US5224265A (en) * | 1991-10-29 | 1993-07-06 | International Business Machines Corporation | Fabrication of discrete thin film wiring structures |
US5440805A (en) * | 1992-03-09 | 1995-08-15 | Rogers Corporation | Method of manufacturing a multilayer circuit |
US5274912A (en) * | 1992-09-01 | 1994-01-04 | Rogers Corporation | Method of manufacturing a multilayer circuit board |
US5329695A (en) * | 1992-09-01 | 1994-07-19 | Rogers Corporation | Method of manufacturing a multilayer circuit board |
US5309629A (en) * | 1992-09-01 | 1994-05-10 | Rogers Corporation | Method of manufacturing a multilayer circuit board |
US5316803A (en) * | 1992-12-10 | 1994-05-31 | International Business Machines Corporation | Method for forming electrical interconnections in laminated vias |
JPH06268381A (ja) * | 1993-03-11 | 1994-09-22 | Hitachi Ltd | 多層配線構造体及びその製造方法 |
US5401913A (en) * | 1993-06-08 | 1995-03-28 | Minnesota Mining And Manufacturing Company | Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board |
US5981880A (en) * | 1996-08-20 | 1999-11-09 | International Business Machines Corporation | Electronic device packages having glass free non conductive layers |
US5774340A (en) * | 1996-08-28 | 1998-06-30 | International Business Machines Corporation | Planar redistribution structure and printed wiring device |
US5847327A (en) | 1996-11-08 | 1998-12-08 | W.L. Gore & Associates, Inc. | Dimensionally stable core for use in high density chip packages |
US6720501B1 (en) * | 1998-04-14 | 2004-04-13 | Formfactor, Inc. | PC board having clustered blind vias |
US6085415A (en) * | 1998-07-27 | 2000-07-11 | Ormet Corporation | Methods to produce insulated conductive through-features in core materials for electric packaging |
US6372999B1 (en) * | 1999-04-20 | 2002-04-16 | Trw Inc. | Multilayer wiring board and multilayer wiring package |
US6399898B1 (en) * | 1999-11-18 | 2002-06-04 | Nortel Networks Limited | Technique for coupling signals between circuit boards |
US6834426B1 (en) * | 2000-07-25 | 2004-12-28 | International Business Machines Corporation | Method of fabricating a laminate circuit structure |
US6495053B1 (en) * | 2000-08-30 | 2002-12-17 | Visteon Global Tech, Inc. | Electrical circuit board and a method for making the same |
US7435912B1 (en) * | 2002-05-14 | 2008-10-14 | Teradata Us, Inc. | Tailoring via impedance on a circuit board |
US6872589B2 (en) * | 2003-02-06 | 2005-03-29 | Kulicke & Soffa Investments, Inc. | High density chip level package for the packaging of integrated circuits and method to manufacture same |
TW577250B (en) * | 2003-05-29 | 2004-02-21 | Via Tech Inc | Circuit board and process thereof |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL267988A (de) * | 1960-08-15 | 1900-01-01 | ||
US3739469A (en) * | 1971-12-27 | 1973-06-19 | Ibm | Multilayer printed circuit board and method of manufacture |
US3972755A (en) * | 1972-12-14 | 1976-08-03 | The United States Of America As Represented By The Secretary Of The Navy | Dielectric circuit board bonding |
US4030190A (en) * | 1976-03-30 | 1977-06-21 | International Business Machines Corporation | Method for forming a multilayer printed circuit board |
DE3243925A1 (de) * | 1982-11-26 | 1984-05-30 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung von laminaten mit niedriger dielektrizitaetskonstante |
JPS6078990A (ja) * | 1983-10-07 | 1985-05-04 | Hokko Chem Ind Co Ltd | テトラゾロ−1,2,4−ベンズチアジアジン誘導体および農園芸用殺菌剤 |
US4591659A (en) * | 1983-12-22 | 1986-05-27 | Trw Inc. | Multilayer printed circuit board structure |
US4585502A (en) * | 1984-04-27 | 1986-04-29 | Hitachi Condenser Co., Ltd. | Process for producing printed circuit board |
JPH0642515B2 (ja) * | 1984-12-26 | 1994-06-01 | 株式会社東芝 | 回路基板 |
US4680220A (en) * | 1985-02-26 | 1987-07-14 | W. L. Gore & Associates, Inc. | Dielectric materials |
US4747897A (en) * | 1985-02-26 | 1988-05-31 | W. L. Gore & Associates, Inc. | Dielectric materials |
ATE39598T1 (de) * | 1985-08-14 | 1989-01-15 | Toray Industries | Mehrschichtige leiterlatte mit gleichmaessig verteilten fuellmaterial-teilchen und verfahren zu ihrer herstellung. |
US4755783A (en) * | 1986-11-18 | 1988-07-05 | Rogers Corporation | Inductive devices for printed wiring boards |
US4755911A (en) * | 1987-04-28 | 1988-07-05 | Junkosha Co., Ltd. | Multilayer printed circuit board |
-
1988
- 1988-03-07 US US07/165,011 patent/US4868350A/en not_active Expired - Fee Related
-
1989
- 1989-01-20 JP JP1010103A patent/JPH01239996A/ja active Pending
- 1989-02-03 EP EP89101916A patent/EP0331909B1/de not_active Expired - Lifetime
- 1989-02-03 DE DE68916068T patent/DE68916068T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US4868350A (en) | 1989-09-19 |
DE68916068D1 (de) | 1994-07-21 |
EP0331909B1 (de) | 1994-06-15 |
EP0331909A1 (de) | 1989-09-13 |
JPH01239996A (ja) | 1989-09-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |