DE60329713D1 - Schabloneartiges substrat und verfahren zu seiner herstellung - Google Patents
Schabloneartiges substrat und verfahren zu seiner herstellungInfo
- Publication number
- DE60329713D1 DE60329713D1 DE60329713T DE60329713T DE60329713D1 DE 60329713 D1 DE60329713 D1 DE 60329713D1 DE 60329713 T DE60329713 T DE 60329713T DE 60329713 T DE60329713 T DE 60329713T DE 60329713 D1 DE60329713 D1 DE 60329713D1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- good
- opto
- dislocation density
- resulting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title abstract 7
- 150000004767 nitrides Chemical class 0.000 abstract 2
- 238000000407 epitaxy Methods 0.000 abstract 1
- 239000007792 gaseous phase Substances 0.000 abstract 1
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 abstract 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 abstract 1
- 238000001451 molecular beam epitaxy Methods 0.000 abstract 1
- 238000000927 vapour-phase epitaxy Methods 0.000 abstract 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02389—Nitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02441—Group 14 semiconducting materials
- H01L21/0245—Silicon, silicon germanium, germanium
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02458—Nitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02516—Crystal orientation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02576—N-type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02579—P-type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02581—Transition metal or rare earth elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02623—Liquid deposition
- H01L21/02628—Liquid deposition using solutions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Semiconductor Lasers (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Adornments (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PL357709A PL225425B1 (pl) | 2002-12-11 | 2002-12-11 | Sposób wytwarzania złożonego podłoża standaryzowanego warstwą epitaksjalną (podłoża typu template) z objętościowego monokrystalicznego azotku zawierającego gal |
PL02357708A PL357708A1 (en) | 2002-12-11 | 2002-12-11 | Method of fabrication of epitaxial layer standardized substrate (template type substrates) from voluminal mono-crystalline aluminium nitride and nitride containing gallium for epitaxy of layers with high aluminium content as well as devices requiring efficient heat abstraction |
PL357707A PL225424B1 (pl) | 2002-12-11 | 2002-12-11 | Sposób wytwarzania podłoża typu template z objętościowego monokrystalicznego azotku zawierającego gal |
PL357696A PL225423B1 (pl) | 2002-12-11 | 2002-12-11 | Sposób wytwarzania podłoża standaryzowanego warstwą epitaksjalną ( podłoża typu template), z objętościowego monokrystalicznego azotku zawierającego gal |
PCT/JP2003/015905 WO2004053209A1 (en) | 2002-12-11 | 2003-12-11 | A template type substrate and a method of preparing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60329713D1 true DE60329713D1 (de) | 2009-11-26 |
Family
ID=32512483
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60329713T Expired - Lifetime DE60329713D1 (de) | 2002-12-11 | 2003-12-11 | Schabloneartiges substrat und verfahren zu seiner herstellung |
DE60331245T Expired - Lifetime DE60331245D1 (de) | 2002-12-11 | 2003-12-11 | Substrat für epitaxie und verfahren zu seiner herstellung |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60331245T Expired - Lifetime DE60331245D1 (de) | 2002-12-11 | 2003-12-11 | Substrat für epitaxie und verfahren zu seiner herstellung |
Country Status (11)
Country | Link |
---|---|
US (3) | US7387677B2 (de) |
EP (2) | EP1576210B1 (de) |
JP (2) | JP4860927B2 (de) |
KR (2) | KR101060073B1 (de) |
AT (2) | ATE445722T1 (de) |
AU (2) | AU2003285768A1 (de) |
DE (2) | DE60329713D1 (de) |
HK (1) | HK1083030A1 (de) |
PL (2) | PL224991B1 (de) |
TW (2) | TWI334229B (de) |
WO (2) | WO2004053210A1 (de) |
