DE60227899D1 - Induktor und Verfahren zu seiner Herstellung - Google Patents
Induktor und Verfahren zu seiner HerstellungInfo
- Publication number
- DE60227899D1 DE60227899D1 DE60227899T DE60227899T DE60227899D1 DE 60227899 D1 DE60227899 D1 DE 60227899D1 DE 60227899 T DE60227899 T DE 60227899T DE 60227899 T DE60227899 T DE 60227899T DE 60227899 D1 DE60227899 D1 DE 60227899D1
- Authority
- DE
- Germany
- Prior art keywords
- inductor
- production
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/10—Inductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0113055A FR2830670A1 (fr) | 2001-10-10 | 2001-10-10 | Inductance et son procede de fabrication |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60227899D1 true DE60227899D1 (de) | 2008-09-11 |
Family
ID=8868137
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60227899T Expired - Fee Related DE60227899D1 (de) | 2001-10-10 | 2002-10-09 | Induktor und Verfahren zu seiner Herstellung |
Country Status (5)
Country | Link |
---|---|
US (1) | US7404249B2 (de) |
EP (1) | EP1302955B1 (de) |
KR (1) | KR100938501B1 (de) |
DE (1) | DE60227899D1 (de) |
FR (1) | FR2830670A1 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0318146D0 (en) * | 2003-08-02 | 2003-09-03 | Zetex Plc | Bipolar transistor with a low saturation voltage |
JP5574639B2 (ja) * | 2009-08-21 | 2014-08-20 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
US8697574B2 (en) | 2009-09-25 | 2014-04-15 | Infineon Technologies Ag | Through substrate features in semiconductor substrates |
US8368174B1 (en) * | 2010-07-09 | 2013-02-05 | Altera Corporation | Compensation network using an on-die compensation inductor |
US9287344B2 (en) | 2010-08-23 | 2016-03-15 | The Hong Kong University Of Science And Technology | Monolithic magnetic induction device |
US10872843B2 (en) | 2017-05-02 | 2020-12-22 | Micron Technology, Inc. | Semiconductor devices with back-side coils for wireless signal and power coupling |
US10121739B1 (en) | 2017-05-02 | 2018-11-06 | Micron Technology, Inc. | Multi-die inductors with coupled through-substrate via cores |
US20180323253A1 (en) * | 2017-05-02 | 2018-11-08 | Micron Technology, Inc. | Semiconductor devices with through-substrate coils for wireless signal and power coupling |
US20180323369A1 (en) | 2017-05-02 | 2018-11-08 | Micron Technology, Inc. | Inductors with through-substrate via cores |
US10134671B1 (en) | 2017-05-02 | 2018-11-20 | Micron Technology, Inc. | 3D interconnect multi-die inductors with through-substrate via cores |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3415679A (en) * | 1965-07-09 | 1968-12-10 | Western Electric Co | Metallization of selected regions of surfaces and products so formed |
US5363080A (en) | 1991-12-27 | 1994-11-08 | Avx Corporation | High accuracy surface mount inductor |
US5545916A (en) | 1994-12-06 | 1996-08-13 | At&T Corp. | High Q integrated inductor |
US5736749A (en) * | 1996-11-19 | 1998-04-07 | Lucent Technologies Inc. | Integrated circuit device with inductor incorporated therein |
JPH10303037A (ja) * | 1997-04-23 | 1998-11-13 | Fuji Electric Co Ltd | 薄膜積層型磁気誘導素子およびその製造方法 |
SG74672A1 (en) * | 1997-12-29 | 2000-08-22 | Texas Instruments Inc | Integrated circuit and method of using porous silicon to achieve component isolation in radio frequency applications |
US6211073B1 (en) * | 1998-02-27 | 2001-04-03 | Micron Technology, Inc. | Methods for making copper and other metal interconnections in integrated circuits |
KR100288776B1 (ko) * | 1998-03-16 | 2001-06-01 | 이장무 | 반도체장치의인덕터및그제조방법 |
FR2793943B1 (fr) * | 1999-05-18 | 2001-07-13 | Memscap | Micro-composants du type micro-inductance ou micro- transformateur, et procede de fabrication de tels micro- composants |
US6307247B1 (en) * | 1999-07-12 | 2001-10-23 | Robert Bruce Davies | Monolithic low dielectric constant platform for passive components and method |
JP2001168289A (ja) * | 1999-12-13 | 2001-06-22 | Seiko Epson Corp | インダクタ、半導体装置、半導体装置の製造方法 |
US6531945B1 (en) * | 2000-03-10 | 2003-03-11 | Micron Technology, Inc. | Integrated circuit inductor with a magnetic core |
US6417755B1 (en) * | 2000-08-25 | 2002-07-09 | Conexant Systems, Inc. | Method for fabrication of high inductance inductors and related structure |
-
2001
- 2001-10-10 FR FR0113055A patent/FR2830670A1/fr active Pending
-
2002
- 2002-10-09 DE DE60227899T patent/DE60227899D1/de not_active Expired - Fee Related
- 2002-10-09 EP EP02354158A patent/EP1302955B1/de not_active Expired - Fee Related
- 2002-10-10 US US10/268,648 patent/US7404249B2/en not_active Expired - Lifetime
- 2002-10-10 KR KR1020020061902A patent/KR100938501B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20030030958A (ko) | 2003-04-18 |
FR2830670A1 (fr) | 2003-04-11 |
US7404249B2 (en) | 2008-07-29 |
US20030066184A1 (en) | 2003-04-10 |
KR100938501B1 (ko) | 2010-01-25 |
EP1302955A1 (de) | 2003-04-16 |
EP1302955B1 (de) | 2008-07-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8339 | Ceased/non-payment of the annual fee |