DE60301923D1 - Geschlitzes Substrat - Google Patents

Geschlitzes Substrat

Info

Publication number
DE60301923D1
DE60301923D1 DE60301923T DE60301923T DE60301923D1 DE 60301923 D1 DE60301923 D1 DE 60301923D1 DE 60301923 T DE60301923 T DE 60301923T DE 60301923 T DE60301923 T DE 60301923T DE 60301923 D1 DE60301923 D1 DE 60301923D1
Authority
DE
Germany
Prior art keywords
slit substrate
slit
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60301923T
Other languages
English (en)
Other versions
DE60301923T2 (de
Inventor
Shen Buswell
Deanna J Bergstrom
Daniel Frech
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE60301923D1 publication Critical patent/DE60301923D1/de
Application granted granted Critical
Publication of DE60301923T2 publication Critical patent/DE60301923T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14016Structure of bubble jet print heads
    • B41J2/14145Structure of the manifold
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2002/14387Front shooter
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49401Fluid pattern dispersing device making, e.g., ink jet
DE60301923T 2002-07-31 2003-07-17 Geschlitztes Substrat Expired - Lifetime DE60301923T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US210727 2002-07-31
US10/210,727 US6666546B1 (en) 2002-07-31 2002-07-31 Slotted substrate and method of making

Publications (2)

Publication Number Publication Date
DE60301923D1 true DE60301923D1 (de) 2005-11-24
DE60301923T2 DE60301923T2 (de) 2006-07-13

Family

ID=29735435

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60301923T Expired - Lifetime DE60301923T2 (de) 2002-07-31 2003-07-17 Geschlitztes Substrat

Country Status (3)

Country Link
US (3) US6666546B1 (de)
EP (1) EP1386740B1 (de)
DE (1) DE60301923T2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7051426B2 (en) * 2002-01-31 2006-05-30 Hewlett-Packard Development Company, L.P. Method making a cutting disk into of a substrate
US20030155328A1 (en) * 2002-02-15 2003-08-21 Huth Mark C. Laser micromachining and methods and systems of same
KR100413693B1 (ko) * 2002-04-02 2004-01-03 삼성전자주식회사 잉크젯 프린트 헤드 및 이의 제조 방법
US6672712B1 (en) * 2002-10-31 2004-01-06 Hewlett-Packard Development Company, L.P. Slotted substrates and methods and systems for forming same
US6984015B2 (en) * 2003-08-12 2006-01-10 Lexmark International, Inc. Ink jet printheads and method therefor
US7429335B2 (en) * 2004-04-29 2008-09-30 Shen Buswell Substrate passage formation
US7326356B2 (en) * 2004-08-31 2008-02-05 Hewlett-Packard Development Company, L.P. Substrate and method of forming substrate for fluid ejection device
US7887016B2 (en) * 2007-08-23 2011-02-15 Gunsaullus Scott E All terrain material and tool tray
WO2013137902A1 (en) * 2012-03-16 2013-09-19 Hewlett-Packard Development Company, L.P. Printhead with recessed slot ends
US10821729B2 (en) 2013-02-28 2020-11-03 Hewlett-Packard Development Company, L.P. Transfer molded fluid flow structure
US11426900B2 (en) * 2013-02-28 2022-08-30 Hewlett-Packard Development Company, L.P. Molding a fluid flow structure
EP2961614B1 (de) 2013-02-28 2020-01-15 Hewlett-Packard Development Company, L.P. Geformter druckbalken
CN105189122B (zh) 2013-03-20 2017-05-10 惠普发展公司,有限责任合伙企业 具有暴露的前表面和后表面的模制芯片条
CN107303758B (zh) * 2016-04-18 2019-03-01 佳能株式会社 液体喷出头的制造方法
JP7297416B2 (ja) * 2018-09-07 2023-06-26 キヤノン株式会社 液体吐出ヘッドおよび液体吐出ヘッドの製造方法

