DE68901573D1 - Loetmittelauftragegeraet. - Google Patents
Loetmittelauftragegeraet.Info
- Publication number
- DE68901573D1 DE68901573D1 DE8989104683T DE68901573T DE68901573D1 DE 68901573 D1 DE68901573 D1 DE 68901573D1 DE 8989104683 T DE8989104683 T DE 8989104683T DE 68901573 T DE68901573 T DE 68901573T DE 68901573 D1 DE68901573 D1 DE 68901573D1
- Authority
- DE
- Germany
- Prior art keywords
- application device
- solvent application
- solvent
- application
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/181,775 US4898117A (en) | 1988-04-15 | 1988-04-15 | Solder deposition system |
Publications (1)
Publication Number | Publication Date |
---|---|
DE68901573D1 true DE68901573D1 (de) | 1992-06-25 |
Family
ID=22665743
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8989104683T Expired - Lifetime DE68901573D1 (de) | 1988-04-15 | 1989-03-16 | Loetmittelauftragegeraet. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4898117A (de) |
EP (1) | EP0337149B1 (de) |
JP (1) | JPH0693543B2 (de) |
DE (1) | DE68901573D1 (de) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5148963A (en) * | 1990-09-24 | 1992-09-22 | International Business Machines Corporation | Method for solder nozzle height sensing |
US5065932A (en) * | 1990-09-24 | 1991-11-19 | International Business Machines Corporation | Solder placement nozzle with inert cover gas and inert gas bleed |
US5119759A (en) * | 1990-09-24 | 1992-06-09 | International Business Machines Corporation | Apparatus for solder nozzle height sensing |
US5104689A (en) * | 1990-09-24 | 1992-04-14 | International Business Machines Corporation | Method and apparatus for automated solder deposition at multiple sites |
JPH04361871A (ja) * | 1991-06-06 | 1992-12-15 | Pioneer Electron Corp | クリームハンダ塗布用ディスペンサー |
GB2259661A (en) * | 1991-09-18 | 1993-03-24 | Ibm | Depositing solder on printed circuit boards |
US6077725A (en) * | 1992-09-03 | 2000-06-20 | Lucent Technologies Inc | Method for assembling multichip modules |
DE29508865U1 (de) * | 1995-05-29 | 1995-08-03 | Siemens Ag | Kontrollvorrichtung für das Vorhandensein von Lotpaste bei deren Aufbringen auf reflowlötbare Leiterplatten |
US5746368A (en) * | 1996-05-15 | 1998-05-05 | Ford Motor Company | Molten solder dispensing system |
US6475282B1 (en) * | 1999-01-08 | 2002-11-05 | Fastar, Ltd. | Intelligent control system for extrusion head dispensement |
ATE487238T1 (de) * | 1999-09-29 | 2010-11-15 | Kaneka Corp | Verfahren und gerät zur automatischen lötung von einem anschlussdraht an einer sonnenzellenbatterie |
EP1100123A1 (de) | 1999-11-09 | 2001-05-16 | Corning Incorporated | Verfahren zur Herstellung von Flipchiplothöckern durch Tauchbeloten |
SG97164A1 (en) * | 2000-09-21 | 2003-07-18 | Micron Technology Inc | Individual selective rework of defective bga solder balls |
US6904673B1 (en) | 2002-09-24 | 2005-06-14 | International Business Machines Corporation | Control of flux by ink stop line in chip joining |
JP4735177B2 (ja) * | 2005-10-11 | 2011-07-27 | 三菱電機株式会社 | 溶融金属吐出装置及び溶融金属吐出方法並びにバンプ形成方法 |
JP4777759B2 (ja) * | 2005-12-01 | 2011-09-21 | 富士フイルム株式会社 | 配線基板及び配線基板接続装置 |
US7416104B2 (en) * | 2006-04-21 | 2008-08-26 | International Business Machines Corporation | Rotational fill techniques for injection molding of solder |
US7410092B2 (en) * | 2006-04-21 | 2008-08-12 | International Business Machines Corporation | Fill head for injection molding of solder |
US7980445B2 (en) * | 2008-01-23 | 2011-07-19 | International Business Machines Corporation | Fill head for full-field solder coverage with a rotatable member |
JP5518500B2 (ja) * | 2010-01-20 | 2014-06-11 | 昭和電工株式会社 | はんだ粉末付着装置および電子回路基板に対するはんだ粉末の付着方法 |
DE102010016814B3 (de) * | 2010-05-05 | 2011-10-06 | Schott Solar Ag | Verfahren und Vorrichtung zum Aufbringen von Lot auf ein Werkstück |
DE102011051024A1 (de) * | 2011-05-17 | 2012-11-22 | Schott Solar Ag | Verfahren zum stoffschlüssigen Verbinden von Elementen |
TWI552824B (zh) | 2011-10-18 | 2016-10-11 | 千住金屬工業股份有限公司 | 焊料凸塊形成方法及裝置 |
KR20130059760A (ko) * | 2011-11-29 | 2013-06-07 | 삼성전기주식회사 | 솔더범프 형성장치 및 이를 구비하는 솔더링 설비 |
CH706712A1 (de) * | 2012-07-05 | 2014-01-15 | Besi Switzerland Ag | Verfahren und Vorrichtung zum Auftragen von Lot auf ein Substrat. |
