DE60317080D1 - Verfahren und vorrichtung zum elektromechanischen und/oder elektrochemisch-mechanischen entfernen von leitendem material von einem mikroelektronischen substrat - Google Patents

Verfahren und vorrichtung zum elektromechanischen und/oder elektrochemisch-mechanischen entfernen von leitendem material von einem mikroelektronischen substrat

Info

Publication number
DE60317080D1
DE60317080D1 DE60317080T DE60317080T DE60317080D1 DE 60317080 D1 DE60317080 D1 DE 60317080D1 DE 60317080 T DE60317080 T DE 60317080T DE 60317080 T DE60317080 T DE 60317080T DE 60317080 D1 DE60317080 D1 DE 60317080D1
Authority
DE
Germany
Prior art keywords
microelectronic substrate
electrodes
support member
pad portion
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60317080T
Other languages
English (en)
Other versions
DE60317080T2 (de
Inventor
Whonchee Lee
Scott G Meikle
Scott E Moore
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micron Technology Inc
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Publication of DE60317080D1 publication Critical patent/DE60317080D1/de
Application granted granted Critical
Publication of DE60317080T2 publication Critical patent/DE60317080T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23HWORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00Combined machining
    • B23H5/06Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08Electrolytic grinding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00Electrolytic etching or polishing
    • C25F3/02Etching
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
DE60317080T 2002-08-29 2003-08-27 Verfahren und vorrichtung zum elektromechanischen und/oder elektrochemisch-mechanischen entfernen von leitendem material von einem mikroelektronischen substrat Expired - Lifetime DE60317080T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US230970 2002-08-29
US10/230,970 US7220166B2 (en) 2000-08-30 2002-08-29 Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
PCT/US2003/027181 WO2004020148A1 (en) 2002-08-29 2003-08-27 Method and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate

Publications (2)

Publication Number Publication Date
DE60317080D1 true DE60317080D1 (de) 2007-12-06
DE60317080T2 DE60317080T2 (de) 2008-08-14

Family

ID=31976643

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60317080T Expired - Lifetime DE60317080T2 (de) 2002-08-29 2003-08-27 Verfahren und vorrichtung zum elektromechanischen und/oder elektrochemisch-mechanischen entfernen von leitendem material von einem mikroelektronischen substrat
DE60329872T Expired - Lifetime DE60329872D1 (de) 2002-08-29 2003-08-27 Verfahren und Vorrichtung zur elektromechanischen und/oder elektrisch-chemisch-mechanischen Entfernung leitfähigen Materials von einem mikroelektronischen Substrat

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60329872T Expired - Lifetime DE60329872D1 (de) 2002-08-29 2003-08-27 Verfahren und Vorrichtung zur elektromechanischen und/oder elektrisch-chemisch-mechanischen Entfernung leitfähigen Materials von einem mikroelektronischen Substrat

Country Status (9)

Country Link
US (3) US7220166B2 (de)
EP (2) EP1875987B1 (de)
JP (1) JP4340233B2 (de)
KR (1) KR100730908B1 (de)
CN (1) CN100503114C (de)
AT (2) ATE376477T1 (de)
AU (1) AU2003262996A1 (de)
DE (2) DE60317080T2 (de)
WO (1) WO2004020148A1 (de)

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US7220166B2 (en) 2007-05-22
EP1875987B1 (de) 2009-10-28
EP1536919A1 (de) 2005-06-08
DE60317080T2 (de) 2008-08-14
CN1688411A (zh) 2005-10-26
ATE376477T1 (de) 2007-11-15
ATE446822T1 (de) 2009-11-15
US7618528B2 (en) 2009-11-17
KR20050057082A (ko) 2005-06-16
WO2004020148A1 (en) 2004-03-11
JP2005537647A (ja) 2005-12-08
EP1875987A3 (de) 2008-08-06
EP1875987A2 (de) 2008-01-09
US20100006428A1 (en) 2010-01-14
US7972485B2 (en) 2011-07-05
US20070111641A1 (en) 2007-05-17
KR100730908B1 (ko) 2007-06-22
AU2003262996A1 (en) 2004-03-19
CN100503114C (zh) 2009-06-24
EP1536919B1 (de) 2007-10-24
US20030054729A1 (en) 2003-03-20
DE60329872D1 (de) 2009-12-10

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