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3752259T2 (de) 1986-12-19 1999-10-14 Applied Materials Inc Bromine-Ätzverfahren für Silizium
US5066357A (en) 1990-01-11 1991-11-19 Hewlett-Packard Company Method for making flexible circuit card with laser-contoured vias and machined capacitors
ES2100278T3 (es) 1991-01-18 1997-06-16 Canon Kk Unidad para chorros de liquido con orificios y aparato de impresion que utiliza la misma.
JP3053936B2 (ja) 1991-12-04 2000-06-19 キヤノン株式会社 液体噴射記録ヘッド用基体、該基体の製造方法、該基体を用いた液体噴射記録ヘッド、該記録ヘッドの製造方法及び該記録ヘッドを具備する記録装置
US5317346A (en) 1992-03-04 1994-05-31 Hewlett-Packard Company Compound ink feed slot
US5278584A (en) * 1992-04-02 1994-01-11 Hewlett-Packard Company Ink delivery system for an inkjet printhead
EP0594310A3 (en) 1992-10-23 1994-08-17 Hewlett Packard Co Ink jet printhead and method of manufacture thereof
US5387314A (en) * 1993-01-25 1995-02-07 Hewlett-Packard Company Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining
US5378137A (en) 1993-05-10 1995-01-03 Hewlett-Packard Company Mask design for forming tapered inkjet nozzles
DE4329728A1 (de) 1993-09-03 1995-03-09 Microparts Gmbh Düsenplatte für Fluidstrahl-Druckkopf und Verfahren zu deren Herstellung
US5466630A (en) 1994-03-21 1995-11-14 United Microelectronics Corp. Silicon-on-insulator technique with buried gap
US5449630A (en) 1994-05-03 1995-09-12 United Microelectronics Corp. Method for fabricating a trench capacitor structure for dynamic random access memory integrated circuit
JPH0890769A (ja) 1994-09-27 1996-04-09 Sharp Corp ひだ付きダイアフラム型インクジェットヘッド
JPH08281960A (ja) 1995-04-13 1996-10-29 Canon Inc インクジェット記録ヘッド
US5658471A (en) 1995-09-22 1997-08-19 Lexmark International, Inc. Fabrication of thermal ink-jet feed slots in a silicon substrate
US5786988A (en) 1996-07-02 1998-07-28 Sandisk Corporation Integrated circuit chips made bendable by forming indentations in their back surfaces flexible packages thereof and methods of manufacture
KR100205321B1 (ko) 1996-12-30 1999-07-01 구본준 크랙방지 패턴을 갖는 반도체소자의 제조방법
US5882982A (en) 1997-01-16 1999-03-16 Vlsi Technology, Inc. Trench isolation method
US5988786A (en) 1997-06-30 1999-11-23 Hewlett-Packard Company Articulated stress relief of an orifice membrane
US5847725A (en) 1997-07-28 1998-12-08 Hewlett-Packard Company Expansion relief for orifice plate of thermal ink jet print head
US6250738B1 (en) * 1997-10-28 2001-06-26 Hewlett-Packard Company Inkjet printing apparatus with ink manifold
US6106096A (en) 1997-12-15 2000-08-22 Lexmark International, Inc. Printhead stress relief
US6271102B1 (en) 1998-02-27 2001-08-07 International Business Machines Corporation Method and system for dicing wafers, and semiconductor structures incorporating the products thereof
US6204182B1 (en) 1998-03-02 2001-03-20 Hewlett-Packard Company In-situ fluid jet orifice
JPH11284060A (ja) 1998-03-27 1999-10-15 Hitachi Ltd 半導体装置及びその製造方法
US6138838A (en) * 1998-05-29 2000-10-31 J&L Fiber Services, Inc. Screen media and a screening passage therefore
US6132033A (en) * 1999-04-30 2000-10-17 Hewlett-Packard Company Inkjet print head with flow control manifold and columnar structures
US6331055B1 (en) 1999-08-30 2001-12-18 Hewlett-Packard Company Inkjet printhead with top plate bubble management
US6184570B1 (en) 1999-10-28 2001-02-06 Ericsson Inc. Integrated circuit dies including thermal stress reducing grooves and microelectronic packages utilizing the same

Also Published As

Publication number Publication date
US6666546B1 (en) 2003-12-23
US6814431B2 (en) 2004-11-09
EP1386740B1 (de) 2005-10-19
US20040031151A1 (en) 2004-02-19
US7501070B2 (en) 2009-03-10
US20040021742A1 (en) 2004-02-05
DE60301923T2 (de) 2006-07-13
EP1386740A1 (de) 2004-02-04

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, TE

8364 No opposition during term of opposition