DE634699T1 - Gruppiertes fotolithografisches System. - Google Patents
Gruppiertes fotolithografisches System.Info
- Publication number
- DE634699T1 DE634699T1 DE0634699T DE94201723T DE634699T1 DE 634699 T1 DE634699 T1 DE 634699T1 DE 0634699 T DE0634699 T DE 0634699T DE 94201723 T DE94201723 T DE 94201723T DE 634699 T1 DE634699 T1 DE 634699T1
- Authority
- DE
- Germany
- Prior art keywords
- grouped
- photolithographic system
- photolithographic
- grouped photolithographic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US9350593A | 1993-07-16 | 1993-07-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE634699T1 true DE634699T1 (de) | 1996-02-15 |
Family
ID=22239332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE0634699T Pending DE634699T1 (de) | 1993-07-16 | 1994-06-15 | Gruppiertes fotolithografisches System. |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5651823A (de) |
| EP (1) | EP0634699A1 (de) |
| JP (1) | JPH07169678A (de) |
| KR (1) | KR950004376A (de) |
| DE (1) | DE634699T1 (de) |
Families Citing this family (76)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5826129A (en) * | 1994-06-30 | 1998-10-20 | Tokyo Electron Limited | Substrate processing system |
| US5993081A (en) * | 1995-10-24 | 1999-11-30 | Canon Kabushiki Kaisha | In-line processing system |
| US6062798A (en) * | 1996-06-13 | 2000-05-16 | Brooks Automation, Inc. | Multi-level substrate processing apparatus |
| US5779799A (en) * | 1996-06-21 | 1998-07-14 | Micron Technology, Inc. | Substrate coating apparatus |
| EP0819981B1 (de) * | 1996-07-18 | 2002-06-05 | JSR Corporation | Strahlungsempfindliche Harzzusammensetzung |
| JP3779393B2 (ja) * | 1996-09-06 | 2006-05-24 | 東京エレクトロン株式会社 | 処理システム |
| JP3566475B2 (ja) * | 1996-12-03 | 2004-09-15 | 東京エレクトロン株式会社 | 処理装置 |
| GB2320135A (en) * | 1996-12-04 | 1998-06-10 | Smiths Industries Plc | Semiconductor wafer processing apparatus |
| JP3926890B2 (ja) * | 1997-06-11 | 2007-06-06 | 東京エレクトロン株式会社 | 処理システム |
| DE19725866C1 (de) * | 1997-06-18 | 1999-04-22 | Ivoclar Ag | Brennofen |
| EP1019954B1 (de) * | 1998-02-04 | 2013-05-15 | Applied Materials, Inc. | Methode und Apparat für die Niedertemperaturbehandlung von elektroplattierten Kupfer-Mikrostrukturen für mikroelektronische Anordnungen |
| US7244677B2 (en) * | 1998-02-04 | 2007-07-17 | Semitool. Inc. | Method for filling recessed micro-structures with metallization in the production of a microelectronic device |
| US6079927A (en) * | 1998-04-22 | 2000-06-27 | Varian Semiconductor Equipment Associates, Inc. | Automated wafer buffer for use with wafer processing equipment |
| US6178361B1 (en) * | 1998-11-20 | 2001-01-23 | Karl Suss America, Inc. | Automatic modular wafer substrate handling device |
| US6616394B1 (en) | 1998-12-30 | 2003-09-09 | Silicon Valley Group | Apparatus for processing wafers |
| US6075334A (en) * | 1999-03-15 | 2000-06-13 | Berkeley Process Control, Inc | Automatic calibration system for wafer transfer robot |
| US6454512B1 (en) | 1999-03-18 | 2002-09-24 | Pri Automation, Inc. | Person-guided vehicle |
| TW451274B (en) * | 1999-06-11 | 2001-08-21 | Tokyo Electron Ltd | Substrate processing apparatus |
