DE602005027431D1 - Preiswerter Piezo-Druckkopf auf der Basis mikrofluidischer Elemente in einer Leiterplatte und siebgedruckter piezoelektrischer Elemente - Google Patents

Preiswerter Piezo-Druckkopf auf der Basis mikrofluidischer Elemente in einer Leiterplatte und siebgedruckter piezoelektrischer Elemente

Info

Publication number
DE602005027431D1
DE602005027431D1 DE602005027431T DE602005027431T DE602005027431D1 DE 602005027431 D1 DE602005027431 D1 DE 602005027431D1 DE 602005027431 T DE602005027431 T DE 602005027431T DE 602005027431 T DE602005027431 T DE 602005027431T DE 602005027431 D1 DE602005027431 D1 DE 602005027431D1
Authority
DE
Germany
Prior art keywords
printed
elements
screen
circuit board
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005027431T
Other languages
English (en)
Inventor
Scott A Elrod
John S Fitch
David K Biegelsen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Palo Alto Research Center Inc
Original Assignee
Palo Alto Research Center Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Palo Alto Research Center Inc filed Critical Palo Alto Research Center Inc
Publication of DE602005027431D1 publication Critical patent/DE602005027431D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14491—Electrical connection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/12—Embodiments of or processes related to ink-jet heads with ink circulating through the whole print head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
DE602005027431T 2004-12-20 2005-12-20 Preiswerter Piezo-Druckkopf auf der Basis mikrofluidischer Elemente in einer Leiterplatte und siebgedruckter piezoelektrischer Elemente Active DE602005027431D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/017,471 US7347533B2 (en) 2004-12-20 2004-12-20 Low cost piezo printhead based on microfluidics in printed circuit board and screen-printed piezoelectrics

Publications (1)

Publication Number Publication Date
DE602005027431D1 true DE602005027431D1 (de) 2011-05-26

Family

ID=36061354

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005027431T Active DE602005027431D1 (de) 2004-12-20 2005-12-20 Preiswerter Piezo-Druckkopf auf der Basis mikrofluidischer Elemente in einer Leiterplatte und siebgedruckter piezoelektrischer Elemente

Country Status (4)

Country Link
US (1) US7347533B2 (de)
EP (1) EP1671798B1 (de)
JP (1) JP2006175869A (de)
DE (1) DE602005027431D1 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7329545B2 (en) 2002-09-24 2008-02-12 Duke University Methods for sampling a liquid flow
US6911132B2 (en) * 2002-09-24 2005-06-28 Duke University Apparatus for manipulating droplets by electrowetting-based techniques
GB2410467A (en) * 2004-01-30 2005-08-03 Hewlett Packard Development Co A method of making an inkjet printhead
EP1859330B1 (de) 2005-01-28 2012-07-04 Duke University Vorrichtungen und verfahren zur manipulation von tropfen auf einer leiterplatte
US20070023292A1 (en) * 2005-07-26 2007-02-01 The Regents Of The University Of California Small object moving on printed circuit board
US20070182777A1 (en) * 2006-02-08 2007-08-09 Eastman Kodak Company Printhead and method of forming same
WO2009021233A2 (en) 2007-08-09 2009-02-12 Advanced Liquid Logic, Inc. Pcb droplet actuator fabrication
US8157352B2 (en) * 2009-02-26 2012-04-17 Fujifilm Corporation Fluid ejecting with centrally formed inlets and outlets
US9555631B2 (en) 2009-10-12 2017-01-31 Hewlett-Packard Development Company, L.P. Laminate manifolds for mesoscale fluidic systems
US8210661B2 (en) * 2009-12-16 2012-07-03 Palo Alto Research Center, Incorporated Stacked slice printhead
US8205971B2 (en) * 2010-01-19 2012-06-26 Xerox Corporation Electrically grounded inkjet ejector and method for making an electrically grounded inkjet ejector
US8622524B2 (en) 2010-05-27 2014-01-07 Funai Electric Co., Ltd. Laminate constructs for micro-fluid ejection devices
US8585187B2 (en) * 2011-04-29 2013-11-19 Xerox Corporation High density electrical interconnect for printing devices using flex circuits and dielectric underfill
US9873939B2 (en) 2011-09-19 2018-01-23 The Regents Of The University Of Michigan Microfluidic device and method using double anodic bonding
WO2013162541A1 (en) 2012-04-25 2013-10-31 Hewlett-Packard Development Company, L.P. Bias current reduction for print nozzle amplifier
US10821729B2 (en) 2013-02-28 2020-11-03 Hewlett-Packard Development Company, L.P. Transfer molded fluid flow structure
CN108058485B (zh) 2013-02-28 2019-10-22 惠普发展公司，有限责任合伙企业 模制的流体流动结构
US9517626B2 (en) 2013-02-28 2016-12-13 Hewlett-Packard Development Company, L.P. Printed circuit board fluid ejection apparatus
US11426900B2 (en) 2013-02-28 2022-08-30 Hewlett-Packard Development Company, L.P. Molding a fluid flow structure
EP2961614B1 (de) 2013-02-28 2020-01-15 Hewlett-Packard Development Company, L.P. Geformter druckbalken
US9724920B2 (en) 2013-03-20 2017-08-08 Hewlett-Packard Development Company, L.P. Molded die slivers with exposed front and back surfaces
CN104647903B (zh) * 2015-02-09 2016-07-06 清华大学深圳研究生院 一种基于微流控芯片的打印喷头装置
CN107531052B (zh) 2015-05-15 2019-10-11 惠普发展公司有限责任合伙企业 流体喷射设备
US10328694B2 (en) 2015-07-31 2019-06-25 Hewlett-Packard Development Company, L.P. Printed circuit board with recessed pocket for fluid droplet ejection die
CN107949481B (zh) 2015-10-12 2021-01-05 惠普发展公司，有限责任合伙企业 打印头
CN106793535A (zh) * 2015-11-20 2017-05-31 富泰华工业（深圳）有限公司 电路板丝网印刷方法
JP7102980B2 (ja) * 2018-06-29 2022-07-20 セイコーエプソン株式会社 液体噴射ヘッドと液体噴射装置と液体噴射ヘッドの製造方法
JP7275768B2 (ja) * 2019-04-01 2023-05-18 ブラザー工業株式会社 液体吐出ヘッド
JP7268452B2 (ja) * 2019-04-01 2023-05-08 ブラザー工業株式会社 液体吐出ヘッド
CN114148108B (zh) * 2021-11-26 2022-09-16 东莞市启思达智能技术有限公司 一种高效喷墨方法及系统