Families Citing this family (78)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2296189C2 (ru) * | 2001-06-06 | 2007-03-27 | АММОНО Сп.з о.о. | Способ и устройство для получения объемного монокристаллического галлийсодержащего нитрида (варианты) |
WO2003036771A1 (fr) * | 2001-10-26 | 2003-05-01 | Ammono Sp.Zo.O. | Laser a semi-conducteurs a base de nitrure et procede de production de ce laser |
US20060005763A1 (en) * | 2001-12-24 | 2006-01-12 | Crystal Is, Inc. | Method and apparatus for producing large, single-crystals of aluminum nitride |
US7638346B2 (en) * | 2001-12-24 | 2009-12-29 | Crystal Is, Inc. | Nitride semiconductor heterostructures and related methods |
US8545629B2 (en) | 2001-12-24 | 2013-10-01 | Crystal Is, Inc. | Method and apparatus for producing large, single-crystals of aluminum nitride |
PL225427B1 (pl) * | 2002-05-17 | 2017-04-28 | Ammono Spółka Z Ograniczoną Odpowiedzialnością | Struktura urządzenia emitującego światło, zwłaszcza do półprzewodnikowego urządzenia laserowego |
US20060138431A1 (en) * | 2002-05-17 | 2006-06-29 | Robert Dwilinski | Light emitting device structure having nitride bulk single crystal layer |
TWI334890B (en) * | 2002-12-11 | 2010-12-21 | Ammono Sp Zoo | Process for obtaining bulk mono-crystalline gallium-containing nitride, eliminating impurities from the obtained crystal and manufacturing substrates made of bulk mono-crystalline gallium-containing nitride |
PL224991B1 (pl) * | 2002-12-11 | 2017-02-28 | Ammono Spółka Z Ograniczoną Odpowiedzialnością | Podłoże do stosowania dla urządzeń opto-elektrycznych lub elektrycznych oraz sposób jego wytwarzania |
US7351994B2 (en) * | 2004-01-21 | 2008-04-01 | Taiwan Semiconductor Manufacturing Company | Noble high-k device |
PL1769105T3 (pl) | 2004-06-11 | 2014-11-28 | Ammono S A | Objętościowy monokrystaliczny azotek galu oraz sposób jego wytwarzania |
PL371405A1 (pl) * | 2004-11-26 | 2006-05-29 | Ammono Sp.Z O.O. | Sposób wytwarzania objętościowych monokryształów metodą wzrostu na zarodku |
US7772601B2 (en) * | 2005-02-04 | 2010-08-10 | Seoul Opto Device Co., Ltd. | Light emitting device having a plurality of light emitting cells and method of fabricating the same |
JP4563230B2 (ja) | 2005-03-28 | 2010-10-13 | 昭和電工株式会社 | AlGaN基板の製造方法 |
US20060288929A1 (en) * | 2005-06-10 | 2006-12-28 | Crystal Is, Inc. | Polar surface preparation of nitride substrates |
JP4277826B2 (ja) * | 2005-06-23 | 2009-06-10 | 住友電気工業株式会社 | 窒化物結晶、窒化物結晶基板、エピ層付窒化物結晶基板、ならびに半導体デバイスおよびその製造方法 |
US7759699B2 (en) | 2005-07-06 | 2010-07-20 | International Rectifier Corporation | III-nitride enhancement mode devices |
US20070069225A1 (en) * | 2005-09-27 | 2007-03-29 | Lumileds Lighting U.S., Llc | III-V light emitting device |
US8101020B2 (en) * | 2005-10-14 | 2012-01-24 | Ricoh Company, Ltd. | Crystal growth apparatus and manufacturing method of group III nitride crystal |
US8349077B2 (en) | 2005-11-28 | 2013-01-08 | Crystal Is, Inc. | Large aluminum nitride crystals with reduced defects and methods of making them |
WO2007065018A2 (en) * | 2005-12-02 | 2007-06-07 | Crystal Is, Inc. | Doped aluminum nitride crystals and methods of making them |
KR20080106402A (ko) | 2006-01-05 | 2008-12-05 | 일루미텍스, 인크. | Led로부터 광을 유도하기 위한 개별 광학 디바이스 |
JP2007277074A (ja) * | 2006-01-10 | 2007-10-25 | Ngk Insulators Ltd | 窒化アルミニウム単結晶の製造方法及び窒化アルミニウム単結晶 |
KR100714629B1 (ko) * | 2006-03-17 | 2007-05-07 | 삼성전기주식회사 | 질화물 반도체 단결정 기판, 그 제조방법 및 이를 이용한수직구조 질화물 발광소자 제조방법 |
KR101155061B1 (ko) * | 2006-03-22 | 2012-06-11 | 삼성코닝정밀소재 주식회사 | 질화물 반도체 기판 및 이의 제조방법 |
CN101454487B (zh) * | 2006-03-30 | 2013-01-23 | 晶体公司 | 氮化铝块状晶体的可控掺杂方法 |
US9034103B2 (en) | 2006-03-30 | 2015-05-19 | Crystal Is, Inc. | Aluminum nitride bulk crystals having high transparency to ultraviolet light and methods of forming them |
US20100095882A1 (en) * | 2008-10-16 | 2010-04-22 | Tadao Hashimoto | Reactor design for growing group iii nitride crystals and method of growing group iii nitride crystals |
