US6853067B1
(en)
|
1999-10-12 |
2005-02-08 |
Microassembly Technologies, Inc. |
Microelectromechanical systems using thermocompression bonding
|
US20020096421A1
(en)
*
|
2000-11-29 |
2002-07-25 |
Cohn Michael B. |
MEMS device with integral packaging
|
JP3651671B2
(ja)
*
|
2001-08-30 |
2005-05-25 |
株式会社東芝 |
マイクロメカニカルスイッチ及びその製造方法
|
US7132736B2
(en)
*
|
2001-10-31 |
2006-11-07 |
Georgia Tech Research Corporation |
Devices having compliant wafer-level packages with pillars and methods of fabrication
|
DE60217924T2
(de)
*
|
2001-11-09 |
2007-08-02 |
Wispry, Inc. |
Mems-einrichtung mit kontakt und abstandshöckern und damit zusammenhängende verfahren
|
US7521366B2
(en)
*
|
2001-12-12 |
2009-04-21 |
Lg Display Co., Ltd. |
Manufacturing method of electro line for liquid crystal display device
|
US7045459B2
(en)
*
|
2002-02-19 |
2006-05-16 |
Northrop Grumman Corporation |
Thin film encapsulation of MEMS devices
|
US7763947B2
(en)
*
|
2002-04-23 |
2010-07-27 |
Sharp Laboratories Of America, Inc. |
Piezo-diode cantilever MEMS
|
US7135777B2
(en)
*
|
2002-05-03 |
2006-11-14 |
Georgia Tech Research Corporation |
Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof
|
US7002225B2
(en)
*
|
2002-05-24 |
2006-02-21 |
Northrup Grumman Corporation |
Compliant component for supporting electrical interface component
|
US6777258B1
(en)
*
|
2002-06-28 |
2004-08-17 |
Silicon Light Machines, Inc. |
Conductive etch stop for etching a sacrificial layer
|
US7064637B2
(en)
*
|
2002-07-18 |
2006-06-20 |
Wispry, Inc. |
Recessed electrode for electrostatically actuated structures
|
US7551048B2
(en)
*
|
2002-08-08 |
2009-06-23 |
Fujitsu Component Limited |
Micro-relay and method of fabricating the same
|
EP1394554B1
(de)
*
|
2002-08-30 |
2011-11-02 |
STMicroelectronics Srl |
Herstellungsverfahren für einen Grenzbeschleunigungsaufnehmer
|
US20040121505A1
(en)
*
|
2002-09-30 |
2004-06-24 |
Magfusion, Inc. |
Method for fabricating a gold contact on a microswitch
|
US7053736B2
(en)
*
|
2002-09-30 |
2006-05-30 |
Teravicta Technologies, Inc. |
Microelectromechanical device having an active opening switch
|
US7317232B2
(en)
*
|
2002-10-22 |
2008-01-08 |
Cabot Microelectronics Corporation |
MEM switching device
|
US6835589B2
(en)
*
|
2002-11-14 |
2004-12-28 |
International Business Machines Corporation |
Three-dimensional integrated CMOS-MEMS device and process for making the same
|
US6800503B2
(en)
*
|
2002-11-20 |
2004-10-05 |
International Business Machines Corporation |
MEMS encapsulated structure and method of making same
|
US7498911B2
(en)
*
|
2003-02-26 |
2009-03-03 |
Memtronics Corporation |
Membrane switch components and designs
|
ATE475999T1
(de)
|
2003-03-04 |
2010-08-15 |
Rohm & Haas Elect Mat |
Koaxiale wellenleitermikrostrukturen und verfahern zu ihrer bildung
|
US6720267B1
(en)
*
|
2003-03-19 |
2004-04-13 |
United Microelectronics Corp. |
Method for forming a cantilever beam model micro-electromechanical system
|
NL1023275C2
(nl)
*
|
2003-04-25 |
2004-10-27 |
Cavendish Kinetics Ltd |
Werkwijze voor het vervaardigen van een micro-mechanisch element.
|
CA2429909A1
(en)
*
|
2003-05-27 |
2004-11-27 |
Cognos Incorporated |
Transformation of tabular and cross-tabulated queries based upon e/r schema into multi-dimensional expression queries
|
DE10325564B4
(de)
*
|
2003-06-05 |
2008-12-18 |
Infineon Technologies Ag |
Chipkartenmodul
|
US7061022B1
(en)
*
|
2003-08-26 |
2006-06-13 |
United States Of America As Represented By The Secretary Of The Army |
Lateral heat spreading layers for epi-side up ridge waveguide semiconductor lasers
|
JP4823478B2
(ja)
*
|
2003-09-19 |
2011-11-24 |
株式会社半導体エネルギー研究所 |
発光装置の作製方法
|
US7520790B2
(en)
*
|
2003-09-19 |
2009-04-21 |
Semiconductor Energy Laboratory Co., Ltd. |
Display device and manufacturing method of display device
|
US7388459B2
(en)
*
|
2003-10-28 |
2008-06-17 |
Medtronic, Inc. |
MEMs switching circuit and method for an implantable medical device
|
US7283024B2
(en)
*
|
2003-12-18 |
2007-10-16 |
Intel Corporation |
MEMS switch stopper bumps with adjustable height
|
GB0330010D0
(en)
|
2003-12-24 |
2004-01-28 |
Cavendish Kinetics Ltd |
Method for containing a device and a corresponding device
|
US7142087B2
(en)
*
|
2004-01-27 |
2006-11-28 |
Lucent Technologies Inc. |
Micromechanical latching switch
|
US7101724B2
(en)
*
|
2004-02-20 |
2006-09-05 |
Wireless Mems, Inc. |
Method of fabricating semiconductor devices employing at least one modulation doped quantum well structure and one or more etch stop layers for accurate contact formation
|
US7265299B2
(en)
*
|
2004-03-04 |
2007-09-04 |
Au Optronics Corporation |
Method for reducing voltage drop across metal lines of electroluminescence display devices
|
US20050244099A1
(en)
*
|
2004-03-24 |
2005-11-03 |
Pasch Nicholas F |
Cantilevered micro-electromechanical switch array
|
US7362199B2
(en)
*
|
2004-03-31 |
2008-04-22 |
Intel Corporation |
Collapsible contact switch
|
FR2868591B1
(fr)
*
|
2004-04-06 |
2006-06-09 |
Commissariat Energie Atomique |
