DE60301923D1 - Geschlitzes Substrat - Google Patents
Geschlitzes SubstratInfo
- Publication number
- DE60301923D1 DE60301923D1 DE60301923T DE60301923T DE60301923D1 DE 60301923 D1 DE60301923 D1 DE 60301923D1 DE 60301923 T DE60301923 T DE 60301923T DE 60301923 T DE60301923 T DE 60301923T DE 60301923 D1 DE60301923 D1 DE 60301923D1
- Authority
- DE
- Germany
- Prior art keywords
- slit substrate
- slit
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14145—Structure of the manifold
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14387—Front shooter
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US210727 | 2002-07-31 | ||
US10/210,727 US6666546B1 (en) | 2002-07-31 | 2002-07-31 | Slotted substrate and method of making |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60301923D1 true DE60301923D1 (de) | 2005-11-24 |
DE60301923T2 DE60301923T2 (de) | 2006-07-13 |
Family
ID=29735435
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60301923T Expired - Lifetime DE60301923T2 (de) | 2002-07-31 | 2003-07-17 | Geschlitztes Substrat |
Country Status (3)
Country | Link |
---|---|
US (3) | US6666546B1 (de) |
EP (1) | EP1386740B1 (de) |
DE (1) | DE60301923T2 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7051426B2 (en) * | 2002-01-31 | 2006-05-30 | Hewlett-Packard Development Company, L.P. | Method making a cutting disk into of a substrate |
US20030155328A1 (en) * | 2002-02-15 | 2003-08-21 | Huth Mark C. | Laser micromachining and methods and systems of same |
KR100413693B1 (ko) * | 2002-04-02 | 2004-01-03 | 삼성전자주식회사 | 잉크젯 프린트 헤드 및 이의 제조 방법 |
US6672712B1 (en) * | 2002-10-31 | 2004-01-06 | Hewlett-Packard Development Company, L.P. | Slotted substrates and methods and systems for forming same |
US6984015B2 (en) * | 2003-08-12 | 2006-01-10 | Lexmark International, Inc. | Ink jet printheads and method therefor |
US7429335B2 (en) * | 2004-04-29 | 2008-09-30 | Shen Buswell | Substrate passage formation |
US7326356B2 (en) * | 2004-08-31 | 2008-02-05 | Hewlett-Packard Development Company, L.P. | Substrate and method of forming substrate for fluid ejection device |
US7887016B2 (en) * | 2007-08-23 | 2011-02-15 | Gunsaullus Scott E | All terrain material and tool tray |
WO2013137902A1 (en) * | 2012-03-16 | 2013-09-19 | Hewlett-Packard Development Company, L.P. | Printhead with recessed slot ends |
US10821729B2 (en) | 2013-02-28 | 2020-11-03 | Hewlett-Packard Development Company, L.P. | Transfer molded fluid flow structure |
US11426900B2 (en) * | 2013-02-28 | 2022-08-30 | Hewlett-Packard Development Company, L.P. | Molding a fluid flow structure |
EP2961614B1 (de) | 2013-02-28 | 2020-01-15 | Hewlett-Packard Development Company, L.P. | Geformter druckbalken |
CN105189122B (zh) | 2013-03-20 | 2017-05-10 | 惠普发展公司,有限责任合伙企业 | 具有暴露的前表面和后表面的模制芯片条 |
CN107303758B (zh) * | 2016-04-18 | 2019-03-01 | 佳能株式会社 | 液体喷出头的制造方法 |
JP7297416B2 (ja) * | 2018-09-07 | 2023-06-26 | キヤノン株式会社 | 液体吐出ヘッドおよび液体吐出ヘッドの製造方法 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3752259T2 (de) | 1986-12-19 | 1999-10-14 | Applied Materials Inc | Bromine-Ätzverfahren für Silizium |
US5066357A (en) | 1990-01-11 | 1991-11-19 | Hewlett-Packard Company | Method for making flexible circuit card with laser-contoured vias and machined capacitors |
ES2100278T3 (es) | 1991-01-18 | 1997-06-16 | Canon Kk | Unidad para chorros de liquido con orificios y aparato de impresion que utiliza la misma. |
JP3053936B2 (ja) | 1991-12-04 | 2000-06-19 | キヤノン株式会社 | 液体噴射記録ヘッド用基体、該基体の製造方法、該基体を用いた液体噴射記録ヘッド、該記録ヘッドの製造方法及び該記録ヘッドを具備する記録装置 |
US5317346A (en) | 1992-03-04 | 1994-05-31 | Hewlett-Packard Company | Compound ink feed slot |
US5278584A (en) * | 1992-04-02 | 1994-01-11 | Hewlett-Packard Company | Ink delivery system for an inkjet printhead |