US20070234946A1 (en) * | 2006-04-07 | 2007-10-11 | Tadao Hashimoto | Method for growing large surface area gallium nitride crystals in supercritical ammonia and lagre surface area gallium nitride crystals |
US8236267B2 (en) * | 2008-06-04 | 2012-08-07 | Sixpoint Materials, Inc. | High-pressure vessel for growing group III nitride crystals and method of growing group III nitride crystals using high-pressure vessel and group III nitride crystal |
US9803293B2 (en) * | 2008-02-25 | 2017-10-31 | Sixpoint Materials, Inc. | Method for producing group III-nitride wafers and group III-nitride wafers |
US8764903B2 (en) | 2009-05-05 | 2014-07-01 | Sixpoint Materials, Inc. | Growth reactor for gallium-nitride crystals using ammonia and hydrogen chloride |
EP2041794A4 (de) * | 2006-06-21 | 2010-07-21 | Univ California | OPTOELEKTRONISCHE UND ELEKTRONISCHE BAUELEMENTE UNTER VERWENDUNG EINES N-FACE- ODER M-PLANE-GaN-SUBSTRATS AUS AMMONOTHERMALER ZÜCHTUNG |
EP2070123A2 (de) | 2006-10-02 | 2009-06-17 | Illumitex, Inc. | Led-system und -verfahren |
EP2100990A1 (de) | 2006-10-16 | 2009-09-16 | Mitsubishi Chemical Corporation | Verfahren zur herstellung eines nitridhalbleiters, mittel zur erhöhung der kristallwachstumsrate, nitrideinkristall, wafer und vorrichtung |
JP5125098B2 (ja) * | 2006-12-26 | 2013-01-23 | 信越半導体株式会社 | 窒化物半導体自立基板の製造方法 |
JP2008160025A (ja) * | 2006-12-26 | 2008-07-10 | Sharp Corp | 窒化物半導体発光素子 |
US8323406B2 (en) * | 2007-01-17 | 2012-12-04 | Crystal Is, Inc. | Defect reduction in seeded aluminum nitride crystal growth |
US9771666B2 (en) | 2007-01-17 | 2017-09-26 | Crystal Is, Inc. | Defect reduction in seeded aluminum nitride crystal growth |
US8080833B2 (en) * | 2007-01-26 | 2011-12-20 | Crystal Is, Inc. | Thick pseudomorphic nitride epitaxial layers |
WO2008094464A2 (en) * | 2007-01-26 | 2008-08-07 | Crystal Is, Inc. | Thick pseudomorphic nitride epitaxial layers |
US8269251B2 (en) | 2007-05-17 | 2012-09-18 | Mitsubishi Chemical Corporation | Method for producing group III nitride semiconductor crystal, group III nitride semiconductor substrate, and semiconductor light-emitting device |
US8088220B2 (en) * | 2007-05-24 | 2012-01-03 | Crystal Is, Inc. | Deep-eutectic melt growth of nitride crystals |
TWI480435B (zh) | 2007-09-19 | 2015-04-11 | Univ California | 氮化鎵塊狀晶體(bulk crystals)及其生長方法 |
EP2240968A1 (de) | 2008-02-08 | 2010-10-20 | Illumitex, Inc. | System und verfahren zur bildung einer emitterschicht |
JP2011523931A (ja) * | 2008-05-28 | 2011-08-25 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 低濃度アルカリ金属保有の六方晶系ウルツ鉱型エピタキシャル層およびその生成方法 |
TWI460322B (zh) * | 2008-06-04 | 2014-11-11 | Sixpoint Materials Inc | 藉由氨熱生長法自初始第iii族氮化物種產生具改良結晶度之第iii族氮化物晶體之方法 |
WO2009151642A1 (en) | 2008-06-12 | 2009-12-17 | Sixpoint Materials, Inc. | Method for testing group-iii nitride wafers and group iii-nitride wafers with test data |
JP5177084B2 (ja) * | 2008-08-06 | 2013-04-03 | 住友電気工業株式会社 | 波長変換素子および波長変換素子の製造方法 |
KR20110097813A (ko) * | 2008-11-07 | 2011-08-31 | 더 리전츠 오브 더 유니버시티 오브 캘리포니아 | Ⅲ족 질화물 결정들의 암모노열 성장을 위한 신규한 용기 설계 및 소스 물질과 씨드 결정들의 상기 용기에 대한 상대적인 배치 |
WO2010060034A1 (en) * | 2008-11-24 | 2010-05-27 | Sixpoint Materials, Inc. | METHODS FOR PRODUCING GaN NUTRIENT FOR AMMONOTHERMAL GROWTH |
JP4867981B2 (ja) * | 2008-12-04 | 2012-02-01 | 住友電気工業株式会社 | GaN結晶の成長方法 |
TW201034256A (en) | 2008-12-11 | 2010-09-16 | Illumitex Inc | Systems and methods for packaging light-emitting diode devices |
US20100314551A1 (en) * | 2009-06-11 | 2010-12-16 | Bettles Timothy J | In-line Fluid Treatment by UV Radiation |
US8449128B2 (en) | 2009-08-20 | 2013-05-28 | Illumitex, Inc. | System and method for a lens and phosphor layer |
US8585253B2 (en) | 2009-08-20 | 2013-11-19 | Illumitex, Inc. | System and method for color mixing lens array |
JP5310534B2 (ja) | 2009-12-25 | 2013-10-09 | 豊田合成株式会社 | Iii族窒化物半導体の製造方法 |
JPWO2011108640A1 (ja) * | 2010-03-04 | 2013-06-27 | Jx日鉱日石金属株式会社 | 結晶成長装置、窒化物系化合物半導体結晶の製造方法及び窒化物系化合物半導体結晶 |