Microcommutateur a faible tension d'actionnement et faible consommation
|
US7476327B2
(en)
*
|
2004-05-04 |
2009-01-13 |
Idc, Llc |
Method of manufacture for microelectromechanical devices
|
DE102004026654B4
(de)
*
|
2004-06-01 |
2009-07-09 |
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. |
Mikromechanisches HF-Schaltelement sowie Verfahren zur Herstellung
|
US7749792B2
(en)
*
|
2004-06-02 |
2010-07-06 |
Carnegie Mellon University |
Self-assembling MEMS devices having thermal actuation
|
US20060055499A1
(en)
*
|
2004-09-16 |
2006-03-16 |
Bolle Cristian A |
Fuse arrangement
|
US8008736B2
(en)
|
2004-09-27 |
2011-08-30 |
Qualcomm Mems Technologies, Inc. |
Analog interferometric modulator device
|
US7420725B2
(en)
|
2004-09-27 |
2008-09-02 |
Idc, Llc |
Device having a conductive light absorbing mask and method for fabricating same
|
US20060065622A1
(en)
*
|
2004-09-27 |
2006-03-30 |
Floyd Philip D |
Method and system for xenon fluoride etching with enhanced efficiency
|
US7369296B2
(en)
|
2004-09-27 |
2008-05-06 |
Idc, Llc |
Device and method for modifying actuation voltage thresholds of a deformable membrane in an interferometric modulator
|
US7936497B2
(en)
|
2004-09-27 |
2011-05-03 |
Qualcomm Mems Technologies, Inc. |
MEMS device having deformable membrane characterized by mechanical persistence
|
US7630119B2
(en)
|
2004-09-27 |
2009-12-08 |
Qualcomm Mems Technologies, Inc. |
Apparatus and method for reducing slippage between structures in an interferometric modulator
|
US7372613B2
(en)
*
|
2004-09-27 |
2008-05-13 |
Idc, Llc |
Method and device for multistate interferometric light modulation
|
US7564612B2
(en)
|
2004-09-27 |
2009-07-21 |
Idc, Llc |
Photonic MEMS and structures
|
US7289259B2
(en)
|
2004-09-27 |
2007-10-30 |
Idc, Llc |
Conductive bus structure for interferometric modulator array
|
US7944599B2
(en)
|
2004-09-27 |
2011-05-17 |
Qualcomm Mems Technologies, Inc. |
Electromechanical device with optical function separated from mechanical and electrical function
|
US7583429B2
(en)
|
2004-09-27 |
2009-09-01 |
Idc, Llc |
Ornamental display device
|
US7527995B2
(en)
|
2004-09-27 |
2009-05-05 |
Qualcomm Mems Technologies, Inc. |
Method of making prestructure for MEMS systems
|
US7304784B2
(en)
*
|
2004-09-27 |
2007-12-04 |
Idc, Llc |
Reflective display device having viewable display on both sides
|
US7417783B2
(en)
*
|
2004-09-27 |
2008-08-26 |
Idc, Llc |
Mirror and mirror layer for optical modulator and method
|
US7193492B2
(en)
*
|
2004-09-29 |
2007-03-20 |
Lucent Technologies Inc. |
Monolithic MEMS device having a balanced cantilever plate
|
US7239064B1
(en)
*
|
2004-10-15 |
2007-07-03 |
Morgan Research Corporation |
Resettable latching MEMS temperature sensor apparatus and method
|
KR100619110B1
(ko)
|
2004-10-21 |
2006-09-04 |
한국전자통신연구원 |
미세전자기계적 스위치 및 그 제조 방법
|
US7230513B2
(en)
*
|
2004-11-20 |
2007-06-12 |
Wireless Mems, Inc. |
Planarized structure for a reliable metal-to-metal contact micro-relay MEMS switch
|
TWI252838B
(en)
*
|
2004-12-02 |
2006-04-11 |
Delta Electronics Inc |
Micro-switch
|
WO2006063257A2
(en)
*
|
2004-12-09 |
2006-06-15 |
Wispry, Inc. |
Micro-electro-mechanical system (mems) capacitors, inductors, and related systems and methods
|
US7391090B2
(en)
*
|
2004-12-17 |
2008-06-24 |
Hewlett-Packard Development Company, L.P. |
Systems and methods for electrically coupling wires and conductors
|
US7521784B2
(en)
*
|
2004-12-17 |
2009-04-21 |
Hewlett-Packard Development Company, L.P. |
System for coupling wire to semiconductor region
|
KR100661176B1
(ko)
*
|
2004-12-17 |
2006-12-26 |
삼성전자주식회사 |
Mems 스위치 및 그 제조 방법
|
US7597819B1
(en)
*
|
2004-12-20 |
2009-10-06 |
Sandia Corporation |
Redox buffered hydrofluoric acid etchant for the reduction of galvanic attack during release etching of MEMS devices having noble material films
|
TWI287634B
(en)
*
|
2004-12-31 |
2007-10-01 |
Wen-Chang Dung |
Micro-electromechanical probe circuit film, method for making the same and applications thereof
|
US7601554B1
(en)
|
2005-01-31 |
2009-10-13 |
The United States Of America As Represented By The Secretary Of The Air Force |
Shaped MEMS contact
|
US7235750B1
(en)
|
2005-01-31 |
2007-06-26 |
United States Of America As Represented By The Secretary Of The Air Force |
Radio frequency MEMS switch contact metal selection
|
US7655996B1
(en)
*
|
2005-02-03 |
2010-02-02 |
The United States Of America As Represented By The Secretary Of The Army |
MEMS structure support and release mechanism
|
US7404167B2
(en)
|
2005-02-23 |
2008-07-22 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Method for improving design window
|
ATE525738T1
(de)
*
|
2005-03-18 |
2011-10-15 |
Reseaux Mems |
Mems-aktuatoren und -schalter
|
JP4707424B2
(ja)
*
|
2005-03-18 |
2011-06-22 |
株式会社東芝 |
可変容量素子および可変容量装置ならびに可変容量装置を用いた携帯電話
|
JP4498181B2
(ja)
*
|
2005-03-22 |
2010-07-07 |
東京エレクトロン株式会社 |
スイッチアレイ
|
US7320621B2
(en)
*
|
2005-03-31 |
2008-01-22 |
Molex Incorporated |
High-density, robust connector with castellations
|
