DE60217206D1 - Gasgekühlte elektrostatische Halteplatte mit stiftförmigen Distanzhaltern für Vakuumanwendungen - Google Patents

Gasgekühlte elektrostatische Halteplatte mit stiftförmigen Distanzhaltern für Vakuumanwendungen

Info

Publication number
DE60217206D1
DE60217206D1 DE60217206T DE60217206T DE60217206D1 DE 60217206 D1 DE60217206 D1 DE 60217206D1 DE 60217206 T DE60217206 T DE 60217206T DE 60217206 T DE60217206 T DE 60217206T DE 60217206 D1 DE60217206 D1 DE 60217206D1
Authority
DE
Germany
Prior art keywords
pin
gas
holding plate
shaped spacers
electrostatic holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60217206T
Other languages
English (en)
Inventor
Michael Sogard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Application granted granted Critical
Publication of DE60217206D1 publication Critical patent/DE60217206D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE60217206T 2001-03-13 2002-03-13 Gasgekühlte elektrostatische Halteplatte mit stiftförmigen Distanzhaltern für Vakuumanwendungen Expired - Lifetime DE60217206D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/808,210 US6628503B2 (en) 2001-03-13 2001-03-13 Gas cooled electrostatic pin chuck for vacuum applications

Publications (1)

Publication Number Publication Date
DE60217206D1 true DE60217206D1 (de) 2007-02-15

Family

ID=25198184

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60217206T Expired - Lifetime DE60217206D1 (de) 2001-03-13 2002-03-13 Gasgekühlte elektrostatische Halteplatte mit stiftförmigen Distanzhaltern für Vakuumanwendungen

Country Status (5)

Country Link
US (1) US6628503B2 (de)
EP (1) EP1241706B1 (de)
JP (1) JP4218248B2 (de)
KR (1) KR20020073273A (de)
DE (1) DE60217206D1 (de)