PL224995B1 (pl) | 2010-04-06 | 2017-02-28 | Inst Wysokich Ciśnień Polskiej Akademii Nauk | Podłoże do wzrostu epitaksjalnego |
JP5806734B2 (ja) | 2010-06-30 | 2015-11-10 | クリスタル アイエス, インコーポレーテッドCrystal Is, Inc. | 熱勾配制御による窒化アルミニウム大単結晶成長 |
US8436363B2 (en) | 2011-02-03 | 2013-05-07 | Soitec | Metallic carrier for layer transfer and methods for forming the same |
US9142412B2 (en) | 2011-02-03 | 2015-09-22 | Soitec | Semiconductor devices including substrate layers and overlying semiconductor layers having closely matching coefficients of thermal expansion, and related methods |
US9082948B2 (en) | 2011-02-03 | 2015-07-14 | Soitec | Methods of fabricating semiconductor structures using thermal spray processes, and semiconductor structures fabricated using such methods |
US8962359B2 (en) | 2011-07-19 | 2015-02-24 | Crystal Is, Inc. | Photon extraction from nitride ultraviolet light-emitting devices |
US8960657B2 (en) | 2011-10-05 | 2015-02-24 | Sunedison, Inc. | Systems and methods for connecting an ingot to a wire saw |
JP5888208B2 (ja) * | 2011-11-18 | 2016-03-16 | 三菱化学株式会社 | 窒化物結晶の製造方法 |
CN103243389B (zh) | 2012-02-08 | 2016-06-08 | 丰田合成株式会社 | 制造第III族氮化物半导体单晶的方法及制造GaN衬底的方法 |
JP5754391B2 (ja) * | 2012-02-08 | 2015-07-29 | 豊田合成株式会社 | Iii族窒化物半導体結晶の製造方法 |
JP2014027092A (ja) * | 2012-07-26 | 2014-02-06 | Sharp Corp | 半導体発光素子 |
JP6137197B2 (ja) | 2012-12-17 | 2017-05-31 | 三菱化学株式会社 | 窒化ガリウム基板、および、窒化物半導体結晶の製造方法 |
CN108511567A (zh) | 2013-03-15 | 2018-09-07 | 晶体公司 | 与赝配电子和光电器件的平面接触 |
JP5999443B2 (ja) | 2013-06-07 | 2016-09-28 | 豊田合成株式会社 | III 族窒化物半導体結晶の製造方法およびGaN基板の製造方法 |
JP6015566B2 (ja) | 2013-06-11 | 2016-10-26 | 豊田合成株式会社 | III 族窒化物半導体のエッチング方法およびIII 族窒化物半導体結晶の製造方法およびGaN基板の製造方法 |
JP6516738B2 (ja) | 2013-07-11 | 2019-05-22 | シックスポイント マテリアルズ, インコーポレイテッド | Iii族窒化物半導体を用いた電子デバイスおよびその製造方法、および該電子デバイスを製作するためのエピタキシャル多層ウエハ |
JP2015115343A (ja) * | 2013-12-09 | 2015-06-22 | シャープ株式会社 | 窒化物半導体素子の製造方法 |
JP6264990B2 (ja) * | 2014-03-26 | 2018-01-24 | 日亜化学工業株式会社 | 窒化物半導体基板の製造方法 |
CN108023001B (zh) * | 2017-11-30 | 2020-03-10 | 武汉大学 | 蚀刻阻挡层结构、含其的外延片及该外延片的制作方法 |
US11087975B1 (en) * | 2018-07-02 | 2021-08-10 | United States Of America As Represented By The Secretary Of The Air Force | Method for fabrication of orientation-patterned templates on common substrates |
Family Cites Families (136)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3922703A (en) * | 1974-04-03 | 1975-11-25 | Rca Corp | Electroluminescent semiconductor device |
FR2514566A1 (fr) * | 1982-02-02 | 1983-04-15 | Bagratishvili Givi | Dispositif emetteur de lumiere semi-conducteur a base de nitrure de gallium et procede de fabrication dudit dispositif |
JPS6065798A (ja) | 1983-09-19 | 1985-04-15 | Toyota Central Res & Dev Lab Inc | 窒化ガリウム単結晶の成長方法 |
CN1014535B (zh) | 1988-12-30 | 1991-10-30 | 中国科学院物理研究所 | 利用改进的矿化剂生长磷酸钛氧钾单晶的方法 |
US5096860A (en) * | 1990-05-25 | 1992-03-17 | Alcan International Limited | Process for producing unagglomerated single crystals of aluminum nitride |
KR920004181B1 (ko) * | 1990-09-13 | 1992-05-30 | 한국과학기술연구원 | 입방정질화붕소의 제조방법 |
US5190738A (en) * | 1991-06-17 | 1993-03-02 | Alcan International Limited | Process for producing unagglomerated single crystals of aluminum nitride |
US5306662A (en) * | 1991-11-08 | 1994-04-26 | Nichia Chemical Industries, Ltd. | Method of manufacturing P-type compound semiconductor |
US5456204A (en) * | 1993-05-28 | 1995-10-10 | Alfa Quartz, C.A. | Filtering flow guide for hydrothermal crystal growth |
GB9412849D0 (en) * | 1993-08-02 | 1994-08-17 | Marketing Store Ltd | Package |
PL173917B1 (pl) * | 1993-08-10 | 1998-05-29 | Ct Badan Wysokocisnieniowych P | Sposób wytwarzania krystalicznej struktury wielowarstwowej |
CA2169927A1 (en) * | 1993-09-17 | 1995-03-23 | Kevin Brown | Pre-rinse for phosphating metal surfaces |
US5679152A (en) * | 1994-01-27 | 1997-10-21 | Advanced Technology Materials, Inc. | Method of making a single crystals Ga*N article |
