DE60335905D1 - LED-Baugruppe mit Leiterrahmen und zweiteiligem Kühlkörper und Herstellungsverfahren derselben - Google Patents
LED-Baugruppe mit Leiterrahmen und zweiteiligem Kühlkörper und Herstellungsverfahren derselbenInfo
- Publication number
- DE60335905D1 DE60335905D1 DE60335905T DE60335905T DE60335905D1 DE 60335905 D1 DE60335905 D1 DE 60335905D1 DE 60335905 T DE60335905 T DE 60335905T DE 60335905 T DE60335905 T DE 60335905T DE 60335905 D1 DE60335905 D1 DE 60335905D1
- Authority
- DE
- Germany
- Prior art keywords
- mounting pad
- heatsink
- leadframe
- reflector
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000008393 encapsulating agent Substances 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US43152302P | 2002-12-06 | 2002-12-06 | |
| PCT/US2003/038214 WO2004053933A2 (en) | 2002-12-06 | 2003-12-03 | Composite leadframe led package and method of making the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE60335905D1 true DE60335905D1 (de) | 2011-03-10 |
Family
ID=32507746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60335905T Expired - Lifetime DE60335905D1 (de) | 2002-12-06 | 2003-12-03 | LED-Baugruppe mit Leiterrahmen und zweiteiligem Kühlkörper und Herstellungsverfahren derselben |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US7692206B2 (de) |
| EP (3) | EP2270889B1 (de) |
| JP (1) | JP4757495B2 (de) |
| KR (1) | KR101141492B1 (de) |
| CN (1) | CN100385636C (de) |
| AT (1) | ATE497256T1 (de) |
| AU (1) | AU2003293223A1 (de) |
| CA (1) | CA2508133A1 (de) |
| DE (1) | DE60335905D1 (de) |
| TW (1) | TWI333230B (de) |
| WO (1) | WO2004053933A2 (de) |
Families Citing this family (143)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7429757B2 (en) * | 2002-06-19 | 2008-09-30 | Sanken Electric Co., Ltd. | Semiconductor light emitting device capable of increasing its brightness |
| US7244965B2 (en) | 2002-09-04 | 2007-07-17 | Cree Inc, | Power surface mount light emitting die package |
| US7775685B2 (en) * | 2003-05-27 | 2010-08-17 | Cree, Inc. | Power surface mount light emitting die package |
| US7692206B2 (en) | 2002-12-06 | 2010-04-06 | Cree, Inc. | Composite leadframe LED package and method of making the same |
| JP4274935B2 (ja) * | 2003-12-26 | 2009-06-10 | トキコーポレーション株式会社 | 発光ユニット用ケースおよび発光ユニット製造方法 |
| US7280288B2 (en) | 2004-06-04 | 2007-10-09 | Cree, Inc. | Composite optical lens with an integrated reflector |
| US7456499B2 (en) | 2004-06-04 | 2008-11-25 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
| TWM258416U (en) * | 2004-06-04 | 2005-03-01 | Lite On Technology Corp | Power LED package module |
| DE102004045947A1 (de) | 2004-06-30 | 2006-01-19 | Osram Opto Semiconductors Gmbh | Leuchtdiodenanordnung |
| KR20060018453A (ko) * | 2004-08-24 | 2006-03-02 | 삼성전자주식회사 | 히트 싱크를 갖는 반도체 소자 |
| JP5192811B2 (ja) * | 2004-09-10 | 2013-05-08 | ソウル セミコンダクター カンパニー リミテッド | 多重モールド樹脂を有する発光ダイオードパッケージ |
| CN100347869C (zh) * | 2004-09-14 | 2007-11-07 | 宏齐科技股份有限公司 | 发光芯片的封装结构 |
| TWI405349B (zh) * | 2004-10-07 | 2013-08-11 | Seoul Semiconductor Co Ltd | 側照明透鏡以及使用此透鏡的發光元件 |
| US20060087866A1 (en) * | 2004-10-22 | 2006-04-27 | Ng Kee Y | LED backlight |
| WO2006065007A1 (en) * | 2004-12-16 | 2006-06-22 | Seoul Semiconductor Co., Ltd. | Leadframe having a heat sink supporting ring, fabricating method of a light emitting diodepackage using the same and light emitting diodepackage fabbricated by the method |
| US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| US9793247B2 (en) | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
| US7821023B2 (en) | 2005-01-10 | 2010-10-26 | Cree, Inc. | Solid state lighting component |