EP0594310A3 (en) | 1992-10-23 | 1994-08-17 | Hewlett Packard Co | Ink jet printhead and method of manufacture thereof |
US5387314A (en) * | 1993-01-25 | 1995-02-07 | Hewlett-Packard Company | Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining |
US5378137A (en) | 1993-05-10 | 1995-01-03 | Hewlett-Packard Company | Mask design for forming tapered inkjet nozzles |
DE4329728A1 (de) | 1993-09-03 | 1995-03-09 | Microparts Gmbh | Düsenplatte für Fluidstrahl-Druckkopf und Verfahren zu deren Herstellung |
US5466630A (en) | 1994-03-21 | 1995-11-14 | United Microelectronics Corp. | Silicon-on-insulator technique with buried gap |
US5449630A (en) | 1994-05-03 | 1995-09-12 | United Microelectronics Corp. | Method for fabricating a trench capacitor structure for dynamic random access memory integrated circuit |
JPH0890769A (ja) | 1994-09-27 | 1996-04-09 | Sharp Corp | ひだ付きダイアフラム型インクジェットヘッド |
JPH08281960A (ja) | 1995-04-13 | 1996-10-29 | Canon Inc | インクジェット記録ヘッド |
US5658471A (en) | 1995-09-22 | 1997-08-19 | Lexmark International, Inc. | Fabrication of thermal ink-jet feed slots in a silicon substrate |
US5786988A (en) | 1996-07-02 | 1998-07-28 | Sandisk Corporation | Integrated circuit chips made bendable by forming indentations in their back surfaces flexible packages thereof and methods of manufacture |
KR100205321B1 (ko) | 1996-12-30 | 1999-07-01 | 구본준 | 크랙방지 패턴을 갖는 반도체소자의 제조방법 |
US5882982A (en) | 1997-01-16 | 1999-03-16 | Vlsi Technology, Inc. | Trench isolation method |
US5988786A (en) | 1997-06-30 | 1999-11-23 | Hewlett-Packard Company | Articulated stress relief of an orifice membrane |
US5847725A (en) | 1997-07-28 | 1998-12-08 | Hewlett-Packard Company | Expansion relief for orifice plate of thermal ink jet print head |
US6250738B1 (en) * | 1997-10-28 | 2001-06-26 | Hewlett-Packard Company | Inkjet printing apparatus with ink manifold |
US6106096A (en) | 1997-12-15 | 2000-08-22 | Lexmark International, Inc. | Printhead stress relief |
US6271102B1 (en) | 1998-02-27 | 2001-08-07 | International Business Machines Corporation | Method and system for dicing wafers, and semiconductor structures incorporating the products thereof |
US6204182B1 (en) | 1998-03-02 | 2001-03-20 | Hewlett-Packard Company | In-situ fluid jet orifice |
JPH11284060A (ja) | 1998-03-27 | 1999-10-15 | Hitachi Ltd | 半導体装置及びその製造方法 |
US6138838A (en) * | 1998-05-29 | 2000-10-31 | J&L Fiber Services, Inc. | Screen media and a screening passage therefore |
US6132033A (en) * | 1999-04-30 | 2000-10-17 | Hewlett-Packard Company | Inkjet print head with flow control manifold and columnar structures |
US6331055B1 (en) | 1999-08-30 | 2001-12-18 | Hewlett-Packard Company | Inkjet printhead with top plate bubble management |
US6184570B1 (en) | 1999-10-28 | 2001-02-06 | Ericsson Inc. | Integrated circuit dies including thermal stress reducing grooves and microelectronic packages utilizing the same |
-
2002
- 2002-07-31 US US10/210,727 patent/US6666546B1/en not_active Expired - Lifetime
-
2003
- 2003-06-20 US US10/601,149 patent/US6814431B2/en not_active Expired - Lifetime
- 2003-07-17 EP EP03254533A patent/EP1386740B1/de not_active Expired - Fee Related
- 2003-07-17 DE DE60301923T patent/DE60301923T2/de not_active Expired - Lifetime
- 2003-08-18 US US10/642,872 patent/US7501070B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US6666546B1 (en) | 2003-12-23 |
US6814431B2 (en) | 2004-11-09 |
EP1386740B1 (de) | 2005-10-19 |
US20040031151A1 (en) | 2004-02-19 |
US7501070B2 (en) | 2009-03-10 |
US20040021742A1 (en) | 2004-02-05 |
DE60301923T2 (de) | 2006-07-13 |
EP1386740A1 (de) | 2004-02-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, TE |
|
8364 | No opposition during term of opposition |