Families Citing this family (89)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
DE10143173A1 (de) 2000-12-04 2002-06-06 Cascade Microtech Inc Wafersonde
TWI272689B (en) * 2001-02-16 2007-02-01 Tokyo Electron Ltd Method and apparatus for transferring heat from a substrate to a chuck
US6970634B2 (en) * 2001-05-04 2005-11-29 Cascade Microtech, Inc. Fiber optic wafer probe
AU2002327490A1 (en) 2001-08-21 2003-06-30 Cascade Microtech, Inc. Membrane probing system
JP2003174077A (ja) * 2001-12-04 2003-06-20 Lintec Corp 吸着保持装置
DE10216786C5 (de) * 2002-04-15 2009-10-15 Ers Electronic Gmbh Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden
JP2004228456A (ja) * 2003-01-27 2004-08-12 Canon Inc 露光装置
EP1447715A3 (de) * 2003-02-12 2009-09-02 ASML Netherlands B.V. Lithographischer Apparat und Verfahren zur Feststellung der korrekten Festklemmung eines Objekts
JP2004363559A (ja) * 2003-05-14 2004-12-24 Canon Inc 光学部材保持装置
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
JP4470199B2 (ja) * 2003-09-25 2010-06-02 Ｓｍｃ株式会社 半導体基板の温度調節装置
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
US7198276B2 (en) * 2003-10-24 2007-04-03 International Business Machines Corporation Adaptive electrostatic pin chuck
US7019820B2 (en) * 2003-12-16 2006-03-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP2267535A1 (de) 2003-11-05 2010-12-29 ASML Netherlands BV Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
EP1530088B1 (de) * 2003-11-05 2007-08-08 ASML Netherlands B.V. Lithographischer Apparat
US7663860B2 (en) 2003-12-05 2010-02-16 Tokyo Electron Limited Electrostatic chuck
US6897945B1 (en) * 2003-12-15 2005-05-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7088431B2 (en) * 2003-12-17 2006-08-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7427868B2 (en) 2003-12-24 2008-09-23 Cascade Microtech, Inc. Active wafer probe
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
JP4636807B2 (ja) * 2004-03-18 2011-02-23 キヤノン株式会社 基板保持装置およびそれを用いた露光装置
US7133120B2 (en) 2004-05-04 2006-11-07 Asml Netherlands B.V. Lithographic apparatus, article support member, and method
US8749762B2 (en) 2004-05-11 2014-06-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7737412B2 (en) * 2004-07-12 2010-06-15 The Regents Of The University Of California Electron microscope phase enhancement
US7548303B2 (en) * 2004-09-04 2009-06-16 Nikon Corporation Cooling assembly for a stage
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
JP2006105789A (ja) * 2004-10-05 2006-04-20 Canon Inc 温度計測装置及び露光装置
US20060090855A1 (en) * 2004-10-29 2006-05-04 Tokyo Electron Limited Substrate mounting table, substrate processing apparatus and substrate temperature control method
CN100382275C (zh) * 2004-10-29 2008-04-16 东京毅力科创株式会社 基板载置台、基板处理装置及基板的温度控制方法
KR101939525B1 (ko) * 2004-12-15 2019-01-16 가부시키가이샤 니콘 기판 유지 장치, 노광 장치 및 디바이스 제조방법
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US20060271302A1 (en) * 2005-05-27 2006-11-30 Ehrlich James L Method of Assessing Productivity of Lactating Animals Using Fitted Parameters to a Mechanistic Lactation Model
US7372549B2 (en) * 2005-06-24 2008-05-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7802917B2 (en) * 2005-08-05 2010-09-28 Lam Research Corporation Method and apparatus for chuck thermal calibration
JP4125315B2 (ja) * 2005-10-11 2008-07-30 キヤノン株式会社 露光装置及びデバイス製造方法
US7432513B2 (en) * 2005-10-21 2008-10-07 Asml Netherlands B.V. Gas shower, lithographic apparatus and use of a gas shower
CN100419989C (zh) * 2005-12-05 2008-09-17 北京北方微电子基地设备工艺研究中心有限责任公司 静电卡盘
KR100689843B1 (ko) * 2006-01-03 2007-03-08 삼성전자주식회사 웨이퍼 스테이지 및 이를 이용한 웨이퍼 안착방법
KR100842739B1 (ko) 2006-05-02 2008-07-01 주식회사 하이닉스반도체 고밀도 플라즈마 증착 장치의 정전척
US7978308B2 (en) * 2006-05-15 2011-07-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7593096B2 (en) * 2006-05-15 2009-09-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
DE102006042026B4 (de) 2006-09-07 2016-08-04 Infineon Technologies Ag Vorrichtung zum Halten eines Substrats und Verfahren zur Behandlung eines Substrats
JP4899879B2 (ja) * 2007-01-17 2012-03-21 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
US20080316461A1 (en) * 2007-06-21 2008-12-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101232234B1 (ko) * 2007-06-21 2013-02-12 에이에스엠엘 네델란즈 비.브이. 클램핑 디바이스 및 대상물 로딩 방법
US8446566B2 (en) 2007-09-04 2013-05-21 Asml Netherlands B.V. Method of loading a substrate on a substrate table and lithographic apparatus and device manufacturing method
US9013682B2 (en) * 2007-06-21 2015-04-21 Asml Netherlands B.V. Clamping device and object loading method
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US20090086187A1 (en) * 2007-08-09 2009-04-02 Asml Netherlands Lithographic Apparatus and Device Manufacturing Method
US9036326B2 (en) * 2008-04-30 2015-05-19 Axcelis Technologies, Inc. Gas bearing electrostatic chuck
TWI475594B (zh) 2008-05-19 2015-03-01 Entegris Inc 靜電夾頭
US8596336B2 (en) * 2008-06-03 2013-12-03 Applied Materials, Inc. Substrate support temperature control
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
JP2010129929A (ja) * 2008-11-28 2010-06-10 Canon Inc 基板保持装置、基板保持方法、露光装置およびデバイス製造方法
US8851133B2 (en) * 2009-03-31 2014-10-07 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus of holding a device
WO2010132640A2 (en) 2009-05-15 2010-11-18 Entegris, Inc. Electrostatic chuck with polymer protrusions
US8861170B2 (en) 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
JP5195711B2 (ja) * 2009-10-13 2013-05-15 東京エレクトロン株式会社 基板冷却装置、基板冷却方法及び記憶媒体
JP6014587B2 (ja) 2010-05-28 2016-10-25 インテグリス・インコーポレーテッド 高表面抵抗率の静電チャック
CN102736429B (zh) * 2011-04-07 2015-06-17 上海微电子装备有限公司 硅片温度稳定装置
JP5550602B2 (ja) * 2011-04-28 2014-07-16 パナソニック株式会社 静電チャックおよびこれを備えるドライエッチング装置
CN102914951B (zh) * 2011-08-04 2014-11-12 上海微电子装备有限公司 用于光刻设备的预对准装置
CN102445857B (zh) * 2011-10-12 2013-10-02 上海华力微电子有限公司 一种光刻机温控硅片载物台
CN102445856B (zh) * 2011-10-12 2014-12-10 上海华力微电子有限公司 一种光刻机硅片载物台温度控制系统及其控制方法
TWI448706B (zh) * 2012-12-24 2014-08-11 Chroma Ate Inc 具有乾燥環境之測試平台
CN103901359B (zh) * 2012-12-31 2016-06-29 致茂电子(苏州)有限公司 具有干燥环境的测试平台
JP2014216503A (ja) * 2013-04-25 2014-11-17 キヤノン株式会社 保持部材、処理装置及び物品の製造方法
US10236202B2 (en) * 2013-11-11 2019-03-19 Diablo Capital, Inc. System and method for adhering a semiconductive wafer to a mobile electrostatic carrier through a vacuum
WO2016135565A1 (en) 2015-02-23 2016-09-01 M Cubed Technologies, Inc. Film electrode for electrostatic chuck
JP6510461B2 (ja) * 2016-05-25 2019-05-08 日本特殊陶業株式会社 基板保持装置
US10867816B2 (en) * 2016-12-13 2020-12-15 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for wafer backside cooling
US11201078B2 (en) * 2017-02-14 2021-12-14 Applied Materials, Inc. Substrate position calibration for substrate supports in substrate processing systems
JP7239560B2 (ja) * 2018-03-26 2023-03-14 日本碍子株式会社 静電チャックヒータ
CN110323150B (zh) * 2018-03-30 2021-12-31 上海微电子装备（集团）股份有限公司 温度控制装置
CN110896045B (zh) 2018-09-12 2022-12-30 中微半导体设备(上海)股份有限公司 一种升举顶针组件，静电夹盘及其所在的处理装置
EP4134748A1 (de) * 2021-08-12 2023-02-15 ASML Netherlands B.V. Elektrostatischer halter, objekttisch und lithografische vorrichtung
WO2023016738A1 (en) * 2021-08-12 2023-02-16 Asml Netherlands B.V. Electrostatic holder, object table and lithographic apparatus