WO1995027815A1 (fr) | 1994-04-08 | 1995-10-19 | Japan Energy Corporation | Procede de tirage d'un cristal semi-conducteur constitue par un compose de nitrure de gallium et dispositif semi-conducteur a composes de nitrure de gallium |
US5599520A (en) * | 1994-11-03 | 1997-02-04 | Garces; Juan M. | Synthesis of crystalline porous solids in ammonia |
US5777350A (en) | 1994-12-02 | 1998-07-07 | Nichia Chemical Industries, Ltd. | Nitride semiconductor light-emitting device |
US5670798A (en) * | 1995-03-29 | 1997-09-23 | North Carolina State University | Integrated heterostructures of Group III-V nitride semiconductor materials including epitaxial ohmic contact non-nitride buffer layer and methods of fabricating same |
US5679965A (en) * | 1995-03-29 | 1997-10-21 | North Carolina State University | Integrated heterostructures of Group III-V nitride semiconductor materials including epitaxial ohmic contact, non-nitride buffer layer and methods of fabricating same |
JP3728332B2 (ja) * | 1995-04-24 | 2005-12-21 | シャープ株式会社 | 化合物半導体発光素子 |
CN1132253C (zh) * | 1995-08-31 | 2003-12-24 | 株式会社东芝 | 氮化镓基半导体发光元件及其制造方法 |
DE69633203T2 (de) * | 1995-09-18 | 2005-09-01 | Hitachi, Ltd. | Halbleiterlaservorrichtungen |
AU7346396A (en) | 1995-10-13 | 1997-04-30 | Centrum Badan Wysokocisnieniowych | Method of manufacturing epitaxial layers of gan or ga(a1,in)n on single crystal gan and mixed ga(a1,in)n substrates |
JP3563869B2 (ja) * | 1996-03-25 | 2004-09-08 | トヨタ自動車株式会社 | エンジン出力制御装置 |
CN1065289C (zh) | 1996-07-22 | 2001-05-02 | 中国科学院物理研究所 | 一种制备掺杂钒酸盐单晶的水热生长方法 |
JP3179346B2 (ja) * | 1996-08-27 | 2001-06-25 | 松下電子工業株式会社 | 窒化ガリウム結晶の製造方法 |
JPH1084161A (ja) * | 1996-09-06 | 1998-03-31 | Sumitomo Electric Ind Ltd | 半導体レーザ及びその製造方法 |
US6031858A (en) * | 1996-09-09 | 2000-02-29 | Kabushiki Kaisha Toshiba | Semiconductor laser and method of fabricating same |
US6542526B1 (en) * | 1996-10-30 | 2003-04-01 | Hitachi, Ltd. | Optical information processor and semiconductor light emitting device suitable for the same |
JPH111399A (ja) | 1996-12-05 | 1999-01-06 | Lg Electron Inc | 窒化ガリウム半導体単結晶基板の製造方法並びにその基板を用いた窒化ガリウムダイオード |
CA2276335C (en) * | 1997-01-09 | 2006-04-11 | Nichia Chemical Industries, Ltd. | Nitride semiconductor device |
US6677619B1 (en) * | 1997-01-09 | 2004-01-13 | Nichia Chemical Industries, Ltd. | Nitride semiconductor device |
US5868837A (en) * | 1997-01-17 | 1999-02-09 | Cornell Research Foundation, Inc. | Low temperature method of preparing GaN single crystals |
PL184902B1 (pl) * | 1997-04-04 | 2003-01-31 | Centrum Badan Wysokocisnieniowych Pan | Sposób usuwania nierówności i obszarów silnie zdefektowanych z powierzchni kryształów i warstw epitaksjalnych GaN i Ga AL In N |
JP3491492B2 (ja) * | 1997-04-09 | 2004-01-26 | 松下電器産業株式会社 | 窒化ガリウム結晶の製造方法 |
ATE550461T1 (de) * | 1997-04-11 | 2012-04-15 | Nichia Corp | Wachstumsmethode für einen nitrid-halbleiter |
US5888389A (en) * | 1997-04-24 | 1999-03-30 | Hydroprocessing, L.L.C. | Apparatus for oxidizing undigested wastewater sludges |
PL183687B1 (pl) * | 1997-06-06 | 2002-06-28 | Centrum Badan | Sposób wytwarzania półprzewodnikowych związków grupy A-B o przewodnictwie elektrycznym typu p i typu n |
GB2333520B (en) | 1997-06-11 | 2000-04-26 | Hitachi Cable | GaN crystal growth method |
TW519551B (en) | 1997-06-11 | 2003-02-01 | Hitachi Cable | Methods of fabricating nitride crystals and nitride crystals obtained therefrom |
US6270569B1 (en) * | 1997-06-11 | 2001-08-07 | Hitachi Cable Ltd. | Method of fabricating nitride crystal, mixture, liquid phase growth method, nitride crystal, nitride crystal powders, and vapor phase growth method |
US6593589B1 (en) * | 1998-01-30 | 2003-07-15 | The University Of New Mexico | Semiconductor nitride structures |
US6249534B1 (en) | 1998-04-06 | 2001-06-19 | Matsushita Electronics Corporation | Nitride semiconductor laser device |
TW428331B (en) * | 1998-05-28 | 2001-04-01 | Sumitomo Electric Industries | Gallium nitride single crystal substrate and method of producing the same |