DE102005016243B3
(de)
|
2005-04-08 |
2006-09-28 |
Austriamicrosystems Ag |
Mikromechanisches Bauelement, Verfahren zur Herstellung und Verwendung
|
FR2885735B1
(fr)
*
|
2005-05-10 |
2007-08-03 |
St Microelectronics Sa |
Circuit integre guide d'ondes
|
US7692521B1
(en)
*
|
2005-05-12 |
2010-04-06 |
Microassembly Technologies, Inc. |
High force MEMS device
|
US7884989B2
(en)
*
|
2005-05-27 |
2011-02-08 |
Qualcomm Mems Technologies, Inc. |
White interferometric modulators and methods for forming the same
|
US7321275B2
(en)
*
|
2005-06-23 |
2008-01-22 |
Intel Corporation |
Ultra-low voltage capable zipper switch
|
JP4489651B2
(ja)
*
|
2005-07-22 |
2010-06-23 |
株式会社日立製作所 |
半導体装置およびその製造方法
|
EP2495212A3
(de)
|
2005-07-22 |
2012-10-31 |
QUALCOMM MEMS Technologies, Inc. |
MEMS-Vorrichtungen mit Stützstrukturen und Herstellungsverfahren dafür
|
WO2007015218A2
(en)
*
|
2005-08-03 |
2007-02-08 |
Kolo Technologies, Inc. |
Micro-electro-mechanical transducer having an optimized non-flat surface
|
US20070040637A1
(en)
*
|
2005-08-19 |
2007-02-22 |
Yee Ian Y K |
Microelectromechanical switches having mechanically active components which are electrically isolated from components of the switch used for the transmission of signals
|
US7960208B2
(en)
*
|
2005-08-26 |
2011-06-14 |
Innovative Micro Technology |
Wafer level hermetic bond using metal alloy with raised feature
|
US20070048887A1
(en)
*
|
2005-08-26 |
2007-03-01 |
Innovative Micro Technology |
Wafer level hermetic bond using metal alloy
|
US8736081B2
(en)
|
2005-08-26 |
2014-05-27 |
Innovative Micro Technology |
Wafer level hermetic bond using metal alloy with keeper layer
|
US7569926B2
(en)
*
|
2005-08-26 |
2009-08-04 |
Innovative Micro Technology |
Wafer level hermetic bond using metal alloy with raised feature
|
US7233048B2
(en)
*
|
2005-08-26 |
2007-06-19 |
Innovative Micro Technology |
MEMS device trench plating process and apparatus for through hole vias
|
US7528691B2
(en)
*
|
2005-08-26 |
2009-05-05 |
Innovative Micro Technology |
Dual substrate electrostatic MEMS switch with hermetic seal and method of manufacture
|
US7582969B2
(en)
*
|
2005-08-26 |
2009-09-01 |
Innovative Micro Technology |
Hermetic interconnect structure and method of manufacture
|
US20070090474A1
(en)
*
|
2005-09-08 |
2007-04-26 |
Li Gary G |
MEMS device and method of fabrication
|
US7332980B2
(en)
*
|
2005-09-22 |
2008-02-19 |
Samsung Electronics Co., Ltd. |
System and method for a digitally tunable impedance matching network
|
US20080094149A1
(en)
*
|
2005-09-22 |
2008-04-24 |
Sungsung Electronics Co., Ltd. |
Power amplifier matching circuit and method using tunable mems devices
|
KR20080068821A
(ko)
*
|
2005-09-30 |
2008-07-24 |
퀄컴 엠이엠스 테크놀로지스, 인크. |
Mems 장치 및 해당 장치용의 접속부
|
KR100827314B1
(ko)
*
|
2005-10-10 |
2008-05-06 |
삼성전기주식회사 |
열처리에 의해 평탄면을 가지는 멤스 소자 및 광변조기제조 방법
|
US8043950B2
(en)
*
|
2005-10-26 |
2011-10-25 |
Semiconductor Energy Laboratory Co., Ltd. |
Semiconductor device and manufacturing method thereof
|
US7630114B2
(en)
*
|
2005-10-28 |
2009-12-08 |
Idc, Llc |
Diffusion barrier layer for MEMS devices
|
US20070096860A1
(en)
*
|
2005-11-02 |
2007-05-03 |
Innovative Micro Technology |
Compact MEMS thermal device and method of manufacture
|
KR100744543B1
(ko)
*
|
2005-12-08 |
2007-08-01 |
한국전자통신연구원 |
미세전자기계적 구조 스위치 및 그 제조방법
|
CN101336328B
(zh)
*
|
2005-12-12 |
2011-08-31 |
远程接合技术公司 |
改进的梁式紧固件
|
JP5399075B2
(ja)
*
|
2005-12-22 |
2014-01-29 |
エプコス アクチエンゲゼルシャフト |
直列接続されたキャパシタを有するmemsデバイス装置
|
US7602261B2
(en)
*
|
2005-12-22 |
2009-10-13 |
Intel Corporation |
Micro-electromechanical system (MEMS) switch
|
US7525151B2
(en)
*
|
2006-01-05 |
2009-04-28 |
International Rectifier Corporation |
Vertical DMOS device in integrated circuit
|
FR2895986B1
(fr)
*
|
2006-01-06 |
2008-09-05 |
Centre Nat Rech Scient |
Preparation de microcomposants multicouches par la methode de la couche epaisse sacrificielle
|
US20070196048A1
(en)
*
|
2006-01-12 |
2007-08-23 |
Almantas Galvanauskas |
Optical waveform shaping
|
US7916980B2
(en)
|
2006-01-13 |
2011-03-29 |
Qualcomm Mems Technologies, Inc. |
Interconnect structure for MEMS device
|
US7382515B2
(en)
|
2006-01-18 |
2008-06-03 |
Qualcomm Mems Technologies, Inc. |
Silicon-rich silicon nitrides as etch stops in MEMS manufacture
|
US7678601B2
(en)
*
|
2006-01-20 |
2010-03-16 |
Texas Instruments Incorporated |
Method of forming an acceleration sensor
|
US20070170528A1
(en)
*
|
2006-01-20 |
2007-07-26 |
Aaron Partridge |
Wafer encapsulated microelectromechanical structure and method of manufacturing same
|
US7671693B2
(en)
*
|
2006-02-17 |
2010-03-02 |
Samsung Electronics Co., Ltd. |
System and method for a tunable impedance matching network
|
US7480432B2
(en)
*
|
2006-02-28 |
2009-01-20 |
Corning Incorporated |
Glass-based micropositioning systems and methods
|
US7463113B2
(en)
*
|
2006-02-28 |
2008-12-09 |
Motorla, Inc. |
Apparatus and methods relating to electrically conductive path interfaces disposed within capacitor plate openings
|
US7545622B2