| US6402400B1 (en) * | 1999-10-06 | 2002-06-11 | Tokyo Electron Limited | Substrate processing apparatus |
| US6443359B1 (en) * | 1999-12-03 | 2002-09-03 | Diebold, Incorporated | Automated transaction system and method |
| US6402508B2 (en) * | 1999-12-09 | 2002-06-11 | Tokyo Electron Limited | Heat and cooling treatment apparatus and substrate processing system |
| SG106599A1 (en) * | 2000-02-01 | 2004-10-29 | Tokyo Electron Ltd | Substrate processing apparatus and substrate processing method |
| US6471913B1 (en) | 2000-02-09 | 2002-10-29 | Semitool, Inc. | Method and apparatus for processing a microelectronic workpiece including an apparatus and method for executing a processing step at an elevated temperature |
| US6780374B2 (en) | 2000-12-08 | 2004-08-24 | Semitool, Inc. | Method and apparatus for processing a microelectronic workpiece at an elevated temperature |
| EP1124252A2 (de) * | 2000-02-10 | 2001-08-16 | Applied Materials, Inc. | Verfahren und Vorrichtung zur Verarbeitung von Substraten |
| US6544338B1 (en) * | 2000-02-10 | 2003-04-08 | Novellus Systems, Inc. | Inverted hot plate cure module |
| EP1356499A2 (de) * | 2000-07-10 | 2003-10-29 | Temptronic Corporation | Scheibenhalter mit verschachtelten wärme- und kühlelementen |
| WO2002031747A1 (en) * | 2000-10-13 | 2002-04-18 | Irm Llc | High throughput processing system and method of using |
| US6754975B2 (en) | 2001-01-16 | 2004-06-29 | Taiwan Semiconductor Manufacturing Co., Ltd | Microelectronic substrate retainer apparatus providing reduced microelectronic substrate damage |
| US6529686B2 (en) | 2001-06-06 | 2003-03-04 | Fsi International, Inc. | Heating member for combination heating and chilling apparatus, and methods |
| EP1481114A4 (de) * | 2001-08-31 | 2005-06-22 | Semitool Inc | Vorrichtung und verfahren zur elektrochemischen verarbeitung von mikroelektronischen werkstücken |
| US6515261B1 (en) | 2002-03-06 | 2003-02-04 | Applied Materials, Inc. | Enhanced lift pin |
| JP4274736B2 (ja) | 2002-03-28 | 2009-06-10 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP4342147B2 (ja) * | 2002-05-01 | 2009-10-14 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| KR100490175B1 (ko) * | 2002-07-04 | 2005-05-17 | 주성엔지니어링(주) | 반도체 제조장치의 컨트롤러 모듈 |
| JP4233285B2 (ja) * | 2002-08-23 | 2009-03-04 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| US6817821B2 (en) * | 2002-10-21 | 2004-11-16 | Robert D. Henderson | Wafer handling for a reflow tool |
| US7384484B2 (en) * | 2002-11-18 | 2008-06-10 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing method, substrate processing apparatus and substrate processing system |
| US6939403B2 (en) * | 2002-11-19 | 2005-09-06 | Blue29, Llc | Spatially-arranged chemical processing station |
| TWI220052B (en) * | 2002-11-25 | 2004-08-01 | Au Optronics Corp | Plasma display panel having shared data electrodes |
| US7274429B2 (en) * | 2003-12-10 | 2007-09-25 | Asml Netherlands B.V. | Integrated lithographic fabrication cluster |
| DE102004019732A1 (de) * | 2004-04-20 | 2005-11-17 | Sse Sister Semiconductor Equipment Gmbh | Vorrichtung und Verfahren für die Bearbeitung eines Substrats in der Halbleitertechnik sowie System, das eine Vorrichtung für die Bearbeitung eines Substrats umfasst |
