DE60219607D1 - Flexible mikrochip-vorrichtungen zur ophthalmologischen und anderen applikation - Google Patents
Flexible mikrochip-vorrichtungen zur ophthalmologischen und anderen applikationInfo
- Publication number
- DE60219607D1 DE60219607D1 DE60219607T DE60219607T DE60219607D1 DE 60219607 D1 DE60219607 D1 DE 60219607D1 DE 60219607 T DE60219607 T DE 60219607T DE 60219607 T DE60219607 T DE 60219607T DE 60219607 D1 DE60219607 D1 DE 60219607D1
- Authority
- DE
- Germany
- Prior art keywords
- ophthalmological
- application
- microchip devices
- eye
- drug
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K9/00—Medicinal preparations characterised by special physical form
- A61K9/0012—Galenical forms characterised by the site of application
- A61K9/0048—Eye, e.g. artificial tears
- A61K9/0051—Ocular inserts, ocular implants
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F9/00—Methods or devices for treatment of the eyes; Devices for putting-in contact lenses; Devices to correct squinting; Apparatus to guide the blind; Protective devices for the eyes, carried on the body or in the hand
- A61F9/0008—Introducing ophthalmic products into the ocular cavity or retaining products therein
- A61F9/0017—Introducing ophthalmic products into the ocular cavity or retaining products therein implantable in, or in contact with, the eye, e.g. ocular inserts
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K9/00—Medicinal preparations characterised by special physical form
- A61K9/0002—Galenical forms characterised by the drug release technique; Application systems commanded by energy
- A61K9/0009—Galenical forms characterised by the drug release technique; Application systems commanded by energy involving or responsive to electricity, magnetism or acoustic waves; Galenical aspects of sonophoresis, iontophoresis, electroporation or electroosmosis
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K9/00—Medicinal preparations characterised by special physical form
- A61K9/0012—Galenical forms characterised by the site of application
- A61K9/0048—Eye, e.g. artificial tears
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K9/00—Medicinal preparations characterised by special physical form
- A61K9/0087—Galenical forms not covered by A61K9/02 - A61K9/7023
- A61K9/0097—Micromachined devices; Microelectromechanical systems [MEMS]; Devices obtained by lithographic treatment of silicon; Devices comprising chips
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61P—SPECIFIC THERAPEUTIC ACTIVITY OF CHEMICAL COMPOUNDS OR MEDICINAL PREPARATIONS
- A61P9/00—Drugs for disorders of the cardiovascular system
- A61P9/10—Drugs for disorders of the cardiovascular system for treating ischaemic or atherosclerotic diseases, e.g. antianginal drugs, coronary vasodilators, drugs for myocardial infarction, retinopathy, cerebrovascula insufficiency, renal arteriosclerosis
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01011—Sodium [Na]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12043—Photo diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US26072501P | 2001-01-09 | 2001-01-09 | |
US260725P | 2001-01-09 | ||
PCT/US2002/000581 WO2002055058A2 (en) | 2001-01-09 | 2002-01-09 | Flexible microchip devices for ophthalmic and other applications |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60219607D1 true DE60219607D1 (de) | 2007-05-31 |
DE60219607T2 DE60219607T2 (de) | 2007-12-27 |
Family
ID=22990347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60219607T Expired - Lifetime DE60219607T2 (de) | 2001-01-09 | 2002-01-09 | Flexible mikrochip-vorrichtungen zur ophthalmologischen und anderen applikation |
Country Status (8)
Country | Link |
---|---|
US (5) | US6976982B2 (de) |