(en)
*
|
2006-03-08 |
2009-06-09 |
Wispry, Inc. |
Micro-electro-mechanical system (MEMS) variable capacitors and actuation components and related methods
|
US7710045B2
(en)
*
|
2006-03-17 |
2010-05-04 |
3M Innovative Properties Company |
Illumination assembly with enhanced thermal conductivity
|
US7711239B2
(en)
|
2006-04-19 |
2010-05-04 |
Qualcomm Mems Technologies, Inc. |
Microelectromechanical device and method utilizing nanoparticles
|
US7554421B2
(en)
*
|
2006-05-16 |
2009-06-30 |
Intel Corporation |
Micro-electromechanical system (MEMS) trampoline switch/varactor
|
GB0610392D0
(en)
*
|
2006-05-25 |
2006-07-05 |
Univ Durham |
Electro-mechanical actuator and apparatus incorporating such device
|
US7649671B2
(en)
|
2006-06-01 |
2010-01-19 |
Qualcomm Mems Technologies, Inc. |
Analog interferometric modulator device with electrostatic actuation and release
|
US7605675B2
(en)
*
|
2006-06-20 |
2009-10-20 |
Intel Corporation |
Electromechanical switch with partially rigidified electrode
|
US7835061B2
(en)
*
|
2006-06-28 |
2010-11-16 |
Qualcomm Mems Technologies, Inc. |
Support structures for free-standing electromechanical devices
|
US7527998B2
(en)
|
2006-06-30 |
2009-05-05 |
Qualcomm Mems Technologies, Inc. |
Method of manufacturing MEMS devices providing air gap control
|
US7911010B2
(en)
*
|
2006-07-17 |
2011-03-22 |
Kwj Engineering, Inc. |
Apparatus and method for microfabricated multi-dimensional sensors and sensing systems
|
JP4234737B2
(ja)
*
|
2006-07-24 |
2009-03-04 |
株式会社東芝 |
Memsスイッチ
|
JP4265630B2
(ja)
*
|
2006-08-04 |
2009-05-20 |
セイコーエプソン株式会社 |
Memsスイッチ、電圧分割回路、利得調整回路、減衰器及びmemsスイッチの製造方法
|
US7944332B2
(en)
*
|
2006-08-09 |
2011-05-17 |
Koninklijke Philips Electronics N.V. |
Self-locking micro electro mechanical device
|
US7495368B2
(en)
*
|
2006-08-31 |
2009-02-24 |
Evigia Systems, Inc. |
Bimorphic structures, sensor structures formed therewith, and methods therefor
|
US7688167B2
(en)
*
|
2006-10-12 |
2010-03-30 |
Innovative Micro Technology |
Contact electrode for microdevices and etch method of manufacture
|
US7684106B2
(en)
*
|
2006-11-02 |
2010-03-23 |
Qualcomm Mems Technologies, Inc. |
Compatible MEMS switch architecture
|
JP5085101B2
(ja)
*
|
2006-11-17 |
2012-11-28 |
オリンパス株式会社 |
可変分光素子
|
US8432239B2
(en)
*
|
2006-11-20 |
2013-04-30 |
Massachusetts Institute Of Technology |
Micro-electro mechanical tunneling switch
|
CN101188159B
(zh)
*
|
2006-11-24 |
2011-01-12 |
阎跃军 |
分段可调电感器
|
US8222087B2
(en)
|
2006-12-19 |
2012-07-17 |
HGST Netherlands, B.V. |
Seed layer for a heat spreader in a magnetic recording head
|
US7706042B2
(en)
|
2006-12-20 |
2010-04-27 |
Qualcomm Mems Technologies, Inc. |
MEMS device and interconnects for same
|
KR100840644B1
(ko)
*
|
2006-12-29 |
2008-06-24 |
동부일렉트로닉스 주식회사 |
스위칭 소자 및 그 제조 방법
|
JP2008188755A
(ja)
|
2006-12-30 |
2008-08-21 |
Rohm & Haas Electronic Materials Llc |
三次元微細構造体およびその形成方法
|
JP4916893B2
(ja)
*
|
2007-01-05 |
2012-04-18 |
株式会社日本マイクロニクス |
プローブの製造方法
|
US7400015B1
(en)
*
|
2007-01-15 |
2008-07-15 |
International Business Machines Corporation |
Semiconductor structure with field shield and method of forming the structure
|
US8115987B2
(en)
|
2007-02-01 |
2012-02-14 |
Qualcomm Mems Technologies, Inc. |
Modulating the intensity of light from an interferometric reflector
|
WO2008103632A2
(en)
*
|
2007-02-20 |
2008-08-28 |
Qualcomm Mems Technologies, Inc. |
Equipment and methods for etching of mems
|
US20080197964A1
(en)
*
|
2007-02-21 |
2008-08-21 |
Simpler Networks Inc. |
Mems actuators and switches
|
EP3104450A3
(de)
|
2007-03-20 |
2016-12-28 |
Nuvotronics, LLC |
Integrierte elektronische komponenten und herstellungsverfahren dafür
|
EP1973189B1
(de)
|
2007-03-20 |
2012-12-05 |
Nuvotronics, LLC |
Mikrostrukturen einer koaxialen Übertragungsleitung und Herstellungsverfahren dafür
|
EP2129619A2
(de)
*
|
2007-04-04 |
2009-12-09 |
Qualcomm Mems Technologies, Inc. |
Beseitigung von freisetzungsätzangriffen durch schnittstellenmodifikation in opferschichten
|
US7643202B2
(en)
|
2007-05-09 |
2010-01-05 |
Qualcomm Mems Technologies, Inc. |
Microelectromechanical system having a dielectric movable membrane and a mirror
|
US7719752B2
(en)
|
2007-05-11 |
2010-05-18 |
Qualcomm Mems Technologies, Inc. |
MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same
|
US7992294B2
(en)
*
|
2007-05-25 |
2011-08-09 |
Molex Incorporated |
Method of manufacturing an interconnect device which forms a heat sink and electrical connections between a heat generating device and a power source
|
US8102638B2
(en)
*
|
2007-06-13 |
2012-01-24 |
The University Court Of The University Of Edinburgh |
Micro electromechanical capacitive switch
|
US7625825B2
(en)
*
|
2007-06-14 |
2009-12-01 |
Qualcomm Mems Technologies, Inc. |
Method of patterning mechanical layer for MEMS structures
|
US7630121B2
(en)
*
|
2007-07-02 |
2009-12-08 |
Qualcomm Mems Technologies, Inc. |
Electromechanical device with optical function separated from mechanical and electrical function
|
US8068268B2
(en)
|