| US7777247B2 (en) * | 2005-01-14 | 2010-08-17 | Cree, Inc. | Semiconductor light emitting device mounting substrates including a conductive lead extending therein |
| US7939842B2 (en) * | 2005-01-27 | 2011-05-10 | Cree, Inc. | Light emitting device packages, light emitting diode (LED) packages and related methods |
| EP1864339A4 (de) * | 2005-03-11 | 2010-12-29 | Seoul Semiconductor Co Ltd | Led-kapselung mit einer gruppe in reihe geschalteter leuchtzellen |
| KR100609784B1 (ko) * | 2005-05-20 | 2006-08-09 | 럭스피아 주식회사 | 일체형 방열판을 가지는 발광다이오드 패키지 및 멀티패키지 모듈 |
| US8669572B2 (en) | 2005-06-10 | 2014-03-11 | Cree, Inc. | Power lamp package |
| US7980743B2 (en) | 2005-06-14 | 2011-07-19 | Cree, Inc. | LED backlighting for displays |
| US20060292747A1 (en) * | 2005-06-27 | 2006-12-28 | Loh Ban P | Top-surface-mount power light emitter with integral heat sink |
| KR100629496B1 (ko) * | 2005-08-08 | 2006-09-28 | 삼성전자주식회사 | Ｌｅｄ 패키지 및 그 제조방법 |
| US20070126020A1 (en) * | 2005-12-03 | 2007-06-07 | Cheng Lin | High-power LED chip packaging structure and fabrication method thereof |
| KR100765714B1 (ko) * | 2005-12-15 | 2007-10-11 | 엘지전자 주식회사 | 리드프레임, 그를 이용한 발광 소자 패키지 및 그의 제조방법 |
| EP1974389A4 (de) | 2006-01-05 | 2010-12-29 | Illumitex Inc | Separate optische vorrichtung zur lichtorientierung von einer led |
| KR101283182B1 (ko) | 2006-01-26 | 2013-07-05 | 엘지이노텍 주식회사 | 발광 다이오드 패키지 및 그 제조 방법 |
| US20070181897A1 (en) * | 2006-02-03 | 2007-08-09 | Been-Yu Liaw | High heat dissipating package baseplate for a high brightness LED |
| KR100729439B1 (ko) * | 2006-03-23 | 2007-06-15 | (주)싸이럭스 | 발광소자 패키지 구조체와 그 제조방법 및 이를 적용한발광소자의 제조방법 |
| US7675145B2 (en) | 2006-03-28 | 2010-03-09 | Cree Hong Kong Limited | Apparatus, system and method for use in mounting electronic elements |
| US11210971B2 (en) | 2009-07-06 | 2021-12-28 | Cree Huizhou Solid State Lighting Company Limited | Light emitting diode display with tilted peak emission pattern |
| US8748915B2 (en) | 2006-04-24 | 2014-06-10 | Cree Hong Kong Limited | Emitter package with angled or vertical LED |
| US7635915B2 (en) | 2006-04-26 | 2009-12-22 | Cree Hong Kong Limited | Apparatus and method for use in mounting electronic elements |
| US7655957B2 (en) * | 2006-04-27 | 2010-02-02 | Cree, Inc. | Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same |
| JP4830768B2 (ja) * | 2006-05-10 | 2011-12-07 | 日亜化学工業株式会社 | 半導体発光装置及び半導体発光装置の製造方法 |
| JP2009538531A (ja) * | 2006-05-23 | 2009-11-05 | クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド | 照明装置、および、製造方法 |
| KR100904152B1 (ko) * | 2006-06-30 | 2009-06-25 | 서울반도체 주식회사 | 히트싱크 지지부를 갖는 리드프레임, 그것을 사용한 발광다이오드 패키지 제조방법 및 그것에 의해 제조된 발광다이오드 패키지 |
| US8044418B2 (en) * | 2006-07-13 | 2011-10-25 | Cree, Inc. | Leadframe-based packages for solid state light emitting devices |
| US7960819B2 (en) * | 2006-07-13 | 2011-06-14 | Cree, Inc. | Leadframe-based packages for solid state emitting devices |
| US8735920B2 (en) | 2006-07-31 | 2014-05-27 | Cree, Inc. | Light emitting diode package with optical element |
| US8367945B2 (en) * | 2006-08-16 | 2013-02-05 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
| CN101145592B (zh) * | 2006-09-13 | 2010-09-29 | 佰鸿工业股份有限公司 | 高散热性发光二极管装置 |
| KR101241528B1 (ko) | 2006-09-25 | 2013-03-08 | 엘지이노텍 주식회사 | 발광 장치 |
| JP2010506402A (ja) | 2006-10-02 | 2010-02-25 | イルミテックス， インコーポレイテッド | Ｌｅｄのシステムおよび方法 |
| US20080089072A1 (en) * | 2006-10-11 | 2008-04-17 | Alti-Electronics Co., Ltd. | High Power Light Emitting Diode Package |
| KR100851183B1 (ko) * | 2006-12-27 | 2008-08-08 | 엘지이노텍 주식회사 | 반도체 발광소자 패키지 |