EP (1) | EP1372602B1 (de) |
JP (3) | JP4657577B2 (de) |
AT (1) | ATE359762T1 (de) |
AU (1) | AU2002241834B2 (de) |
CA (1) | CA2432438C (de) |
DE (1) | DE60219607T2 (de) |
WO (1) | WO2002055058A2 (de) |
Families Citing this family (297)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2001012157A1 (en) * | 1999-08-18 | 2001-02-22 | Microchips, Inc. | Thermally-activated microchip chemical delivery devices |
AU782639B2 (en) * | 1999-12-10 | 2005-08-18 | Massachusetts Institute Of Technology | Microchip devices for delivery of molecules and methods of fabrication thereof |
AU2001252890B2 (en) * | 2000-03-02 | 2005-06-02 | Microchips, Inc. | Microfabricated devices for the storage and selective exposure of chemicals and devices |
DE60116520T2 (de) * | 2000-10-10 | 2006-08-31 | Microchips, Inc., Bedford | Microchip-reservoir-vorrichtungen mit drahtloser übertragung von energie und daten |
AU2002241834B2 (en) * | 2001-01-09 | 2006-11-09 | Microchips, Inc. | Flexible microchip devices for opthalmic and other applications |
US7431710B2 (en) | 2002-04-08 | 2008-10-07 | Glaukos Corporation | Ocular implants with anchors and methods thereof |
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AU2002326304A1 (en) * | 2001-05-31 | 2002-12-16 | Massachusetts Institute Of Technology | Microchip devices with improved reservoir opening |
EP1404297B1 (de) | 2001-06-12 | 2011-04-27 | The Johns Hopkins University School Of Medicine | Reservoirvorrichtung für die intraokulare arzneimittelabgabe |
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-
2002
- 2002-01-09 AU AU2002241834A patent/AU2002241834B2/en not_active Ceased
- 2002-01-09 US US10/042,996 patent/US6976982B2/en not_active Expired - Fee Related
- 2002-01-09 WO PCT/US2002/000581 patent/WO2002055058A2/en active IP Right Grant
- 2002-01-09 EP EP02707424A patent/EP1372602B1/de not_active Expired - Lifetime
- 2002-01-09 JP JP2002555792A patent/JP4657577B2/ja not_active Expired - Fee Related
- 2002-01-09 DE DE60219607T patent/DE60219607T2/de not_active Expired - Lifetime
- 2002-01-09 CA CA2432438A patent/CA2432438C/en not_active Expired - Fee Related
- 2002-01-09 AT AT02707424T patent/ATE359762T1/de not_active IP Right Cessation
-
2005
- 2005-12-01 US US11/291,973 patent/US7582080B2/en not_active Expired - Fee Related
-
2007
- 2007-10-26 US US11/925,466 patent/US7879019B2/en not_active Expired - Fee Related
- 2007-10-26 US US11/925,507 patent/US7776024B2/en not_active Expired - Fee Related
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2009
- 2009-01-05 JP JP2009000222A patent/JP4354521B2/ja not_active Expired - Fee Related
- 2009-12-04 JP JP2009277085A patent/JP2010099483A/ja active Pending
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2011
- 2011-01-24 US US13/012,426 patent/US8308707B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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WO2002055058A3 (en) | 2003-10-16 |
US20060178655A1 (en) | 2006-08-10 |
CA2432438C (en) | 2011-04-26 |
US7582080B2 (en) | 2009-09-01 |
DE60219607T2 (de) | 2007-12-27 |
EP1372602A2 (de) | 2004-01-02 |
US7879019B2 (en) | 2011-02-01 |
JP2010099483A (ja) | 2010-05-06 |
JP4354521B2 (ja) | 2009-10-28 |
US8308707B2 (en) | 2012-11-13 |
US20080221557A1 (en) | 2008-09-11 |
JP4657577B2 (ja) | 2011-03-23 |
EP1372602B1 (de) | 2007-04-18 |
AU2002241834B2 (en) | 2006-11-09 |
US7776024B2 (en) | 2010-08-17 |
US20020099359A1 (en) | 2002-07-25 |
US20110172587A1 (en) | 2011-07-14 |
CA2432438A1 (en) | 2002-07-18 |
JP2004517858A (ja) | 2004-06-17 |
US20080071252A1 (en) | 2008-03-20 |
ATE359762T1 (de) | 2007-05-15 |
JP2009142661A (ja) | 2009-07-02 |
US6976982B2 (en) | 2005-12-20 |
WO2002055058A2 (en) | 2002-07-18 |
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