DE60232857D1 - Befestigen von schutzkappen auf wafer-ebene - Google Patents
Befestigen von schutzkappen auf wafer-ebeneInfo
- Publication number
- DE60232857D1 DE60232857D1 DE60232857T DE60232857T DE60232857D1 DE 60232857 D1 DE60232857 D1 DE 60232857D1 DE 60232857 T DE60232857 T DE 60232857T DE 60232857 T DE60232857 T DE 60232857T DE 60232857 D1 DE60232857 D1 DE 60232857D1
- Authority
- DE
- Germany
- Prior art keywords
- wafer level
- tool
- array
- caps
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/50—Removing moulded articles
- B29C2043/503—Removing moulded articles using ejector pins, rods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/0022—Multi-cavity moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0109—Bonding an individual cap on the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0127—Using a carrier for applying a plurality of packaging lids to the system wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/924—Active solid-state devices, e.g. transistors, solid-state diodes with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AUPR2448A AUPR244801A0 (en) | 2001-01-10 | 2001-01-10 | A method and apparatus (WSM01) |
PCT/AU2002/000008 WO2002056367A1 (en) | 2001-01-10 | 2002-01-08 | Wafer scale molding of protective caps |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60232857D1 true DE60232857D1 (de) | 2009-08-20 |
Family
ID=3826483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60232857T Expired - Lifetime DE60232857D1 (de) | 2001-01-10 | 2002-01-08 | Befestigen von schutzkappen auf wafer-ebene |
Country Status (7)
Country | Link |
---|---|
US (11) | US6716666B2 (de) |
EP (1) | EP1356510B1 (de) |
JP (1) | JP3962688B2 (de) |
AT (1) | ATE436091T1 (de) |
AU (1) | AUPR244801A0 (de) |
DE (1) | DE60232857D1 (de) |
WO (1) | WO2002056367A1 (de) |
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US7109580B2 (en) * | 2004-03-03 | 2006-09-19 | Hymite A/S | Hermetically sealed package for optical, electronic, opto-electronic and other devices |
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-
2001
- 2001-01-10 AU AUPR2448A patent/AUPR244801A0/en not_active Abandoned
-
2002
- 2002-01-08 US US10/129,502 patent/US6716666B2/en not_active Expired - Fee Related
- 2002-01-08 EP EP02729352A patent/EP1356510B1/de not_active Expired - Lifetime
- 2002-01-08 AT AT02729352T patent/ATE436091T1/de not_active IP Right Cessation
- 2002-01-08 JP JP2002556935A patent/JP3962688B2/ja not_active Expired - Fee Related
- 2002-01-08 DE DE60232857T patent/DE60232857D1/de not_active Expired - Lifetime
- 2002-01-08 WO PCT/AU2002/000008 patent/WO2002056367A1/en active IP Right Grant
- 2002-01-14 US US10/043,299 patent/US20020088537A1/en not_active Abandoned
-
2003
- 2003-12-08 US US10/728,985 patent/US7173332B2/en not_active Expired - Fee Related
- 2003-12-08 US US10/728,929 patent/US6989292B2/en not_active Expired - Lifetime
- 2003-12-08 US US10/728,798 patent/US6979599B2/en not_active Expired - Lifetime
- 2003-12-08 US US10/728,930 patent/US6982189B2/en not_active Expired - Lifetime
- 2003-12-08 US US10/728,923 patent/US7026176B2/en not_active Expired - Lifetime
- 2003-12-08 US US10/728,800 patent/US6977189B2/en not_active Expired - Lifetime
- 2003-12-08 US US10/728,808 patent/US7126216B2/en not_active Expired - Lifetime
- 2003-12-08 US US10/728,799 patent/US6812062B2/en not_active Expired - Lifetime
-
2004
- 2004-09-27 US US10/949,350 patent/US7008819B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
AUPR244801A0 (en) | 2001-02-01 |
US7126216B2 (en) | 2006-10-24 |
US20040082119A1 (en) | 2004-04-29 |
EP1356510A4 (de) | 2006-10-11 |
US6982189B2 (en) | 2006-01-03 |
US6979599B2 (en) | 2005-12-27 |
US20040082104A1 (en) | 2004-04-29 |
WO2002056367A1 (en) | 2002-07-18 |
US20040082105A1 (en) | 2004-04-29 |
US20040101992A1 (en) | 2004-05-27 |
US7008819B2 (en) | 2006-03-07 |
US6812062B2 (en) | 2004-11-02 |
US7026176B2 (en) | 2006-04-11 |
EP1356510A1 (de) | 2003-10-29 |
US6977189B2 (en) | 2005-12-20 |
US6989292B2 (en) | 2006-01-24 |
US20040082115A1 (en) | 2004-04-29 |
US20040121517A1 (en) | 2004-06-24 |
US6716666B2 (en) | 2004-04-06 |
US20040082110A1 (en) | 2004-04-29 |
ATE436091T1 (de) | 2009-07-15 |
US7173332B2 (en) | 2007-02-06 |
US20050042802A1 (en) | 2005-02-24 |
JP3962688B2 (ja) | 2007-08-22 |
US20030092245A1 (en) | 2003-05-15 |
EP1356510B1 (de) | 2009-07-08 |
JP2004523106A (ja) | 2004-07-29 |
US20040079862A1 (en) | 2004-04-29 |
US20020088537A1 (en) | 2002-07-11 |
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