| US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
| US7922360B2 (en) * | 2007-02-14 | 2011-04-12 | Cree, Inc. | Thermal transfer in solid state light emitting apparatus and methods of manufacturing |
| US7964888B2 (en) * | 2007-04-18 | 2011-06-21 | Cree, Inc. | Semiconductor light emitting device packages and methods |
| KR101380385B1 (ko) * | 2007-06-29 | 2014-04-10 | 서울반도체 주식회사 | 일괄 봉지 기술을 이용하는 ｌｅｄ 패키지 제조방법 |
| CN101388161A (zh) * | 2007-09-14 | 2009-03-18 | 科锐香港有限公司 | Led表面安装装置和并入有此装置的led显示器 |
| US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
| US8866169B2 (en) | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
| USD615504S1 (en) * | 2007-10-31 | 2010-05-11 | Cree, Inc. | Emitter package |
| KR200447448Y1 (ko) * | 2007-11-29 | 2010-01-25 | (주)솔라루체 | Ｌｅｄ 소자용 리드프레임 패키지 및 이를 이용한 ｌｅｄ패키지 |
| USD633631S1 (en) | 2007-12-14 | 2011-03-01 | Cree Hong Kong Limited | Light source of light emitting diode |
| DE102008013898A1 (de) * | 2007-12-14 | 2009-06-25 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement, Anordnung und Verfahren zur Herstellung eines optoelektronischen Bauelements |
| USD634863S1 (en) | 2008-01-10 | 2011-03-22 | Cree Hong Kong Limited | Light source of light emitting diode |
| EP2240968A1 (de) | 2008-02-08 | 2010-10-20 | Illumitex, Inc. | System und verfahren zur bildung einer emitterschicht |
| DE102008011862A1 (de) * | 2008-02-29 | 2009-09-03 | Osram Opto Semiconductors Gmbh | Miniaturgehäuse, Trägeranordnung mit mindestens einem Miniaturgehäuse, sowie ein Verfahren zur Herstellung einer Trägeranordnung |
| TWI360239B (en) * | 2008-03-19 | 2012-03-11 | E Pin Optical Industry Co Ltd | Package structure for light emitting diode |
| DE102008021435A1 (de) | 2008-04-29 | 2009-11-19 | Schott Ag | Gehäuse für LEDs mit hoher Leistung |
| KR100997198B1 (ko) * | 2008-05-06 | 2010-11-29 | 김민공 | 프레스 단조 방식의 발광다이오드 금속제 하우징 및 금속제하우징을 이용한 발광다이오드 금속제 패키지 |
| KR100951779B1 (ko) | 2008-05-09 | 2010-04-08 | 주식회사 디에스엘시디 | 발광다이오드 패키지 및 그 제조방법 |
| US8049230B2 (en) | 2008-05-16 | 2011-11-01 | Cree Huizhou Opto Limited | Apparatus and system for miniature surface mount devices |
| KR101324077B1 (ko) * | 2008-08-26 | 2013-10-31 | 딩구오 판 | 발광 다이오드 멀티 칩 실장 및 실장 탑재로 만들어진 스트립 라이트 |
| JP5217800B2 (ja) | 2008-09-03 | 2013-06-19 | 日亜化学工業株式会社 | 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法 |
| DE102008045925A1 (de) * | 2008-09-04 | 2010-03-11 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils |
| US9425172B2 (en) | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
| US8791471B2 (en) | 2008-11-07 | 2014-07-29 | Cree Hong Kong Limited | Multi-chip light emitting diode modules |
| KR100888236B1 (ko) | 2008-11-18 | 2009-03-12 | 서울반도체 주식회사 | 발광 장치 |
| TW201034256A (en) | 2008-12-11 | 2010-09-16 | Illumitex Inc | Systems and methods for packaging light-emitting diode devices |
| US7923739B2 (en) | 2009-06-05 | 2011-04-12 | Cree, Inc. | Solid state lighting device |
| US8598602B2 (en) * | 2009-01-12 | 2013-12-03 | Cree, Inc. | Light emitting device packages with improved heat transfer |
| US8368112B2 (en) | 2009-01-14 | 2013-02-05 | Cree Huizhou Opto Limited | Aligned multiple emitter package |
| US20110037083A1 (en) * | 2009-01-14 | 2011-02-17 | Alex Chi Keung Chan | Led package with contrasting face |
| JP2010182486A (ja) * | 2009-02-04 | 2010-08-19 | Koito Mfg Co Ltd | 車両用灯具 |
| US8351794B2 (en) * | 2009-03-10 | 2013-01-08 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Parallel optical transceiver module having a heat dissipation system that dissipates heat and protects components of the module from particulates and handling |
