DE68906615T2 - Lift-off-Prozess für Metallanschlüsse. - Google Patents

Lift-off-Prozess für Metallanschlüsse.

Info

Publication number
DE68906615T2
DE68906615T2 DE89114044T DE68906615T DE68906615T2 DE 68906615 T2 DE68906615 T2 DE 68906615T2 DE 89114044 T DE89114044 T DE 89114044T DE 68906615 T DE68906615 T DE 68906615T DE 68906615 T2 DE68906615 T2 DE 68906615T2
Authority
DE
Germany
Prior art keywords
lift
metal connections
connections
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE89114044T
Other languages
English (en)
Other versions
DE68906615D1 (de
Inventor
Stuart E Greer
Robert T Howard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE68906615D1 publication Critical patent/DE68906615D1/de
Application granted granted Critical
Publication of DE68906615T2 publication Critical patent/DE68906615T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
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    • Y10S438/951—Lift-off
DE89114044T 1988-08-22 1989-07-29 Lift-off-Prozess für Metallanschlüsse. Expired - Fee Related DE68906615T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/234,728 US4861425A (en) 1988-08-22 1988-08-22 Lift-off process for terminal metals

Publications (2)

Publication Number Publication Date
DE68906615D1 DE68906615D1 (de) 1993-06-24
DE68906615T2 true DE68906615T2 (de) 1993-12-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE89114044T Expired - Fee Related DE68906615T2 (de) 1988-08-22 1989-07-29 Lift-off-Prozess für Metallanschlüsse.

Country Status (4)

Country Link
US (1) US4861425A (de)
EP (1) EP0355478B1 (de)
JP (1) JPH0795549B2 (de)
DE (1) DE68906615T2 (de)

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US5933752A (en) * 1996-11-28 1999-08-03 Sony Corporation Method and apparatus for forming solder bumps for a semiconductor device
US5904156A (en) * 1997-09-24 1999-05-18 International Business Machines Corporation Dry film resist removal in the presence of electroplated C4's
WO1999063588A1 (de) * 1998-06-02 1999-12-09 Siemens S.A. Verfahren zum umschmelzen von lotschichten
DE10156054C2 (de) * 2001-11-15 2003-11-13 Infineon Technologies Ag Herstellungsverfahren für eine Leiterbahn auf einem Substrat
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EP0355478B1 (de) 1993-05-19
JPH0795549B2 (ja) 1995-10-11
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JPH0282625A (ja) 1990-03-23
EP0355478A1 (de) 1990-02-28
US4861425A (en) 1989-08-29

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