2007-07-03 |
2011-11-29 |
Qualcomm Mems Technologies, Inc. |
MEMS devices having improved uniformity and methods for making them
|
US8310016B2
(en)
*
|
2007-07-17 |
2012-11-13 |
Kwj Engineering, Inc. |
Apparatus and method for microfabricated multi-dimensional sensors and sensing systems
|
CN101849289B
(zh)
*
|
2007-07-23 |
2014-02-26 |
维斯普瑞公司 |
制备三层梁的方法和设备
|
CA2694044C
(en)
|
2007-07-25 |
2017-02-28 |
Qualcomm Mems Technologies, Inc. |
Mems display devices and methods of fabricating the same
|
JP2010538306A
(ja)
|
2007-07-31 |
2010-12-09 |
クォルコム・メムズ・テクノロジーズ・インコーポレーテッド |
干渉変調器の色ずれを高めるためのデバイス
|
US8154378B2
(en)
*
|
2007-08-10 |
2012-04-10 |
Alcatel Lucent |
Thermal actuator for a MEMS-based relay switch
|
US7847999B2
(en)
|
2007-09-14 |
2010-12-07 |
Qualcomm Mems Technologies, Inc. |
Interferometric modulator display devices
|
WO2009036215A2
(en)
*
|
2007-09-14 |
2009-03-19 |
Qualcomm Mems Technologies, Inc. |
Etching processes used in mems production
|
WO2009050209A2
(en)
*
|
2007-10-15 |
2009-04-23 |
Epcos Ag |
Manufacturing a mems element having cantilever and cavity on a substrate
|
TW200919593A
(en)
*
|
2007-10-18 |
2009-05-01 |
Asia Pacific Microsystems Inc |
Elements and modules with micro caps and wafer level packaging method thereof
|
US8058549B2
(en)
|
2007-10-19 |
2011-11-15 |
Qualcomm Mems Technologies, Inc. |
Photovoltaic devices with integrated color interferometric film stacks
|
EP2212926A2
(de)
|
2007-10-19 |
2010-08-04 |
QUALCOMM MEMS Technologies, Inc. |
Display mit integrierter fotovoltaik
|
WO2009055393A1
(en)
|
2007-10-23 |
2009-04-30 |
Qualcomm Mems Technologies, Inc. |
Adjustably transmissive mems-based devices
|
US8941631B2
(en)
|
2007-11-16 |
2015-01-27 |
Qualcomm Mems Technologies, Inc. |
Simultaneous light collection and illumination on an active display
|
US20090140433A1
(en)
*
|
2007-11-30 |
2009-06-04 |
Alces Technology, Inc. |
MEMS chip-to-chip interconnects
|
WO2009079460A1
(en)
*
|
2007-12-14 |
2009-06-25 |
University Of Florida Research Foundation, Inc. |
Electrothermal microactuator for large vertical displacement without tilt or lateral shift
|
US7609136B2
(en)
*
|
2007-12-20 |
2009-10-27 |
General Electric Company |
MEMS microswitch having a conductive mechanical stop
|
WO2009079780A1
(en)
*
|
2007-12-21 |
2009-07-02 |
The Royal Institution For The Advancement Of Learning/Mcgill University |
Low temperature ceramic microelectromechanical structures
|
US7863079B2
(en)
|
2008-02-05 |
2011-01-04 |
Qualcomm Mems Technologies, Inc. |
Methods of reducing CD loss in a microelectromechanical device
|
US8199020B1
(en)
*
|
2008-02-11 |
2012-06-12 |
The United States Of America As Represented By The Secretary Of The Army |
Thermal cutoff fuse for arbitrary temperatures
|
US7989262B2
(en)
|
2008-02-22 |
2011-08-02 |
Cavendish Kinetics, Ltd. |
Method of sealing a cavity
|
US8164821B2
(en)
*
|
2008-02-22 |
2012-04-24 |
Qualcomm Mems Technologies, Inc. |
Microelectromechanical device with thermal expansion balancing layer or stiffening layer
|
US7944604B2
(en)
|
2008-03-07 |
2011-05-17 |
Qualcomm Mems Technologies, Inc. |
Interferometric modulator in transmission mode
|
US7612933B2
(en)
|
2008-03-27 |
2009-11-03 |
Qualcomm Mems Technologies, Inc. |
Microelectromechanical device with spacing layer
|
EP2107038B1
(de)
*
|
2008-03-31 |
2012-05-16 |
Imec |
Elektrostatisch betätigbare MEMS-Vorrichtung mit verringerter Substrataufladung
|
US7898723B2
(en)
|
2008-04-02 |
2011-03-01 |
Qualcomm Mems Technologies, Inc. |
Microelectromechanical systems display element with photovoltaic structure
|
US7969638B2
(en)
|
2008-04-10 |
2011-06-28 |
Qualcomm Mems Technologies, Inc. |
Device having thin black mask and method of fabricating the same
|
TW201000910A
(en)
*
|
2008-04-21 |
2010-01-01 |
Top Eng Co Ltd |
Card for MEMS probe and method for manufacturing thereof
|
US8451077B2
(en)
|
2008-04-22 |
2013-05-28 |
International Business Machines Corporation |
MEMS switches with reduced switching voltage and methods of manufacture
|
US7993950B2
(en)
*
|
2008-04-30 |
2011-08-09 |
Cavendish Kinetics, Ltd. |
System and method of encapsulation
|
US8023191B2
(en)
*
|
2008-05-07 |
2011-09-20 |
Qualcomm Mems Technologies, Inc. |
Printable static interferometric images
|
US7956759B1
(en)
|
2008-05-13 |
2011-06-07 |
The United States Of America As Represented By The Secretary Of The Army |
Humidity sensitive cutoff fuse
|
US8023167B2
(en)
|
2008-06-25 |
2011-09-20 |
Qualcomm Mems Technologies, Inc. |
Backlight displays
|
WO2010039307A2
(en)
*
|
2008-06-26 |
2010-04-08 |
Cornell University |
Cmos integrated micromechanical resonators and methods for fabricating the same
|
US7859740B2
(en)
|
2008-07-11 |
2010-12-28 |
Qualcomm Mems Technologies, Inc. |
Stiction mitigation with integrated mech micro-cantilevers through vertical stress gradient control
|
US7977635B2
(en)
*
|
2008-08-08 |
2011-07-12 |
Oliver Edwards |
Radiant energy imager using null switching
|
US7855826B2
(en)
*
|
2008-08-12 |
2010-12-21 |