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188977A (en) * 1976-12-15 1980-02-19 Johnson Controls, Inc. Fluid system circuit board
US4110140A (en) * 1976-12-15 1978-08-29 Johnson Controls, Inc. Method of making fluid system circuit board
JPS54152766A (en) * 1978-05-24 1979-12-01 Yamatake Honeywell Co Ltd Fluid circuit device
US4883219A (en) * 1988-09-01 1989-11-28 Anderson Jeffrey J Manufacture of ink jet print heads by diffusion bonding and brazing
US5087930A (en) * 1989-11-01 1992-02-11 Tektronix, Inc. Drop-on-demand ink jet print head
US5489930A (en) * 1993-04-30 1996-02-06 Tektronix, Inc. Ink jet head with internal filter
JPH09226115A (ja) * 1996-02-21 1997-09-02 Rohm Co Ltd インクジェットプリントヘッド
US6123410A (en) * 1997-10-28 2000-09-26 Hewlett-Packard Company Scalable wide-array inkjet printhead and method for fabricating same
JP3521768B2 (ja) * 1997-11-06 2004-04-19 セイコーエプソン株式会社 インクジェット式記録ヘッド
US6341845B1 (en) * 2000-08-25 2002-01-29 Hewlett-Packard Company Electrical connection for wide-array inkjet printhead assembly with hybrid carrier for printhead dies
US6552901B2 (en) * 1998-12-22 2003-04-22 James Hildebrandt Apparatus and system for cooling electronic circuitry, heat sinks, and related components
US6361146B1 (en) * 1999-06-15 2002-03-26 Lexmark International, Inc. Adhesive bonding laminates
WO2001002172A1 (en) * 1999-06-30 2001-01-11 Silverbrook Research Pty Ltd Printhead support structure and assembly
JP3991527B2 (ja) * 1999-09-20 2007-10-17 ブラザー工業株式会社 インク噴射装置
JP2001150680A (ja) * 1999-11-29 2001-06-05 Casio Comput Co Ltd インクジェットプリンタヘッド
AUPQ455999A0 (en) 1999-12-09 2000-01-06 Silverbrook Research Pty Ltd Memjet four color modular print head packaging
JP2002052712A (ja) * 2000-08-14 2002-02-19 Sharp Corp インク噴射装置
US6454260B1 (en) * 2000-12-05 2002-09-24 Xerox Corporation Air jet board device
JP4670159B2 (ja) * 2001-02-19 2011-04-13 ブラザー工業株式会社 インクジェットプリンタヘッド
US6548895B1 (en) * 2001-02-21 2003-04-15 Sandia Corporation Packaging of electro-microfluidic devices
JP4362996B2 (ja) * 2001-08-22 2009-11-11 富士ゼロックス株式会社 格子状配列構造の圧電／電歪アクチュエータ及びその製造方法
KR100438836B1 (ko) * 2001-12-18 2004-07-05 삼성전자주식회사 압전 방식의 잉크젯 프린트 헤드 및 그 제조방법
US6786708B2 (en) * 2002-07-18 2004-09-07 The Regents Of The University Of Michigan Laminated devices and methods of making same
GB2391871A (en) 2002-08-16 2004-02-18 Qinetiq Ltd Depositing conductive solid materials using reservoirs in a printhead
US6987348B2 (en) * 2002-12-13 2006-01-17 Palo Alto Research Center Inc. Piezoelectric transducers
US6767079B1 (en) * 2003-01-15 2004-07-27 Xerox Corporation Low cost high performance thermal ink jet printhead