JP6726626B2 (ja) | 2014-06-09 | 2020-07-22 | ステパン カンパニー | 冷水洗浄用洗剤 |
US9573214B2 (en) | 2014-08-08 | 2017-02-21 | Merlin Solar Technologies, Inc. | Solder application method and apparatus |
BR112017014650B1 (pt) | 2015-01-08 | 2022-10-11 | Stepan Company | Detergente de vestuário útil para limpeza com água fria compreendendo um surfactante com ponte alquileno e uma lipase e método para lavar um artigo têxtil sujo em água |
WO2016114275A1 (ja) | 2015-01-13 | 2016-07-21 | 千住金属工業株式会社 | 流体吐出装置、流体吐出方法、及び流体塗布装置 |
CN108602088B (zh) | 2015-12-15 | 2022-10-14 | 千住金属工业株式会社 | 流体排出装置及流体排出方法 |
TWI698970B (zh) | 2015-12-15 | 2020-07-11 | 日商千住金屬工業股份有限公司 | 焊料凸塊之修正方法 |
EP3378571A1 (de) * | 2017-03-23 | 2018-09-26 | LM WP Patent Holding A/S | Spendervorrichtung zur applikation eines strukturklebstoffs und verfahren mit verwendung solch einer spendervorrichtung |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT557307A (de) * | 1955-02-23 | 1900-01-01 | ||
US3104986A (en) * | 1960-08-08 | 1963-09-24 | Robert L Goman | Fluid dispensing system |
US3589590A (en) * | 1968-12-11 | 1971-06-29 | State Street Bank & Trust Co | Soldering apparatus |
US3661638A (en) * | 1970-05-26 | 1972-05-09 | Photocircuits Corp | Process for uniformly coating printed circuit board through holes |
US3705457A (en) * | 1970-11-02 | 1972-12-12 | Electrovert Mfg Co Ltd | Wave soldering using inert gas to protect pretinned and soldered surfaces of relatively flat workpieces |
US3876857A (en) * | 1973-06-29 | 1975-04-08 | Raymond Lee Organization Inc | Soldering pen for microcircuit production |
US4121535A (en) * | 1977-03-16 | 1978-10-24 | Inta-Rota, Incorporated | Hot melt pumping apparatus |
US4206254A (en) * | 1979-02-28 | 1980-06-03 | International Business Machines Corporation | Method of selectively depositing metal on a ceramic substrate with a metallurgy pattern |
DE2937188A1 (de) * | 1979-09-14 | 1981-03-19 | Norddeutsche Affinerie, 2000 Hamburg | Plattierverfahren |
US4389771A (en) * | 1981-01-05 | 1983-06-28 | Western Electric Company, Incorporated | Treatment of a substrate surface to reduce solder sticking |
US4360144A (en) * | 1981-01-21 | 1982-11-23 | Basf Wyandotte Corporation | Printed circuit board soldering |
US4493856A (en) * | 1982-03-18 | 1985-01-15 | International Business Machines Corporation | Selective coating of metallurgical features of a dielectric substrate with diverse metals |
US4619841A (en) * | 1982-09-13 | 1986-10-28 | Schwerin Thomas E | Solder leveler |
DE3241124A1 (de) * | 1982-11-06 | 1984-05-10 | Koenig & Bauer AG, 8700 Würzburg | Farbabteilkeil in einem farbkasten einer rotationsdruckmaschine |
JPS59216997A (ja) * | 1983-05-25 | 1984-12-07 | 神崎製紙株式会社 | 塗被紙の製造方法 |
JPS60240142A (ja) * | 1984-05-14 | 1985-11-29 | Fujitsu Ltd | ハンダバンプ形成方法 |
EP0169948A1 (de) * | 1984-07-18 | 1986-02-05 | AT&T Corp. | Verfahren und Apparatur zum Aufbringen von viskosem Material auf eine Vielzahl von Punkten |
US4608941A (en) * | 1985-01-10 | 1986-09-02 | Teledyne Electro-Mechanisms | Apparatus for soldering printed circuit panels |
US4695481A (en) * | 1985-03-28 | 1987-09-22 | Senju Metal Industry Co., Ltd. | Method of performing plating of an item having fine parts and a support device therefor |
US4622239A (en) * | 1986-02-18 | 1986-11-11 | At&T Technologies, Inc. | Method and apparatus for dispensing viscous materials |
US4710399A (en) * | 1986-09-02 | 1987-12-01 | Dennis Richard K | Method and mechanism to deposit solder paste upon substrates |
-
1988
- 1988-04-15 US US07/181,775 patent/US4898117A/en not_active Expired - Lifetime
-
1989
- 1989-02-20 JP JP1038545A patent/JPH0693543B2/ja not_active Expired - Lifetime
- 1989-03-16 EP EP89104683A patent/EP0337149B1/de not_active Not-in-force
- 1989-03-16 DE DE8989104683T patent/DE68901573D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0215698A (ja) | 1990-01-19 |
JPH0693543B2 (ja) | 1994-11-16 |
US4898117A (en) | 1990-02-06 |
EP0337149B1 (de) | 1992-05-20 |
EP0337149A2 (de) | 1989-10-18 |
EP0337149A3 (en) | 1990-03-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8330 | Complete disclaimer |