Qualcomm Mems Technologies, Inc. |
Method and apparatus to reduce or eliminate stiction and image retention in interferometric modulator devices
|
US8358266B2
(en)
|
2008-09-02 |
2013-01-22 |
Qualcomm Mems Technologies, Inc. |
Light turning device with prismatic light turning features
|
WO2010027145A1
(ko)
*
|
2008-09-05 |
2010-03-11 |
(주) 탑엔지니어링 |
Mems 프로브용 카드 및 그의 제조 방법
|
ITTO20080714A1
(it)
|
2008-09-30 |
2010-04-01 |
St Microelectronics Srl |
Dispositivo microelettromeccanico provvisto di una struttura antiadesione e relativo metodo di antiadesione
|
WO2010061364A2
(en)
|
2008-11-26 |
2010-06-03 |
Freescale Semiconductor, Inc. |
Electromechanical transducer device and method of forming a electromechanical transducer device
|
JP5605952B2
(ja)
|
2008-11-26 |
2014-10-15 |
フリースケール セミコンダクター インコーポレイテッド |
電気機械トランスデューサデバイスおよびその製造方法
|
US8257119B2
(en)
|
2008-12-19 |
2012-09-04 |
Honeywell International |
Systems and methods for affixing a silicon device to a support structure
|
US8445306B2
(en)
|
2008-12-24 |
2013-05-21 |
International Business Machines Corporation |
Hybrid MEMS RF switch and method of fabricating same
|
US8957485B2
(en)
*
|
2009-01-21 |
2015-02-17 |
Cavendish Kinetics, Ltd. |
Fabrication of MEMS based cantilever switches by employing a split layer cantilever deposition scheme
|
US8270056B2
(en)
|
2009-03-23 |
2012-09-18 |
Qualcomm Mems Technologies, Inc. |
Display device with openings between sub-pixels and method of making same
|
US8877648B2
(en)
*
|
2009-03-26 |
2014-11-04 |
Semprius, Inc. |
Methods of forming printable integrated circuit devices by selective etching to suspend the devices from a handling substrate and devices formed thereby
|
JP5187441B2
(ja)
*
|
2009-04-24 |
2013-04-24 |
株式会社村田製作所 |
Mems素子およびその製造方法
|
FR2946036B1
(fr)
|
2009-05-26 |
2011-11-25 |
Thales Sa |
Procede d'integration de micro-interrupteurs de type mems sur des substrats en gan comportant des composants electroniques de puissance
|
US8979349B2
(en)
|
2009-05-29 |
2015-03-17 |
Qualcomm Mems Technologies, Inc. |
Illumination devices and methods of fabrication thereof
|
JP2010284748A
(ja)
*
|
2009-06-11 |
2010-12-24 |
Toshiba Corp |
電気部品
|
US8513042B2
(en)
|
2009-06-29 |
2013-08-20 |
Freescale Semiconductor, Inc. |
Method of forming an electromechanical transducer device
|
JP2011017626A
(ja)
*
|
2009-07-09 |
2011-01-27 |
Sony Corp |
力学量検知部材及び力学量検知装置
|
TWM378928U
(en)
*
|
2009-07-29 |
2010-04-21 |
Pixart Imaging Inc |
Mems device and spring element of mems
|
JP5398411B2
(ja)
*
|
2009-08-10 |
2014-01-29 |
株式会社東芝 |
マイクロ可動デバイスおよびマイクロ可動デバイスの製造方法
|
US8138007B2
(en)
|
2009-08-26 |
2012-03-20 |
Freescale Semiconductor, Inc. |
MEMS device with stress isolation and method of fabrication
|
US8569091B2
(en)
*
|
2009-08-27 |
2013-10-29 |
International Business Machines Corporation |
Integrated circuit switches, design structure and methods of fabricating the same
|
US8270062B2
(en)
|
2009-09-17 |
2012-09-18 |
Qualcomm Mems Technologies, Inc. |
Display device with at least one movable stop element
|
US20110063068A1
(en)
*
|
2009-09-17 |
2011-03-17 |
The George Washington University |
Thermally actuated rf microelectromechanical systems switch
|
US8779886B2
(en)
*
|
2009-11-30 |
2014-07-15 |
General Electric Company |
Switch structures
|
US8826529B2
(en)
|
2009-09-23 |
2014-09-09 |
General Electric Company |
Method of forming a micro-electromechanical system device
|
US8354899B2
(en)
*
|
2009-09-23 |
2013-01-15 |
General Electric Company |
Switch structure and method
|
US8488228B2
(en)
|
2009-09-28 |
2013-07-16 |
Qualcomm Mems Technologies, Inc. |
Interferometric display with interferometric reflector
|
US20110123783A1
(en)
*
|
2009-11-23 |
2011-05-26 |
David Sherrer |
Multilayer build processses and devices thereof
|
CN102086017B
(zh)
*
|
2009-12-03 |
2014-11-26 |
原相科技股份有限公司 |
微机电元件及微机电弹簧元件
|
CN102110616B
(zh)
*
|
2009-12-25 |
2012-09-05 |
华东光电集成器件研究所 |
一种在ltcc基板上实现薄膜多层布线的方法
|
US8237263B2
(en)
*
|
2009-12-31 |
2012-08-07 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Method and apparatus for cooling an integrated circuit
|
EP3699939A1
(de)
|
2010-01-15 |
2020-08-26 |
Wispry, Inc. |
Gefederte mems-kondensatoren mit einstellbarem tragarm, rf mems und verfahren zum betrieb desselben
|
KR101067214B1
(ko)
*
|
2010-04-07 |
2011-09-22 |
삼성전기주식회사 |
인쇄회로기판 및 그 제조방법
|
KR20130100232A
(ko)
|
2010-04-09 |
2013-09-10 |
퀄컴 엠이엠에스 테크놀로지스, 인크. |
전기 기계 디바이스의 기계층 및 그 형성 방법
|
CN101814866B
(zh)
*
|
2010-04-16 |
2012-08-01 |
大连理工大学 |
一种电热驱动微结构的制作方法
|
US20110269295A1
(en)
*
|
2010-04-30 |
2011-11-03 |
Hopper Peter J |
Method of Forming a Semiconductor Wafer that Provides Galvanic Isolation
|
US8956903B2
(en)
|
2010-06-25 |
2015-02-17 |
International Business Machines Corporation |
Planar cavity MEMS and related structures, methods of manufacture and design structures
|
JP5667391B2
(ja)
*
|
2010-08-11 |
2015-02-12 |
日本電波工業株式会社 |
ディスク型mems振動子
|
FR2963784B1
(fr)
*
|
2010-08-11 |
2012-08-31 |
Univ Limoges |
Microsystemes electromecaniques a gaps d'air.