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4213698A (en) 1978-12-01 1980-07-22 Bell Telephone Laboratories, Incorporated Apparatus and method for holding and planarizing thin workpieces
US4551192A (en) 1983-06-30 1985-11-05 International Business Machines Corporation Electrostatic or vacuum pinchuck formed with microcircuit lithography
JPS6060060A (ja) 1983-09-12 1985-04-06 株式会社日立製作所 鉄道車両の扉開閉装置
US4603466A (en) 1984-02-17 1986-08-05 Gca Corporation Wafer chuck
US4544446A (en) 1984-07-24 1985-10-01 J. T. Baker Chemical Co. VLSI chemical reactor
US4676649A (en) * 1985-11-27 1987-06-30 Compact Spindle Bearing Corp. Multi-axis gas bearing stage assembly
DE3943478C2 (de) 1989-05-08 1995-11-16 Philips Electronics Nv Werkstückträger für ein scheibenförmiges Werkstück, sowie Vakuumbehandlungsanlage
US5197089A (en) * 1990-05-21 1993-03-23 Hampshire Instruments, Inc. Pin chuck for lithography system
US5230741A (en) 1990-07-16 1993-07-27 Novellus Systems, Inc. Gas-based backside protection during substrate processing
JPH07110455B2 (ja) 1992-10-27 1995-11-29 住友電気工業株式会社 ウェハ固定装置
JPH0758191A (ja) 1993-08-13 1995-03-03 Toshiba Corp ウェハステージ装置
JPH07153825A (ja) * 1993-11-29 1995-06-16 Toto Ltd 静電チャック及びこの静電チャックを用いた被吸着体の処理方法
US5885469B1 (en) 1996-11-05 2000-08-08 Applied Materials Inc Topographical structure of an electrostatic chuck and method of fabricating same
US6278600B1 (en) * 1994-01-31 2001-08-21 Applied Materials, Inc. Electrostatic chuck with improved temperature control and puncture resistance
US5548470A (en) 1994-07-19 1996-08-20 International Business Machines Corporation Characterization, modeling, and design of an electrostatic chuck with improved wafer temperature uniformity
TW286414B (en) 1995-07-10 1996-09-21 Watkins Johnson Co Electrostatic chuck assembly
US5810933A (en) * 1996-02-16 1998-09-22 Novellus Systems, Inc. Wafer cooling device
JP2002009139A (ja) 2000-06-20 2002-01-11 Nikon Corp 静電チャック