| US8168990B2 (en) * | 2009-03-19 | 2012-05-01 | Cid Technologies Llc | Apparatus for dissipating thermal energy generated by current flow in semiconductor circuits |
| US20100270580A1 (en) * | 2009-04-22 | 2010-10-28 | Jason Loomis Posselt | Substrate based light source package with electrical leads |
| US8957435B2 (en) * | 2009-04-28 | 2015-02-17 | Cree, Inc. | Lighting device |
| US8686445B1 (en) | 2009-06-05 | 2014-04-01 | Cree, Inc. | Solid state lighting devices and methods |
| US9111778B2 (en) | 2009-06-05 | 2015-08-18 | Cree, Inc. | Light emitting diode (LED) devices, systems, and methods |
| US8860043B2 (en) * | 2009-06-05 | 2014-10-14 | Cree, Inc. | Light emitting device packages, systems and methods |
| US7875970B2 (en) * | 2009-06-10 | 2011-01-25 | Green Arrow Asia Limited | Integrated circuit package having a castellated heatspreader |
| CN101936500A (zh) * | 2009-06-30 | 2011-01-05 | 富准精密工业(深圳)有限公司 | 发光二极管模组 |
| US8415692B2 (en) | 2009-07-06 | 2013-04-09 | Cree, Inc. | LED packages with scattering particle regions |
| US8598809B2 (en) | 2009-08-19 | 2013-12-03 | Cree, Inc. | White light color changing solid state lighting and methods |
| US8449128B2 (en) | 2009-08-20 | 2013-05-28 | Illumitex, Inc. | System and method for a lens and phosphor layer |
| US8585253B2 (en) | 2009-08-20 | 2013-11-19 | Illumitex, Inc. | System and method for color mixing lens array |
| US8679865B2 (en) * | 2009-08-28 | 2014-03-25 | Samsung Electronics Co., Ltd. | Resin application apparatus, optical property correction apparatus and method, and method for manufacturing LED package |
| US8410371B2 (en) | 2009-09-08 | 2013-04-02 | Cree, Inc. | Electronic device submounts with thermally conductive vias and light emitting devices including the same |
| WO2011029154A1 (en) * | 2009-09-10 | 2011-03-17 | Hamish Mclennan | Improved light emitting diode (led) assembly and method of manufacturing the same |
| CN102024882A (zh) * | 2009-09-14 | 2011-04-20 | 展晶科技(深圳)有限公司 | 发光二极管装置及其制造方法 |
| US8120056B2 (en) * | 2009-10-19 | 2012-02-21 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light emitting diode assembly |
| US7893445B2 (en) * | 2009-11-09 | 2011-02-22 | Cree, Inc. | Solid state emitter package including red and blue emitters |
| WO2011060319A1 (en) * | 2009-11-13 | 2011-05-19 | Uni-Light Llc | Led thermal management |
| CN102751426B (zh) * | 2010-01-20 | 2015-08-12 | 光宝电子(广州)有限公司 | 封装结构及发光二极管封装结构 |
| US8350370B2 (en) | 2010-01-29 | 2013-01-08 | Cree Huizhou Opto Limited | Wide angle oval light emitting diode package |
| US9024350B2 (en) * | 2010-02-08 | 2015-05-05 | Ban P Loh | LED light module |
| US9012938B2 (en) | 2010-04-09 | 2015-04-21 | Cree, Inc. | High reflective substrate of light emitting devices with improved light output |
| US9240526B2 (en) | 2010-04-23 | 2016-01-19 | Cree, Inc. | Solid state light emitting diode packages with leadframes and ceramic material |
| US8648359B2 (en) | 2010-06-28 | 2014-02-11 | Cree, Inc. | Light emitting devices and methods |
| US8269244B2 (en) | 2010-06-28 | 2012-09-18 | Cree, Inc. | LED package with efficient, isolated thermal path |
| USD643819S1 (en) | 2010-07-16 | 2011-08-23 | Cree, Inc. | Package for light emitting diode (LED) lighting |
| US8455882B2 (en) | 2010-10-15 | 2013-06-04 | Cree, Inc. | High efficiency LEDs |
| USD679842S1 (en) | 2011-01-03 | 2013-04-09 | Cree, Inc. | High brightness LED package |
| US8610140B2 (en) | 2010-12-15 | 2013-12-17 | Cree, Inc. | Light emitting diode (LED) packages, systems, devices and related methods |