JPH11340576A (ja) | 1998-05-28 | 1999-12-10 | Sumitomo Electric Ind Ltd | 窒化ガリウム系半導体デバイス |
JP4005701B2 (ja) * | 1998-06-24 | 2007-11-14 | シャープ株式会社 | 窒素化合物半導体膜の形成方法および窒素化合物半導体素子 |
JP2000031533A (ja) | 1998-07-14 | 2000-01-28 | Toshiba Corp | 半導体発光素子 |
TW413956B (en) * | 1998-07-28 | 2000-12-01 | Sumitomo Electric Industries | Fluorescent substrate LED |
US6335546B1 (en) * | 1998-07-31 | 2002-01-01 | Sharp Kabushiki Kaisha | Nitride semiconductor structure, method for producing a nitride semiconductor structure, and light emitting device |
JP2000091637A (ja) * | 1998-09-07 | 2000-03-31 | Rohm Co Ltd | 半導体発光素子の製法 |
US6423984B1 (en) * | 1998-09-10 | 2002-07-23 | Toyoda Gosei Co., Ltd. | Light-emitting semiconductor device using gallium nitride compound semiconductor |
US6252261B1 (en) * | 1998-09-30 | 2001-06-26 | Nec Corporation | GaN crystal film, a group III element nitride semiconductor wafer and a manufacturing process therefor |
JP3592553B2 (ja) * | 1998-10-15 | 2004-11-24 | 株式会社東芝 | 窒化ガリウム系半導体装置 |
EP1003227B1 (de) * | 1998-11-06 | 2010-01-13 | Panasonic Corporation | Halbleitervorrichtung |
TW498102B (en) * | 1998-12-28 | 2002-08-11 | Futaba Denshi Kogyo Kk | A process for preparing GaN fluorescent substance |
US20020096674A1 (en) * | 1999-01-08 | 2002-07-25 | Cho Hak Dong | Nucleation layer growth and lift-up of process for GaN wafer |
US6372041B1 (en) * | 1999-01-08 | 2002-04-16 | Gan Semiconductor Inc. | Method and apparatus for single crystal gallium nitride (GaN) bulk synthesis |
JP2000216494A (ja) | 1999-01-20 | 2000-08-04 | Sanyo Electric Co Ltd | 半導体発光素子およびその製造方法 |
EP1024524A2 (de) | 1999-01-27 | 2000-08-02 | Matsushita Electric Industrial Co., Ltd. | Abscheidung von dielektrischen Schichten unter Verwendung von überkritischem CO2 |
US6177057B1 (en) * | 1999-02-09 | 2001-01-23 | The United States Of America As Represented By The Secretary Of The Navy | Process for preparing bulk cubic gallium nitride |
JP3399392B2 (ja) * | 1999-02-19 | 2003-04-21 | 株式会社村田製作所 | 半導体発光素子、およびその製造方法 |
EP1168539B1 (de) | 1999-03-04 | 2009-12-16 | Nichia Corporation | Nitridhalbleiterlaserelement |
JP3957918B2 (ja) | 1999-05-17 | 2007-08-15 | 独立行政法人科学技術振興機構 | 窒化ガリウム単結晶の育成方法 |
US6592663B1 (en) * | 1999-06-09 | 2003-07-15 | Ricoh Company Ltd. | Production of a GaN bulk crystal substrate and a semiconductor device formed on a GaN bulk crystal substrate |
JP4329229B2 (ja) | 1999-06-30 | 2009-09-09 | 住友電気工業株式会社 | Iii−v族窒化物半導体の成長方法および気相成長装置 |
CA2313155C (en) * | 1999-06-30 | 2003-09-30 | Sumitomo Electric Industries, Ltd. | Group iii-v nitride semiconductor growth method and vapor phase growth apparatus |
FR2796657B1 (fr) * | 1999-07-20 | 2001-10-26 | Thomson Csf | Procede de synthese de materiaux massifs monocristallins en nitrures d'elements de la colonne iii du tableau de la classification periodique |
JP3968920B2 (ja) * | 1999-08-10 | 2007-08-29 | 双葉電子工業株式会社 | 蛍光体 |
JP4646359B2 (ja) | 1999-09-09 | 2011-03-09 | シャープ株式会社 | 窒化物半導体発光素子の製造方法 |
JP2001085737A (ja) * | 1999-09-10 | 2001-03-30 | Sharp Corp | 窒化物半導体発光素子 |
US6265322B1 (en) | 1999-09-21 | 2001-07-24 | Agere Systems Guardian Corp. | Selective growth process for group III-nitride-based semiconductors |
JP4145437B2 (ja) | 1999-09-28 | 2008-09-03 | 住友電気工業株式会社 | 単結晶GaNの結晶成長方法及び単結晶GaN基板の製造方法と単結晶GaN基板 |
CN1113988C (zh) | 1999-09-29 | 2003-07-09 | 中国科学院物理研究所 | 一种氮化镓单晶的热液生长方法 |
US6398867B1 (en) | 1999-10-06 | 2002-06-04 | General Electric Company | Crystalline gallium nitride and method for forming crystalline gallium nitride |
EP1104031B1 (de) * | 1999-11-15 | 2012-04-11 | Panasonic Corporation | Nitrid-Halbleiterlaserdiode und deren Herstellungsverfahren |
US6653663B2 (en) * | 1999-12-06 | 2003-11-25 | Matsushita Electric Industrial Co., Ltd. | Nitride semiconductor device |
JP2001168385A (ja) | 1999-12-06 | 2001-06-22 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体素子及びiii族窒化物系化合物半導体発光素子 |