| JP4343151B2 (ja) * | 2004-08-11 | 2009-10-14 | 東京エレクトロン株式会社 | 加熱プレートの温度測定方法、基板処理装置及び加熱プレートの温度測定用のコンピュータプログラム |
| US7282675B2 (en) * | 2004-12-22 | 2007-10-16 | Sokudo Co., Ltd. | Integrated thermal unit having a shuttle with a temperature controlled surface |
| US7288746B2 (en) * | 2004-12-22 | 2007-10-30 | Sokudo Co., Ltd. | Integrated thermal unit having laterally adjacent bake and chill plates on different planes |
| JP2008526030A (ja) * | 2004-12-22 | 2008-07-17 | 株式会社Ｓｏｋｕｄｏ | 集積熱ユニット |
| US7297906B2 (en) * | 2004-12-22 | 2007-11-20 | Sokudo Co., Ltd. | Integrated thermal unit having a shuttle with two-axis movement |
| US7819079B2 (en) | 2004-12-22 | 2010-10-26 | Applied Materials, Inc. | Cartesian cluster tool configuration for lithography type processes |
| US7741585B2 (en) * | 2004-12-22 | 2010-06-22 | Sokudo Co., Ltd. | Integrated thermal unit having a shuttle with two-axis movement |
| US7651306B2 (en) | 2004-12-22 | 2010-01-26 | Applied Materials, Inc. | Cartesian robot cluster tool architecture |
| US7396412B2 (en) | 2004-12-22 | 2008-07-08 | Sokudo Co., Ltd. | Coat/develop module with shared dispense |
| US7798764B2 (en) | 2005-12-22 | 2010-09-21 | Applied Materials, Inc. | Substrate processing sequence in a cartesian robot cluster tool |
| US7699021B2 (en) | 2004-12-22 | 2010-04-20 | Sokudo Co., Ltd. | Cluster tool substrate throughput optimization |
| US7601934B2 (en) * | 2004-12-22 | 2009-10-13 | Sokudo Co., Ltd. | Integrated thermal unit having a shuttle with a temperature controlled surface |
| KR100637717B1 (ko) * | 2005-09-28 | 2006-10-25 | 세메스 주식회사 | 베이크 유닛, 상기 베이크 유닛에 사용되는 가열플레이트를 냉각하는 방법, 그리고 상기 베이크 유닛을포함하는 기판 처리 장치 및 방법 |
| US20080028360A1 (en) * | 2006-07-31 | 2008-01-31 | Picciotto Carl E | Methods and systems for performing lithography, methods for aligning objects relative to one another, and nanoimprinting molds having non-marking alignment features |
| US7694688B2 (en) | 2007-01-05 | 2010-04-13 | Applied Materials, Inc. | Wet clean system design |
| US7950407B2 (en) * | 2007-02-07 | 2011-05-31 | Applied Materials, Inc. | Apparatus for rapid filling of a processing volume |
| US20080203083A1 (en) * | 2007-02-28 | 2008-08-28 | Wirth Paul Z | Single wafer anneal processor |
| JP5006122B2 (ja) | 2007-06-29 | 2012-08-22 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| JP4505006B2 (ja) * | 2007-09-28 | 2010-07-14 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP4505005B2 (ja) * | 2007-09-28 | 2010-07-14 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP4499147B2 (ja) * | 2007-11-21 | 2010-07-07 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP5128918B2 (ja) | 2007-11-30 | 2013-01-23 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| JP4617349B2 (ja) * | 2007-12-27 | 2011-01-26 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP5001828B2 (ja) | 2007-12-28 | 2012-08-15 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| JP5179170B2 (ja) | 2007-12-28 | 2013-04-10 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| US7798487B2 (en) * | 2008-06-27 | 2010-09-21 | Eastman Kodak Company | Print plate handling system |