| US8772817B2 (en) | 2010-12-22 | 2014-07-08 | Cree, Inc. | Electronic device submounts including substrates with thermally conductive vias |
| TW201251140A (en) * | 2011-01-31 | 2012-12-16 | Cree Inc | High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion |
| WO2012109225A1 (en) | 2011-02-07 | 2012-08-16 | Cree, Inc. | Components and methods for light emitting diode (led) lighting |
| US9246052B2 (en) | 2011-07-15 | 2016-01-26 | Institute Of Semiconductors, Chinese Academy Of Sciences | Packaging structure of light emitting diode and method of manufacturing the same |
| WO2013036481A2 (en) | 2011-09-06 | 2013-03-14 | Cree, Inc. | Light emitter packages and devices having improved wire bonding and related methods |
| DE102011113653B4 (de) * | 2011-09-19 | 2016-02-18 | Rüdiger Lanz | LED-Hochleistungsspot |
| US8823041B2 (en) | 2011-10-27 | 2014-09-02 | Seoul Semiconductor Co., Ltd. | Light emitting diode package and light emitting module comprising the same |
| US8692282B2 (en) | 2011-10-27 | 2014-04-08 | Seoul Semiconductor Co., Ltd. | Light emitting diode package and light emitting module comprising the same |
| US20130107462A1 (en) * | 2011-10-27 | 2013-05-02 | Zhirong LU | Hidden pin type high-power led support and hidden pin type high-power led packaging structure and technology using same |
| US20130120986A1 (en) | 2011-11-12 | 2013-05-16 | Raydex Technology, Inc. | High efficiency directional light source with concentrated light output |
| US8564004B2 (en) | 2011-11-29 | 2013-10-22 | Cree, Inc. | Complex primary optics with intermediate elements |
| US9194556B1 (en) | 2012-02-22 | 2015-11-24 | Theodore G. Nelson | Method of producing LED lighting apparatus and apparatus produced thereby |
| KR101281532B1 (ko) * | 2013-01-11 | 2013-07-03 | (주)뉴티스 | 파워 엘이디 패키지용 히트싱크 일체형 리드 프레임의 제조방법 |
| DE202013101190U1 (de) | 2013-03-20 | 2014-06-24 | Zumtobel Lighting Gmbh | Anordnung zur Lichtabgabe mit einer LED, einer Platine und einem optischen Element |
| USD735683S1 (en) | 2013-05-03 | 2015-08-04 | Cree, Inc. | LED package |
| TWI559053B (zh) * | 2013-05-28 | 2016-11-21 | 潘宇翔 | 適用於直下式背光模組之光源裝置及其顯示器 |
| US9105825B2 (en) | 2013-06-03 | 2015-08-11 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Light source package and method of manufacturing the same |
| US9461024B2 (en) | 2013-08-01 | 2016-10-04 | Cree, Inc. | Light emitter devices and methods for light emitting diode (LED) chips |
| USD758976S1 (en) | 2013-08-08 | 2016-06-14 | Cree, Inc. | LED package |
| US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
| US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
| USD790486S1 (en) | 2014-09-30 | 2017-06-27 | Cree, Inc. | LED package with truncated encapsulant |
| USD777122S1 (en) | 2015-02-27 | 2017-01-24 | Cree, Inc. | LED package |
| US11431146B2 (en) * | 2015-03-27 | 2022-08-30 | Jabil Inc. | Chip on submount module |
| USD912303S1 (en) * | 2015-04-07 | 2021-03-02 | Flos S.P.A. | Table lamp |
| USD783547S1 (en) | 2015-06-04 | 2017-04-11 | Cree, Inc. | LED package |
| JP6748303B2 (ja) * | 2016-11-11 | 2020-08-26 | ルミレッズ ホールディング ベーフェー | リードフレーム製造方法 |
| US11677059B2 (en) | 2017-04-26 | 2023-06-13 | Samsung Electronics Co., Ltd. | Light-emitting device package including a lead frame |
| KR102335216B1 (ko) | 2017-04-26 | 2021-12-03 | 삼성전자 주식회사 | 발광소자 패키지 |
| WO2019151826A1 (ko) * | 2018-02-05 | 2019-08-08 | 엘지이노텍 주식회사 | 반도체 소자 패키지 및 이를 포함하는 발광장치 |
| WO2020027721A1 (en) * | 2018-07-31 | 2020-02-06 | Ams Sensors Asia Pte. Ltd. | Package including portions of a lead frame as electrically conductive leads |