JP2001185718A (ja) * | 1999-12-24 | 2001-07-06 | Hitachi Cable Ltd | 窒化ガリウム系化合物半導体を用いた高電子移動度トランジスタ用エピタキシャルウェハの製造方法 |
US7315599B1 (en) * | 1999-12-29 | 2008-01-01 | Intel Corporation | Skew correction circuit |
US6355497B1 (en) | 2000-01-18 | 2002-03-12 | Xerox Corporation | Removable large area, low defect density films for led and laser diode growth |
JP3335974B2 (ja) | 2000-01-24 | 2002-10-21 | 星和電機株式会社 | 窒化ガリウム系半導体発光素子及びその製造方法 |
JP4429459B2 (ja) | 2000-03-03 | 2010-03-10 | 古河電気工業株式会社 | 高抵抗GaN結晶層の製造方法 |
US20010015437A1 (en) * | 2000-01-25 | 2001-08-23 | Hirotatsu Ishii | GaN field-effect transistor, inverter device, and production processes therefor |
US6447604B1 (en) * | 2000-03-13 | 2002-09-10 | Advanced Technology Materials, Inc. | Method for achieving improved epitaxy quality (surface texture and defect density) on free-standing (aluminum, indium, gallium) nitride ((al,in,ga)n) substrates for opto-electronic and electronic devices |
US6596079B1 (en) | 2000-03-13 | 2003-07-22 | Advanced Technology Materials, Inc. | III-V nitride substrate boule and method of making and using the same |
JP3946427B2 (ja) | 2000-03-29 | 2007-07-18 | 株式会社東芝 | エピタキシャル成長用基板の製造方法及びこのエピタキシャル成長用基板を用いた半導体装置の製造方法 |
WO2001080311A1 (en) * | 2000-04-17 | 2001-10-25 | Virginia Commonwealth University | Defect reduction in gan and related materials |
JP2001339121A (ja) * | 2000-05-29 | 2001-12-07 | Sharp Corp | 窒化物半導体発光素子とそれを含む光学装置 |
GB2363518A (en) | 2000-06-17 | 2001-12-19 | Sharp Kk | A method of growing a nitride layer on a GaN substrate |
US6693935B2 (en) * | 2000-06-20 | 2004-02-17 | Sony Corporation | Semiconductor laser |
JP2002016285A (ja) * | 2000-06-27 | 2002-01-18 | National Institute Of Advanced Industrial & Technology | 半導体発光素子 |
US6586762B2 (en) * | 2000-07-07 | 2003-07-01 | Nichia Corporation | Nitride semiconductor device with improved lifetime and high output power |
JP3968968B2 (ja) * | 2000-07-10 | 2007-08-29 | 住友電気工業株式会社 | 単結晶GaN基板の製造方法 |
EP1176120A1 (de) * | 2000-07-28 | 2002-01-30 | Japan Pionics Co., Ltd. | Verfahren zur Reinigung von Ammonia |
JP4190711B2 (ja) * | 2000-08-31 | 2008-12-03 | 株式会社リコー | Iii族窒化物結晶の結晶製造方法および結晶製造装置 |
JP4154558B2 (ja) * | 2000-09-01 | 2008-09-24 | 日本電気株式会社 | 半導体装置 |
US6858882B2 (en) * | 2000-09-08 | 2005-02-22 | Sharp Kabushiki Kaisha | Nitride semiconductor light-emitting device and optical device including the same |
JP4416297B2 (ja) * | 2000-09-08 | 2010-02-17 | シャープ株式会社 | 窒化物半導体発光素子、ならびにそれを使用した発光装置および光ピックアップ装置 |
JP2002094189A (ja) * | 2000-09-14 | 2002-03-29 | Sharp Corp | 窒化物半導体レーザ素子およびそれを用いた光学装置 |
JP2002134416A (ja) | 2000-10-19 | 2002-05-10 | Ricoh Co Ltd | p型3族窒化物の結晶成長方法および製造方法、並びに半導体素子 |
US7053413B2 (en) * | 2000-10-23 | 2006-05-30 | General Electric Company | Homoepitaxial gallium-nitride-based light emitting device and method for producing |
US6936488B2 (en) | 2000-10-23 | 2005-08-30 | General Electric Company | Homoepitaxial gallium-nitride-based light emitting device and method for producing |
JP4063520B2 (ja) * | 2000-11-30 | 2008-03-19 | 日本碍子株式会社 | 半導体発光素子 |
KR100831751B1 (ko) | 2000-11-30 | 2008-05-23 | 노쓰 캐롤라이나 스테이트 유니버시티 | M'n 물의 제조 방법 및 장치 |
JP4003413B2 (ja) | 2000-12-11 | 2007-11-07 | 日亜化学工業株式会社 | 13族窒化物結晶の製造方法 |
JP3785566B2 (ja) | 2001-03-19 | 2006-06-14 | 株式会社日鉱マテリアルズ | GaN系化合物半導体結晶の製造方法 |
US6806508B2 (en) * | 2001-04-20 | 2004-10-19 | General Electic Company | Homoepitaxial gallium nitride based photodetector and method of producing |
JP4633962B2 (ja) | 2001-05-18 | 2011-02-16 | 日亜化学工業株式会社 | 窒化物半導体基板の製造方法 |
US6734530B2 (en) | 2001-06-06 | 2004-05-11 | Matsushita Electric Industries Co., Ltd. | GaN-based compound semiconductor EPI-wafer and semiconductor element using the same |
RU2296189C2 (ru) * | 2001-06-06 | 2007-03-27 | АММОНО Сп.з о.о. | Способ и устройство для получения объемного монокристаллического галлийсодержащего нитрида (варианты) |