|
CN103109315A
(zh)
|
2010-08-17 |
2013-05-15 |
高通Mems科技公司 |
对干涉式显示装置中的电荷中性电极的激活和校准
|
US9057872B2
(en)
|
2010-08-31 |
2015-06-16 |
Qualcomm Mems Technologies, Inc. |
Dielectric enhanced mirror for IMOD display
|
DE102010047128A1
(de)
*
|
2010-09-30 |
2012-04-05 |
Infineon Technologies Ag |
Hallsensoranordnung zum redundanten Messen eines Magnetfeldes
|
KR20120064364A
(ko)
*
|
2010-12-09 |
2012-06-19 |
삼성전자주식회사 |
태양 전지의 제조 방법
|
US8735200B2
(en)
*
|
2010-12-13 |
2014-05-27 |
Sagnik Pal |
Fabrication of robust electrothermal MEMS with fast thermal response
|
US9221677B2
(en)
*
|
2010-12-20 |
2015-12-29 |
Rf Micro Devices, Inc. |
Composite sacrificial structure for reliably creating a contact gap in a MEMS switch
|
US20120174572A1
(en)
*
|
2011-01-10 |
2012-07-12 |
Donato Clausi |
Method for mechanical and electrical integration of sma wires to microsystems
|
US8171800B1
(en)
*
|
2011-01-25 |
2012-05-08 |
Continental Automotive Systems, Inc. |
Differential pressure sensor using dual backside absolute pressure sensing
|
US8962443B2
(en)
*
|
2011-01-31 |
2015-02-24 |
Avago Technologies General Ip (Singapore) Pte. Ltd. |
Semiconductor device having an airbridge and method of fabricating the same
|
US9134527B2
(en)
|
2011-04-04 |
2015-09-15 |
Qualcomm Mems Technologies, Inc. |
Pixel via and methods of forming the same
|
US8963159B2
(en)
|
2011-04-04 |
2015-02-24 |
Qualcomm Mems Technologies, Inc. |
Pixel via and methods of forming the same
|
US8531192B2
(en)
*
|
2011-04-15 |
2013-09-10 |
Robert Bosch Gmbh |
High-impedance MEMS switch
|
US8659816B2
(en)
|
2011-04-25 |
2014-02-25 |
Qualcomm Mems Technologies, Inc. |
Mechanical layer and methods of making the same
|
US8866300B1
(en)
|
2011-06-05 |
2014-10-21 |
Nuvotronics, Llc |
Devices and methods for solder flow control in three-dimensional microstructures
|
US8814601B1
(en)
|
2011-06-06 |
2014-08-26 |
Nuvotronics, Llc |
Batch fabricated microconnectors
|
CN103732526B
(zh)
*
|
2011-06-07 |
2016-04-06 |
维斯普瑞公司 |
用于在集成了cmos的mems电容性器件中优化电流密度的系统和方法
|
US8973250B2
(en)
|
2011-06-20 |
2015-03-10 |
International Business Machines Corporation |
Methods of manufacturing a micro-electro-mechanical system (MEMS) structure
|
US9120667B2
(en)
|
2011-06-20 |
2015-09-01 |
International Business Machines Corporation |
Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures
|
US8643140B2
(en)
*
|
2011-07-11 |
2014-02-04 |
United Microelectronics Corp. |
Suspended beam for use in MEMS device
|
US9993982B2
(en)
|
2011-07-13 |
2018-06-12 |
Nuvotronics, Inc. |
Methods of fabricating electronic and mechanical structures
|
CN102367165B
(zh)
*
|
2011-08-31 |
2015-01-21 |
华东光电集成器件研究所 |
一种基于soi的mems器件电极互连方法
|
CN102423258B
(zh)
*
|
2011-09-20 |
2013-12-25 |
上海交通大学 |
基于mems技术的无线传输可植入对称结构压力传感器
|
US20130106875A1
(en)
*
|
2011-11-02 |
2013-05-02 |
Qualcomm Mems Technologies, Inc. |
Method of improving thin-film encapsulation for an electromechanical systems assembly
|
US8736939B2
(en)
|
2011-11-04 |
2014-05-27 |
Qualcomm Mems Technologies, Inc. |
Matching layer thin-films for an electromechanical systems reflective display device
|
US9349558B2
(en)
*
|
2011-12-06 |
2016-05-24 |
Palo Alto Research Center Incorporated |
Mechanically acuated heat switch
|
FR2984010B1
(fr)
*
|
2011-12-09 |
2014-01-03 |
St Microelectronics Rousset |
Dispositif capacitif integre ayant une valeur capacitive thermiquement variable
|
FR2984013B1
(fr)
|
2011-12-09 |
2014-01-10 |
St Microelectronics Rousset |
Dispositif mecanique de commutation electrique integre possedant un etat bloque
|
US8673670B2
(en)
|
2011-12-15 |
2014-03-18 |
International Business Machines Corporation |
Micro-electro-mechanical system (MEMS) structures and design structures
|
US20130181893A1
(en)
*
|
2012-01-13 |
2013-07-18 |
Qualcomm Mems Technologies, Inc. |
Electrostatically transduced sensors composed of photochemically etched glass
|
FR2988712B1
(fr)
|
2012-04-02 |
2014-04-11 |
St Microelectronics Rousset |
Circuit integre equipe d'un dispositif de detection de son orientation spatiale et/ou d'un changement de cette orientation.
|
US8748999B2
(en)
*
|
2012-04-20 |
2014-06-10 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Capacitive sensors and methods for forming the same
|
CN104205343A
(zh)
*
|
2012-04-26 |
2014-12-10 |
惠普发展公司,有限责任合伙企业 |
可定制的非线性电器件
|
US8569115B1
(en)
|
2012-07-06 |
2013-10-29 |
LuxVue Technology Corporation |
Method of forming a compliant bipolar micro device transfer head with silicon electrodes
|
WO2014008110A1
(en)
*
|
2012-07-06 |
2014-01-09 |
LuxVue Technology Corporation |
Compliant bipolar micro device transfer head with silicon electrodes
|
US9162878B2
(en)
|
2012-08-30 |
2015-10-20 |
Innovative Micro Technology |
Wafer level hermetic bond using metal alloy with raised feature and wetting layer
|
US9325044B2
(en)
|
2013-01-26 |
2016-04-26 |
Nuvotronics, Inc. |
Multi-layer digital elliptic filter and method
|
JP6105304B2
(ja)
*
|
2013-01-31 |
2017-03-29 |
ルネサスエレクトロニクス株式会社 |
インダクタ装置及び半導体装置
|
US9306254B1
(en)
|
2013-03-15 |
2016-04-05 |
Nuvotronics, Inc. |
Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
|
US9306255B1
(en)
|
2013-03-15 |
2016-04-05 |
Nuvotronics, Inc. |
Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
|
US9233832B2
(en)
*
|
2013-05-10 |
2016-01-12 |
Globalfoundries Inc. |
Micro-electro-mechanical system (MEMS) structures and design structures
|
US9911563B2
(en)
|
2013-07-31 |
2018-03-06 |
Analog Devices Global |
MEMS switch device and method of fabrication
|
FR3009653B1
(fr)
*
|
2013-08-09 |
2015-08-07 |
Commissariat Energie Atomique |
Dispositif de conversion d'energie thermique en energie electrique
|
FR3012671B1
(fr)
*
|
2013-10-29 |
2015-11-13 |
St Microelectronics Rousset |
Dispositif mecanique integre a mouvement vertical
|
US9162868B2
(en)
|
2013-11-27 |
2015-10-20 |
Infineon Technologies Ag |
MEMS device
|