| JP7248699B2 (ja) * | 2018-09-27 | 2023-03-29 | 京セラ株式会社 | 配線基板および電気装置 |
Family Cites Families (64)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4267559A (en) * | 1979-09-24 | 1981-05-12 | Bell Telephone Laboratories, Incorporated | Low thermal impedance light-emitting diode package |
| JPS5812961U (ja) * | 1981-07-16 | 1983-01-27 | 株式会社東芝 | ハ−メチツクシ−ル型光半導体装置 |
| US4514750A (en) * | 1982-01-11 | 1985-04-30 | Texas Instruments Incorporated | Integrated circuit package having interconnected leads adjacent the package ends |
| JPS60262476A (ja) * | 1984-06-08 | 1985-12-25 | Matsushita Electric Ind Co Ltd | 発光素子 |
| USRE37707E1 (en) * | 1990-02-22 | 2002-05-21 | Stmicroelectronics S.R.L. | Leadframe with heat dissipator connected to S-shaped fingers |
| US5173839A (en) * | 1990-12-10 | 1992-12-22 | Grumman Aerospace Corporation | Heat-dissipating method and device for led display |
| JP2966591B2 (ja) | 1991-08-02 | 1999-10-25 | 三洋電機株式会社 | 光半導体装置 |
| US5441918A (en) * | 1993-01-29 | 1995-08-15 | Lsi Logic Corporation | Method of making integrated circuit die package |
| JP3420612B2 (ja) * | 1993-06-25 | 2003-06-30 | 株式会社東芝 | Ｌｅｄランプ |
| US5789772A (en) | 1994-07-15 | 1998-08-04 | The Whitaker Corporation | Semi-insulating surface light emitting devices |
| DE4446566A1 (de) * | 1994-12-24 | 1996-06-27 | Telefunken Microelectron | Mehrpoliges, oberflächenmontierbares, elektronisches Bauelement |
| US5874838A (en) | 1996-06-13 | 1999-02-23 | Cypress Semiconductor Corporation | High voltage-tolerant low voltage input/output cell |
| US5785418A (en) * | 1996-06-27 | 1998-07-28 | Hochstein; Peter A. | Thermally protected LED array |
| JP3699783B2 (ja) * | 1996-07-23 | 2005-09-28 | 株式会社シチズン電子 | チップ型半導体及びその製造方法 |
| TW383508B (en) * | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
| JPH10144965A (ja) | 1996-11-11 | 1998-05-29 | Hamamatsu Photonics Kk | 光半導体装置及びその製造方法 |
| US6238599B1 (en) * | 1997-06-18 | 2001-05-29 | International Business Machines Corporation | High conductivity, high strength, lead-free, low cost, electrically conducting materials and applications |
| EP1004145B1 (de) * | 1997-07-29 | 2005-06-01 | Osram Opto Semiconductors GmbH | Optoelektronisches bauelement |
| JP3472450B2 (ja) | 1997-09-04 | 2003-12-02 | シャープ株式会社 | 発光装置 |
| US5869883A (en) * | 1997-09-26 | 1999-02-09 | Stanley Wang, President Pantronix Corp. | Packaging of semiconductor circuit in pre-molded plastic package |
| TW408497B (en) | 1997-11-25 | 2000-10-11 | Matsushita Electric Works Ltd | LED illuminating apparatus |
| JPH11163412A (ja) | 1997-11-25 | 1999-06-18 | Matsushita Electric Works Ltd | Ｌｅｄ照明装置 |
| DE19755734A1 (de) * | 1997-12-15 | 1999-06-24 | Siemens Ag | Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes |
| DE19803936A1 (de) * | 1998-01-30 | 1999-08-05 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Ausdehnungskompensiertes optoelektronisches Halbleiter-Bauelement, insbesondere UV-emittierende Leuchtdiode und Verfahren zu seiner Herstellung |
| JPH11298048A (ja) | 1998-04-15 | 1999-10-29 | Matsushita Electric Works Ltd | Ｌｅｄ実装基板 |
| JP2000049184A (ja) * | 1998-05-27 | 2000-02-18 | Hitachi Ltd | 半導体装置およびその製造方法 |
| US5959316A (en) * | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
| US6335548B1 (en) | 1999-03-15 | 2002-01-01 | Gentex Corporation | Semiconductor radiation emitter package |
| US6274924B1 (en) * | 1998-11-05 | 2001-08-14 | Lumileds Lighting, U.S. Llc | Surface mountable LED package |
| JP2000183407A (ja) * | 1998-12-16 | 2000-06-30 | Rohm Co Ltd | 光半導体装置 |
