DE60235389D1 - Kapselung fuer polarisiertes mems relais und verfahren zur kapselung - Google Patents

Kapselung fuer polarisiertes mems relais und verfahren zur kapselung

Info

Publication number
DE60235389D1
DE60235389D1 DE60235389T DE60235389T DE60235389D1 DE 60235389 D1 DE60235389 D1 DE 60235389D1 DE 60235389 T DE60235389 T DE 60235389T DE 60235389 T DE60235389 T DE 60235389T DE 60235389 D1 DE60235389 D1 DE 60235389D1
Authority
DE
Germany
Prior art keywords
capsulation
polarized
mems relay
mems
relay
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60235389T
Other languages
English (en)
Inventor
John Stafford
Gordon Tam
Jun Shen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/126,291 external-priority patent/US6778046B2/en
Application filed by Individual filed Critical Individual
Application granted granted Critical
Publication of DE60235389D1 publication Critical patent/DE60235389D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0077—Other packages not provided for in groups B81B7/0035 - B81B7/0074
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H36/00—Switches actuated by change of magnetic field or of electric field, e.g. by change of relative position of magnet and switch, by shielding
    • H01H36/0006—Permanent magnet actuating reed switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/005—Details of electromagnetic relays using micromechanics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H36/00—Switches actuated by change of magnetic field or of electric field, e.g. by change of relative position of magnet and switch, by shielding
    • H01H2036/0093—Micromechanical switches actuated by a change of the magnetic field
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/005—Details of electromagnetic relays using micromechanics
    • H01H2050/007—Relays of the polarised type, e.g. the MEMS relay beam having a preferential magnetisation direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/1026—Compound semiconductors
    • H01L2924/1032—III-V
    • H01L2924/10329—Gallium arsenide [GaAs]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
DE60235389T 2001-09-17 2002-09-16 Kapselung fuer polarisiertes mems relais und verfahren zur kapselung Expired - Lifetime DE60235389D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US32284101P 2001-09-17 2001-09-17
US10/126,291 US6778046B2 (en) 2001-09-17 2002-04-19 Latching micro magnetic relay packages and methods of packaging
PCT/US2002/029279 WO2003026369A1 (en) 2001-09-17 2002-09-16 Latching micro magnetic relay packages and methods of packaging

Publications (1)

Publication Number Publication Date
DE60235389D1 true DE60235389D1 (de) 2010-04-01

Family

ID=27668018

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60235389T Expired - Lifetime DE60235389D1 (de) 2001-09-17 2002-09-16 Kapselung fuer polarisiertes mems relais und verfahren zur kapselung

Country Status (5)

Country Link
EP (1) EP1437036B1 (de)
JP (1) JP2005503659A (de)
CN (1) CN100441068C (de)
AT (1) ATE458386T1 (de)
DE (1) DE60235389D1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4702325B2 (ja) * 2007-06-07 2011-06-15 パナソニック電工株式会社 マイクロリレー
GB0817309D0 (en) * 2008-09-19 2008-10-29 Univ Heriot Watt Encapsulation method
US9402118B2 (en) * 2012-07-27 2016-07-26 Knowles Electronics, Llc Housing and method to control solder creep on housing
US9505607B2 (en) * 2015-03-27 2016-11-29 Intel Corporation Methods of forming sensor integrated packages and structures formed thereby
CN111558774A (zh) * 2020-07-20 2020-08-21 昆山联滔电子有限公司 一种继电器焊接装置及焊接方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0722888A (ja) * 1993-06-30 1995-01-24 Kinseki Ltd 圧電素子容器
JP3465940B2 (ja) * 1993-12-20 2003-11-10 日本信号株式会社 プレーナー型電磁リレー及びその製造方法
JPH0936690A (ja) * 1995-07-20 1997-02-07 S I I Quartz Techno:Kk 薄型水晶振動子
US5847631A (en) * 1995-10-10 1998-12-08 Georgia Tech Research Corporation Magnetic relay system and method capable of microfabrication production
JPH09243449A (ja) * 1996-03-05 1997-09-19 Mitsubishi Electric Corp 赤外線検出器
US6025767A (en) * 1996-08-05 2000-02-15 Mcnc Encapsulated micro-relay modules and methods of fabricating same
FR2761518B1 (fr) * 1997-04-01 1999-05-28 Suisse Electronique Microtech Moteur planaire magnetique et micro-actionneur magnetique comportant un tel moteur
US6100477A (en) * 1998-07-17 2000-08-08 Texas Instruments Incorporated Recessed etch RF micro-electro-mechanical switch
JP2000190070A (ja) * 1998-12-21 2000-07-11 Senju Metal Ind Co Ltd はんだ付け方法およびその装置
US6246305B1 (en) * 1998-12-30 2001-06-12 Honeywell International Inc Apparatus and method for operating a micromechanical switch
US6410360B1 (en) * 1999-01-26 2002-06-25 Teledyne Industries, Inc. Laminate-based apparatus and method of fabrication
US6469602B2 (en) * 1999-09-23 2002-10-22 Arizona State University Electronically switching latching micro-magnetic relay and method of operating same
US6452238B1 (en) * 1999-10-04 2002-09-17 Texas Instruments Incorporated MEMS wafer level package
US6384353B1 (en) * 2000-02-01 2002-05-07 Motorola, Inc. Micro-electromechanical system device
JP2001217519A (ja) * 2000-02-03 2001-08-10 Ibiden Co Ltd 配線板のキャパシタ構造及びキャパシタシート

Also Published As

Publication number Publication date
EP1437036A4 (de) 2006-11-15
EP1437036B1 (de) 2010-02-17
CN1631066A (zh) 2005-06-22
ATE458386T1 (de) 2010-03-15
EP1437036A1 (de) 2004-07-14
JP2005503659A (ja) 2005-02-03
CN100441068C (zh) 2008-12-03

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