US10310009B2
(en)
|
2014-01-17 |
2019-06-04 |
Nuvotronics, Inc |
Wafer scale test interface unit and contactors
|
CN106413437B
(zh)
*
|
2014-01-24 |
2019-08-06 |
吉瑞高新科技股份有限公司 |
电池座、电子烟及电子烟的雾化控制方法
|
US9796578B2
(en)
*
|
2014-03-10 |
2017-10-24 |
Apple Inc. |
Microelectromechanical systems devices with improved reliability
|
US9385306B2
(en)
|
2014-03-14 |
2016-07-05 |
The United States Of America As Represented By The Secretary Of The Army |
Ferroelectric mechanical memory and method
|
CN106463311B
(zh)
*
|
2014-04-01 |
2019-01-22 |
维斯普瑞公司 |
减少rf mems致动器元件中表面介电充电的系统、装置和方法
|
EP2937311B1
(de)
*
|
2014-04-25 |
2019-08-21 |
Rolex Sa |
Herstellungsverfahren einer verstärkten uhrkomponente, entsprechende uhrkomponente und entsprechende uhr
|
US9274277B2
(en)
|
2014-05-15 |
2016-03-01 |
Globalfoundries Inc. |
Waveguide devices with supporting anchors
|
FR3022691B1
(fr)
|
2014-06-23 |
2016-07-01 |
Stmicroelectronics Rousset |
Dispositif capacitif commandable integre
|
CN105366624B
(zh)
*
|
2014-07-30 |
2017-06-13 |
中芯国际集成电路制造(上海)有限公司 |
一种半导体器件及其制造方法和电子装置
|
CN105428256B
(zh)
*
|
2014-07-30 |
2018-07-20 |
中芯国际集成电路制造(上海)有限公司 |
一种半导体器件及其制造方法和电子装置
|
US20160099112A1
(en)
*
|
2014-10-03 |
2016-04-07 |
wiSpry, Inc. . |
Systems, devices, and methods to reduce dielectric charging in micro-electro-mechanical systems devices
|
US10132699B1
(en)
|
2014-10-06 |
2018-11-20 |
National Technology & Engineering Solutions Of Sandia, Llc |
Electrodeposition processes for magnetostrictive resonators
|
US10847469B2
(en)
|
2016-04-26 |
2020-11-24 |
Cubic Corporation |
CTE compensation for wafer-level and chip-scale packages and assemblies
|
EP3224899A4
(de)
|
2014-12-03 |
2018-08-22 |
Nuvotronics, Inc. |
Systeme und verfahren zur herstellung von gestapelten schaltungen und übertragungsleitungen
|
US9466452B1
(en)
|
2015-03-31 |
2016-10-11 |
Stmicroelectronics, Inc. |
Integrated cantilever switch
|
FR3034567B1
(fr)
|
2015-03-31 |
2017-04-28 |
St Microelectronics Rousset |
Dispositif metallique a piece(s) mobile(s) ameliore loge dans une cavite de la partie d'interconnexion (" beol ") d'un circuit integre
|
US9971970B1
(en)
|
2015-04-27 |
2018-05-15 |
Rigetti & Co, Inc. |
Microwave integrated quantum circuits with VIAS and methods for making the same
|
WO2017019557A1
(en)
*
|
2015-07-24 |
2017-02-02 |
Trustees Of Boston University |
Mems devices for smart lighting applications
|
WO2017200621A2
(en)
*
|
2016-02-29 |
2017-11-23 |
The Regents Of The University Of Michigan |
Assembly processes for three-dimensional microstructures
|
JP2019517147A
(ja)
|
2016-05-20 |
2019-06-20 |
メイコム テクノロジー ソリューションズ ホールディングス インコーポレイテッド |
半導体レーザ及び半導体レーザの平坦化のためのプロセス
|
US20180079640A1
(en)
*
|
2016-09-22 |
2018-03-22 |
Innovative Micro Technology |
Mems device with offset electrode
|
CN107917750B
(zh)
*
|
2016-10-08 |
2020-06-26 |
北京大学 |
一种mems热式声粒子传感器
|
CN107915280B
(zh)
*
|
2016-10-11 |
2020-05-26 |
青岛经济技术开发区海尔热水器有限公司 |
一种双循环模式的水吧系统
|
DE102016122525B4
(de)
*
|
2016-11-22 |
2019-09-19 |
Infineon Technologies Ag |
Sensorbauelemente eines mikroelektronischen Systems
|
US10996125B2
(en)
*
|
2017-05-17 |
2021-05-04 |
Infineon Technologies Ag |
Pressure sensors and method for forming a MEMS pressure sensor
|
US11121301B1
(en)
|
2017-06-19 |
2021-09-14 |
Rigetti & Co, Inc. |
Microwave integrated quantum circuits with cap wafers and their methods of manufacture
|
US11276727B1
(en)
|
2017-06-19 |
2022-03-15 |
Rigetti & Co, Llc |
Superconducting vias for routing electrical signals through substrates and their methods of manufacture
|
KR102471766B1
(ko)
*
|
2017-07-24 |
2022-11-29 |
스파크 써미오닉스, 인크. |
소형 갭 장치 시스템 및 제조 방법
|
JP6842386B2
(ja)
*
|
2017-08-31 |
2021-03-17 |
キオクシア株式会社 |
半導体装置
|
WO2019090057A1
(en)
*
|
2017-11-02 |
2019-05-09 |
Nextinput, Inc. |
Sealed force sensor with etch stop layer
|
US10720338B1
(en)
|
2017-11-07 |
2020-07-21 |
Honeywell Federal Manufacturing & Technologies, Llc |
Low temperature cofired ceramic substrates and fabrication techniques for the same
|
US10319654B1
(en)
|
2017-12-01 |
2019-06-11 |
Cubic Corporation |
Integrated chip scale packages
|
US11040871B2
(en)
*
|
2017-12-14 |
2021-06-22 |
Invensense, Inc. |
Device comprising a micro-electro-mechanical system substrate with protrusions of different heights that has been integrated with a complementary metal-oxide-semiconductor substrate
|
US11464140B2
(en)
|
2019-12-06 |
2022-10-04 |
Frore Systems Inc. |
Centrally anchored MEMS-based active cooling systems
|
US11710678B2
(en)
|
2018-08-10 |
2023-07-25 |
Frore Systems Inc. |
Combined architecture for cooling devices
|
GB201815797D0
(en)
|
2018-09-27 |
2018-11-14 |
Sofant Tech Ltd |
Mems devices and circuits including same
|
US10793422B2
(en)
*
|
2018-12-17 |
2020-10-06 |
Vanguard International Semiconductor Singapore Pte. Ltd. |
Microelectromechanical systems packages and methods for packaging a microelectromechanical systems device
|
TWI708424B
(zh)
*
|
2019-07-04 |
2020-10-21 |
國家中山科學研究院 |
直接平貼式主動頻率選擇表面之開關元件與其製作方法
|
US11802554B2
(en)
|
2019-10-30 |
2023-10-31 |
Frore Systems Inc. |
MEMS-based airflow system having a vibrating fan element arrangement
|
US11510341B2
(en)
*
|
2019-12-06 |
2022-11-22 |
Frore Systems Inc. |
Engineered actuators usable in MEMs active cooling devices
|
US11796262B2
(en)
|
2019-12-06 |
2023-10-24 |
Frore Systems Inc. |
Top chamber cavities for center-pinned actuators
|
CN113336187A
(zh)
*
|
2020-02-14 |
2021-09-03 |
绍兴中芯集成电路制造股份有限公司 |
Mems器件封装方法及封装结构
|
CN116325139A
(zh)
|
2020-10-02 |
2023-06-23 |
福珞尔系统公司 |
主动式热沉
|
US20230068451A1
(en)
*
|
2021-08-30 |
2023-03-02 |
Texas Instruments Incorporated |
Methods and apparatus to thermally actuate microelectromechanical structures devices
|
WO2023059519A2
(en)
*
|
2021-10-04 |
2023-04-13 |
Formfactor, Inc. |
Thermal management techniques for high power integrated circuits operating in dry cryogenic environments
|