| JP2000208822A (ja) * | 1999-01-11 | 2000-07-28 | Matsushita Electronics Industry Corp | 半導体発光装置 |
| US6521916B2 (en) * | 1999-03-15 | 2003-02-18 | Gentex Corporation | Radiation emitter device having an encapsulant with different zones of thermal conductivity |
| US6457645B1 (en) * | 1999-04-13 | 2002-10-01 | Hewlett-Packard Company | Optical assembly having lens offset from optical axis |
| DE19918370B4 (de) | 1999-04-22 | 2006-06-08 | Osram Opto Semiconductors Gmbh | LED-Weißlichtquelle mit Linse |
| KR100335480B1 (ko) * | 1999-08-24 | 2002-05-04 | 김덕중 | 칩 패드가 방열 통로로 사용되는 리드프레임 및 이를 포함하는반도체 패키지 |
| JP2001144333A (ja) | 1999-11-10 | 2001-05-25 | Sharp Corp | 発光装置とその製造方法 |
| JP2001148514A (ja) | 1999-11-18 | 2001-05-29 | Matsushita Electric Works Ltd | 照明光源 |
| JP4125848B2 (ja) * | 1999-12-17 | 2008-07-30 | ローム株式会社 | ケース付チップ型発光装置 |
| US6559525B2 (en) * | 2000-01-13 | 2003-05-06 | Siliconware Precision Industries Co., Ltd. | Semiconductor package having heat sink at the outer surface |
| JP4944301B2 (ja) * | 2000-02-01 | 2012-05-30 | パナソニック株式会社 | 光電子装置およびその製造方法 |
| US6456766B1 (en) * | 2000-02-01 | 2002-09-24 | Cornell Research Foundation Inc. | Optoelectronic packaging |
| US6492725B1 (en) * | 2000-02-04 | 2002-12-10 | Lumileds Lighting, U.S., Llc | Concentrically leaded power semiconductor device package |
| JP2002093206A (ja) | 2000-09-18 | 2002-03-29 | Stanley Electric Co Ltd | Ｌｅｄ信号灯具 |
| JP2002103977A (ja) | 2000-09-29 | 2002-04-09 | Johnan Seisakusho Co Ltd | 車両のサンルーフ装置 |
| DE10051159C2 (de) * | 2000-10-16 | 2002-09-19 | Osram Opto Semiconductors Gmbh | LED-Modul, z.B. Weißlichtquelle |
| US6940704B2 (en) * | 2001-01-24 | 2005-09-06 | Gelcore, Llc | Semiconductor light emitting device |
| US6541800B2 (en) * | 2001-02-22 | 2003-04-01 | Weldon Technologies, Inc. | High power LED |
| JP2002299698A (ja) * | 2001-03-30 | 2002-10-11 | Sumitomo Electric Ind Ltd | 発光装置 |
| DE10117889A1 (de) | 2001-04-10 | 2002-10-24 | Osram Opto Semiconductors Gmbh | Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement sowie Verfahren zu dessen Herstellung |
| DE10118630A1 (de) * | 2001-04-12 | 2002-10-17 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Verfahren zur Herstellung eines optoelektronischen Halbleiter-Bauelements |
| US6429513B1 (en) * | 2001-05-25 | 2002-08-06 | Amkor Technology, Inc. | Active heat sink for cooling a semiconductor chip |
| USD465207S1 (en) * | 2001-06-08 | 2002-11-05 | Gem Services, Inc. | Leadframe matrix for a surface mount package |
| US6670648B2 (en) * | 2001-07-19 | 2003-12-30 | Rohm Co., Ltd. | Semiconductor light-emitting device having a reflective case |
| TW498516B (en) * | 2001-08-08 | 2002-08-11 | Siliconware Precision Industries Co Ltd | Manufacturing method for semiconductor package with heat sink |
| JP2003100986A (ja) * | 2001-09-26 | 2003-04-04 | Toshiba Corp | 半導体装置 |
| JP2003152227A (ja) * | 2001-11-14 | 2003-05-23 | Citizen Electronics Co Ltd | Ｌｅｄの色補正手段および色補正方法 |
| KR100439402B1 (ko) * | 2001-12-24 | 2004-07-09 | 삼성전기주식회사 | 발광다이오드 패키지 |
| US20030148670A1 (en) * | 2002-02-06 | 2003-08-07 | Henry Maxwell | Electrical wedge connector |
| JP4211359B2 (ja) | 2002-03-06 | 2009-01-21 | 日亜化学工業株式会社 | 半導体装置の製造方法 |
| JP4172196B2 (ja) | 2002-04-05 | 2008-10-29 | 豊田合成株式会社 | 発光ダイオード |
| US7122884B2 (en) * | 2002-04-16 | 2006-10-17 | Fairchild Semiconductor Corporation | Robust leaded molded packages and methods for forming the same |
| US7244965B2 (en) * | 2002-09-04 | 2007-07-17 | Cree Inc, | Power surface mount light emitting die package |