Also Published As

Publication number Publication date
EP1241706A2 (de) 2002-09-18
EP1241706A3 (de) 2004-02-18
JP4218248B2 (ja) 2009-02-04
US20020130276A1 (en) 2002-09-19
US6628503B2 (en) 2003-09-30
KR20020073273A (ko) 2002-09-23
EP1241706B1 (de) 2007-01-03
JP2002305238A (ja) 2002-10-18

Similar Documents

Publication Publication Date Title
DE60217206D1 (de) Gasgekühlte elektrostatische Halteplatte mit stiftförmigen Distanzhaltern für Vakuumanwendungen
NO20041098L (no) Ledende mikrotiterplate
DE60137791D1 (de) Dünnfilme für magnetische vorrichtungen
ATA10432001A (de) Magnetsetzroboter
IT1316047B1 (it) Unita lineare di manipolazione
DE60220697D1 (de) Plattenkassette
DE60218747D1 (de) Brennstoffzellen
FI20010400A0 (fi) Laite lasilevyjen taivuttamiseksi
DE60230016D1 (de) Brennstoffzelle
DE60221626D1 (de) Einzel/Doppelbogenstapler
ATE551446T1 (de) Kathodenplatte
DE50202931D1 (de) Halbleiterstruktur mit feldplatte
DE60204747D1 (de) Biegeplatte
DE60114684D1 (de) Platten-Klemmen-Anordnung
ITMI20021318A1 (it) Apparecchio di commutazione multipolare con custodia doppia
NO20030463L (no) Eksplosjonssikre elektriske systemer
ITTO20020702A1 (it) Struttura di piastra di serraggio circolare doppia per
DE50212362D1 (de) Elektrodynamischer linearantrieb
ITMI20020081A0 (it) Telaio con piastra di montaggio per dispositivi elettrici
SE0203782L (sv) Fästplatta
DE60206986D1 (de) Befestigungsplatte
ITMI20010420V0 (it) Struttura di cronotermostato con placca intercambiabile.
ITMI20020221V0 (it) Flacone con targhetta magnetica
UA5694S (uk) Плита електрична
NO20033027D0 (no) Skiltplate

Legal Events

Date Code Title Description
8332 No legal effect for de