| JP5306908B2 (ja) * | 2009-06-03 | 2013-10-02 | 東京エレクトロン株式会社 | 搬送モジュール |
| US8847122B2 (en) * | 2009-06-08 | 2014-09-30 | Macronix International Co., Ltd. | Method and apparatus for transferring substrate |
| US9176397B2 (en) * | 2011-04-28 | 2015-11-03 | Mapper Lithography Ip B.V. | Apparatus for transferring a substrate in a lithography system |
| US8703581B2 (en) * | 2011-06-15 | 2014-04-22 | Applied Materials, Inc. | Water soluble mask for substrate dicing by laser and plasma etch |
| CN102402133B (zh) * | 2011-11-12 | 2013-09-18 | 哈尔滨工业大学 | 基于并联机构的双工件台同相位回转交换方法与装置 |
| CN103199032A (zh) * | 2012-01-04 | 2013-07-10 | 沈阳芯源微电子设备有限公司 | 一种集束式结构的涂胶显影设备 |
| US9281251B2 (en) * | 2013-08-09 | 2016-03-08 | Tokyo Electron Limited | Substrate backside texturing |
| CN105789085B (zh) * | 2014-12-24 | 2018-08-14 | 上海微电子装备（集团）股份有限公司 | 一种兼容多种工艺硅片的物料传输系统 |
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| US4842683A (en) * | 1986-12-19 | 1989-06-27 | Applied Materials, Inc. | Magnetic field-enhanced plasma etch reactor |
| US4951601A (en) * | 1986-12-19 | 1990-08-28 | Applied Materials, Inc. | Multi-chamber integrated process system |
| US5193972A (en) * | 1987-02-09 | 1993-03-16 | Svg Lithography Systems, Inc. | Wafer handling system |
| KR970003907B1 (ko) * | 1988-02-12 | 1997-03-22 | 도오교오 에레구토론 가부시끼 가이샤 | 기판처리 장치 및 기판처리 방법 |
| US5202716A (en) * | 1988-02-12 | 1993-04-13 | Tokyo Electron Limited | Resist process system |
| US5061144A (en) * | 1988-11-30 | 1991-10-29 | Tokyo Electron Limited | Resist process apparatus |
| EP0408216A3 (en) * | 1989-07-11 | 1991-09-18 | Hitachi, Ltd. | Method for processing wafers and producing semiconductor devices and apparatus for producing the same |
| JP2905857B2 (ja) * | 1989-08-11 | 1999-06-14 | 東京エレクトロン株式会社 | 縦型処理装置 |
| US5079854A (en) * | 1989-12-27 | 1992-01-14 | Xerox Corporation | Method and apparatus for cleaning, coating and curing receptor substrates in an enclosed planetary array |
| CA2017719C (en) * | 1990-05-29 | 1999-01-19 | Zarlink Semiconductor Inc. | Moisture-free sog process |
| JP2704309B2 (ja) * | 1990-06-12 | 1998-01-26 | 大日本スクリーン製造株式会社 | 基板処理装置及び基板の熱処理方法 |
| JPH0810686B2 (ja) * | 1990-09-14 | 1996-01-31 | 株式会社東芝 | 半導体基板エッチング処理装置 |
| US5180276A (en) * | 1991-04-18 | 1993-01-19 | Brooks Automation, Inc. | Articulated arm transfer device |
| US5171393A (en) * | 1991-07-29 | 1992-12-15 | Moffat William A | Wafer processing apparatus |
| JP2867194B2 (ja) * | 1992-02-05 | 1999-03-08 | 東京エレクトロン株式会社 | 処理装置及び処理方法 |
-
1994
- 1994-06-15 DE DE0634699T patent/DE634699T1/de active Pending
- 1994-06-15 EP EP94201723A patent/EP0634699A1/de not_active Withdrawn
- 1994-07-16 KR KR1019940017257A patent/KR950004376A/ko not_active Application Discontinuation
- 1994-07-18 JP JP6165361A patent/JPH07169678A/ja active Pending
-
1995
- 1995-03-29 US US08/412,650 patent/US5651823A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US5651823A (en) | 1997-07-29 |
| KR950004376A (ko) | 1995-02-17 |
| JPH07169678A (ja) | 1995-07-04 |
| EP0634699A1 (de) | 1995-01-18 |
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