Also Published As

Publication number Publication date
US20060132543A1 (en) 2006-06-22
EP1671798A2 (de) 2006-06-21
JP2006175869A (ja) 2006-07-06
US7347533B2 (en) 2008-03-25
EP1671798B1 (de) 2011-04-13
EP1671798A3 (de) 2009-04-01

Similar Documents

Publication Publication Date Title
DE602005027431D1 (de) Preiswerter Piezo-Druckkopf auf der Basis mikrofluidischer Elemente in einer Leiterplatte und siebgedruckter piezoelektrischer Elemente
DE602005013876D1 (de) Piezoelektrischer Tintenstrahldruckkopf und Herstellungsverfahren dafür
DE602005004118D1 (de) Tintenstrahldrucktinten mit vernetzten polyurethanen
DK1800872T3 (da) Printermaterialebeholder og printkort monteret på printermaterialebeholder
PL1859330T3 (pl) Urządzenia i sposoby manipulacji kropelkami na płytkach obwodów drukowanych
DE602006007639D1 (de) Tintenstrahldruckvorrichtung und zugehörige Tintenpatrone
EP1630707A4 (de) Elementanordnungsprüfeinrichtung und leiterplattenentwurfseinrichtung
DE60318343D1 (de) Tintenstrahldruckvorrichtung und zugehörige Tintenpatrone
DE60324489D1 (de) Tintenstrahldruckkopf und damit versehene Druckvorrichtung
DE60326289D1 (de) Tintenstrahldruckkopf und damit versehene Druckvorrichtung
DE602006007764D1 (de) Tintenstrahlkopf und Tintenstrahldruckgerät
DE602004000799D1 (de) Tintenstrahldrucktinte und Aufzeichnungsgerät
DE602005017543D1 (de) Leiterplatte mit partiell eingebetteten Anschlusselementen
DE602006001310D1 (de) Piezoelektrisches Element, Flüssigkeitstrahlkopf und -gerät
DE602006003102D1 (de) Piezoelektrischer Tintenstrahldruckkopf und Herstellungsverfahren dafür
DE602004025791D1 (de) Tintenstrahldrucken auf Offsetmedien
FI20075088L (fi) Piirilevy, johon on upotettu paljas mikrosiru ja menetelmä sitä varten
DE602005024637D1 (de) Tintenstrahldruckvorrichtung und -Verfahren
DE602006020644D1 (de) Tintenstrahldruckkopf, Tintenstrahldruckvorrichtung und Tintenstrahldruckkopfherstellungsverfahren
DE602004026000D1 (de) Druckkopfsubstrat, Druckkopf und Druckgerät
DE602004000429D1 (de) Auf einer Leiterplatte oberflächenmontierte Schaltvorrichtung mit Stopper
DE602006004889D1 (de) Tintenstrahltinte und tintensatz
ATE293538T1 (de) Tintenstrahldruckkopf mit ausgeglichenem energieumsatz an widerstandselementen durch angepasste fet-schaltkreise
DE602006003764D1 (de) Tintestrahldruckverfahren
DE602005009894D1 (de) Tintenstrahldruckfarbe