PL207400B1 (pl) | 2001-06-06 | 2010-12-31 | Ammono Społka Z Ograniczoną Odpowiedzialnością | Sposób i urządzenie do otrzymywania objętościowego monokryształu azotku zawierającego gal |
PL350375A1 (en) | 2001-10-26 | 2003-05-05 | Ammono Sp Z Oo | Epitaxial layer substrate |
US6488767B1 (en) * | 2001-06-08 | 2002-12-03 | Advanced Technology Materials, Inc. | High surface quality GaN wafer and method of fabricating same |
JP2002009392A (ja) | 2001-06-22 | 2002-01-11 | Matsushita Electric Ind Co Ltd | 半導体発光素子およびその製造方法 |
US6562466B2 (en) | 2001-07-02 | 2003-05-13 | Essilor International Compagnie Generale D'optique | Process for transferring a coating onto a surface of a lens blank |
WO2003036771A1 (fr) * | 2001-10-26 | 2003-05-01 | Ammono Sp.Zo.O. | Laser a semi-conducteurs a base de nitrure et procede de production de ce laser |
KR100904501B1 (ko) * | 2001-10-26 | 2009-06-25 | 암모노 에스피. 제트오. 오. | 에피택시용 기판 |
US6949140B2 (en) | 2001-12-05 | 2005-09-27 | Ricoh Company, Ltd. | Crystal growth method, crystal growth apparatus, group-III nitride crystal and group-III nitride semiconductor device |
US7097707B2 (en) * | 2001-12-31 | 2006-08-29 | Cree, Inc. | GaN boule grown from liquid melt using GaN seed wafers |
US20030209191A1 (en) | 2002-05-13 | 2003-11-13 | Purdy Andrew P. | Ammonothermal process for bulk synthesis and growth of cubic GaN |
PL225427B1 (pl) | 2002-05-17 | 2017-04-28 | Ammono Spółka Z Ograniczoną Odpowiedzialnością | Struktura urządzenia emitującego światło, zwłaszcza do półprzewodnikowego urządzenia laserowego |
US20060138431A1 (en) | 2002-05-17 | 2006-06-29 | Robert Dwilinski | Light emitting device structure having nitride bulk single crystal layer |
TWI274735B (en) * | 2002-05-17 | 2007-03-01 | Ammono Sp Zoo | Bulk single crystal production facility employing supercritical ammonia |
KR20050054482A (ko) | 2002-06-26 | 2005-06-10 | 암모노 에스피. 제트오. 오. | 질화물 반도체 레이저 디바이스 및 그의 성능을향상시키기 위한 방법 |
CN100339512C (zh) * | 2002-06-26 | 2007-09-26 | 波兰商艾蒙诺公司 | 获得大单晶含镓氮化物的方法的改进 |
US7099073B2 (en) * | 2002-09-27 | 2006-08-29 | Lucent Technologies Inc. | Optical frequency-converters based on group III-nitrides |
TWI334890B (en) | 2002-12-11 | 2010-12-21 | Ammono Sp Zoo | Process for obtaining bulk mono-crystalline gallium-containing nitride, eliminating impurities from the obtained crystal and manufacturing substrates made of bulk mono-crystalline gallium-containing nitride |
US7314517B2 (en) | 2002-12-11 | 2008-01-01 | Ammono Sp. Z.O.O. | Process for obtaining bulk mono-crystalline gallium-containing nitride |
PL224991B1 (pl) * | 2002-12-11 | 2017-02-28 | Ammono Spółka Z Ograniczoną Odpowiedzialnością | Podłoże do stosowania dla urządzeń opto-elektrycznych lub elektrycznych oraz sposób jego wytwarzania |
EP1616981A4 (de) | 2003-04-03 | 2009-06-03 | Tokyo Denpa Kk | Zinkoxid-einkristall |
PL1769105T3 (pl) | 2004-06-11 | 2014-11-28 | Ammono S A | Objętościowy monokrystaliczny azotek galu oraz sposób jego wytwarzania |
JP4579294B2 (ja) | 2004-06-11 | 2010-11-10 | アンモノ・スプウカ・ジ・オグラニチョノン・オドポヴィエドニアウノシツィオン | 第13族元素窒化物の層から製造される高電子移動度トランジスタ(hemt)およびその製造方法 |
PL371405A1 (pl) | 2004-11-26 | 2006-05-29 | Ammono Sp.Z O.O. | Sposób wytwarzania objętościowych monokryształów metodą wzrostu na zarodku |
US7704324B2 (en) | 2005-01-25 | 2010-04-27 | General Electric Company | Apparatus for processing materials in supercritical fluids and methods thereof |
US7803344B2 (en) | 2006-10-25 | 2010-09-28 | The Regents Of The University Of California | Method for growing group III-nitride crystals in a mixture of supercritical ammonia and nitrogen, and group III-nitride crystals grown thereby |
US20070234946A1 (en) | 2006-04-07 | 2007-10-11 | Tadao Hashimoto | Method for growing large surface area gallium nitride crystals in supercritical ammonia and lagre surface area gallium nitride crystals |
TWI480435B (zh) | 2007-09-19 | 2015-04-11 | Univ California | 氮化鎵塊狀晶體(bulk crystals)及其生長方法 |
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