| US7692206B2 (en) | 2002-12-06 | 2010-04-06 | Cree, Inc. | Composite leadframe LED package and method of making the same |
| TW560813U (en) | 2003-03-06 | 2003-11-01 | Shang-Hua You | Improved LED seat |
-
2003
- 2003-11-25 US US10/721,654 patent/US7692206B2/en active Active
- 2003-12-03 EP EP10185249.9A patent/EP2270889B1/de not_active Expired - Lifetime
- 2003-12-03 EP EP10185206.9A patent/EP2284914B1/de not_active Expired - Lifetime
- 2003-12-03 JP JP2004559204A patent/JP4757495B2/ja not_active Expired - Lifetime
- 2003-12-03 DE DE60335905T patent/DE60335905D1/de not_active Expired - Lifetime
- 2003-12-03 EP EP03790215A patent/EP1568076B1/de not_active Expired - Lifetime
- 2003-12-03 AU AU2003293223A patent/AU2003293223A1/en not_active Abandoned
- 2003-12-03 AT AT03790215T patent/ATE497256T1/de not_active IP Right Cessation
- 2003-12-03 CN CNB2003801049369A patent/CN100385636C/zh not_active Expired - Lifetime
- 2003-12-03 WO PCT/US2003/038214 patent/WO2004053933A2/en active Application Filing
- 2003-12-03 CA CA002508133A patent/CA2508133A1/en not_active Abandoned
- 2003-12-03 KR KR1020057009879A patent/KR101141492B1/ko active IP Right Grant
- 2003-12-05 TW TW092134358A patent/TWI333230B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| AU2003293223A1 (en) | 2004-06-30 |
| EP2270889A3 (de) | 2011-02-02 |
| JP2006509372A (ja) | 2006-03-16 |
| EP1568076A4 (de) | 2007-06-06 |
| CN1720608A (zh) | 2006-01-11 |
| US7692206B2 (en) | 2010-04-06 |
| EP2284914A1 (de) | 2011-02-16 |
| EP1568076A2 (de) | 2005-08-31 |
| WO2004053933A2 (en) | 2004-06-24 |
| WO2004053933A3 (en) | 2004-09-16 |
| EP1568076B1 (de) | 2011-01-26 |
| JP4757495B2 (ja) | 2011-08-24 |
| EP2270889B1 (de) | 2016-03-30 |
| TWI333230B (en) | 2010-11-11 |
| KR20050084080A (ko) | 2005-08-26 |
| US20040126913A1 (en) | 2004-07-01 |
| AU2003293223A8 (en) | 2004-06-30 |
| ATE497256T1 (de) | 2011-02-15 |
| EP2270889A2 (de) | 2011-01-05 |
| KR101141492B1 (ko) | 2012-05-03 |
| CA2508133A1 (en) | 2004-06-24 |
| CN100385636C (zh) | 2008-04-30 |
| EP2284914B1 (de) | 2016-04-20 |
| TW200503048A (en) | 2005-01-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE60335905D1 (de) | LED-Baugruppe mit Leiterrahmen und zweiteiligem Kühlkörper und Herstellungsverfahren derselben | |
| ATE444568T1 (de) | Gehäuse für oberflächenmontierten lichtemissionschip hoher leistung | |
| ATE400896T1 (de) | Oberflächenmontiertes gehäuse für lichtemittierenden leistungschip | |
| US9666772B2 (en) | High powered light emitter packages with compact optics | |
| DE602005012259D1 (de) | Gehäuse mit lichtemittierender Hochleistungsdiode und Reflexionslinse, sowie zugehöriges Herstellungsverfahren | |
| US20060193130A1 (en) | LED lighting system | |
| JP2005538550A5 (de) | ||
| KR20080030584A (ko) | 반도체 발광 장치 패키지 구조 | |
| TW200616249A (en) | A low thermal resistance LED package | |
| US20090091934A1 (en) | High power LED module | |
| JP2004342791A (ja) | Ｌｅｄランプおよびｌｅｄ照明具 | |
| KR100665182B1 (ko) | 고출력 ｌｅｄ 패키지 및 그 제조방법 | |
| KR100579397B1 (ko) | 리드프레임과 직접 연결된 히트싱크를 채택하는 발광다이오드 패키지 | |
| KR20120001189A (ko) | 발광 다이오드 패키지 | |
| US20220102597A1 (en) | Light emitting devices having profiled side surfaces | |
| US8581278B2 (en) | Light-emitting diode packaging structure | |
| KR100797507B1 (ko) | 수직형 파워 엘이디 및 수평형 파워 엘이디의 방열구조 | |
| KR100878398B1 (ko) | 고출력 ｌｅｄ 패키지 및 그 제조방법 | |
| US11444227B2 (en) | Light emitting diode package with substrate configuration having enhanced structural integrity | |
| KR200430803Y1 (ko) | 수직형 파워 엘이디 및 수평형 파워 엘이디의 방열구조 | |
| KR100579388B1 (ko) | 나선홈을 구비하는 히트싱크를 채택하는 발광 다이오드패키지 | |
| KR20100028887A (ko) | 발광소자 패키지 |