DE602005002782D1 - Eine Vorrichtung und ein Verfahren um ein Fluidmeniskus herzustellen - Google Patents
Eine Vorrichtung und ein Verfahren um ein Fluidmeniskus herzustellenInfo
- Publication number
- DE602005002782D1 DE602005002782D1 DE602005002782T DE602005002782T DE602005002782D1 DE 602005002782 D1 DE602005002782 D1 DE 602005002782D1 DE 602005002782 T DE602005002782 T DE 602005002782T DE 602005002782 T DE602005002782 T DE 602005002782T DE 602005002782 D1 DE602005002782 D1 DE 602005002782D1
- Authority
- DE
- Germany
- Prior art keywords
- housing
- substrate
- insert
- process configuration
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000012530 fluid Substances 0.000 title abstract 2
- 230000005499 meniscus Effects 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 5
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/817,355 US7293571B2 (en) | 2002-09-30 | 2004-04-01 | Substrate proximity processing housing and insert for generating a fluid meniscus |
US817355 | 2004-04-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE602005002782D1 true DE602005002782D1 (de) | 2007-11-22 |
DE602005002782T2 DE602005002782T2 (de) | 2008-07-17 |
Family
ID=34940657
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005002782T Active DE602005002782T2 (de) | 2004-04-01 | 2005-03-30 | Eine Vorrichtung und ein Verfahren um ein Fluidmeniskus herzustellen |
Country Status (10)
Country | Link |
---|---|
US (2) | US7293571B2 (de) |
EP (1) | EP1601006B1 (de) |
JP (1) | JP4630104B2 (de) |
KR (1) | KR101134325B1 (de) |
CN (4) | CN101630633B (de) |
AT (1) | ATE375602T1 (de) |
DE (1) | DE602005002782T2 (de) |
MY (1) | MY139622A (de) |
SG (1) | SG115844A1 (de) |
TW (2) | TWI299511B (de) |
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US7383843B2 (en) * | 2002-09-30 | 2008-06-10 | Lam Research Corporation | Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer |
US7614411B2 (en) | 2002-09-30 | 2009-11-10 | Lam Research Corporation | Controls of ambient environment during wafer drying using proximity head |
US7069937B2 (en) * | 2002-09-30 | 2006-07-04 | Lam Research Corporation | Vertical proximity processor |
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US7240679B2 (en) * | 2002-09-30 | 2007-07-10 | Lam Research Corporation | System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold |
US7513262B2 (en) | 2002-09-30 | 2009-04-07 | Lam Research Corporation | Substrate meniscus interface and methods for operation |
US7632376B1 (en) | 2002-09-30 | 2009-12-15 | Lam Research Corporation | Method and apparatus for atomic layer deposition (ALD) in a proximity system |
US8236382B2 (en) * | 2002-09-30 | 2012-08-07 | Lam Research Corporation | Proximity substrate preparation sequence, and method, apparatus, and system for implementing the same |
US7293571B2 (en) | 2002-09-30 | 2007-11-13 | Lam Research Corporation | Substrate proximity processing housing and insert for generating a fluid meniscus |
US7389783B2 (en) * | 2002-09-30 | 2008-06-24 | Lam Research Corporation | Proximity meniscus manifold |
US7153400B2 (en) * | 2002-09-30 | 2006-12-26 | Lam Research Corporation | Apparatus and method for depositing and planarizing thin films of semiconductor wafers |
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US7675000B2 (en) * | 2003-06-24 | 2010-03-09 | Lam Research Corporation | System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology |
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US8062471B2 (en) * | 2004-03-31 | 2011-11-22 | Lam Research Corporation | Proximity head heating method and apparatus |
KR101255048B1 (ko) | 2005-04-01 | 2013-04-16 | 에프에스아이 인터내쇼날 인크. | 하나 이상의 처리 유체를 이용하여 마이크로일렉트로닉 워크피이스를 처리하는데 이용되는 장치용 배리어 구조 및 노즐 장치 |
JP5039939B2 (ja) * | 2006-01-24 | 2012-10-03 | 国立大学法人大阪大学 | 表面加工方法及び装置 |
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US8813764B2 (en) | 2009-05-29 | 2014-08-26 | Lam Research Corporation | Method and apparatus for physical confinement of a liquid meniscus over a semiconductor wafer |
JP4755573B2 (ja) * | 2006-11-30 | 2011-08-24 | 東京応化工業株式会社 | 処理装置および処理方法、ならびに表面処理治具 |
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-
2004
- 2004-04-01 US US10/817,355 patent/US7293571B2/en not_active Expired - Fee Related
-
2005
- 2005-03-28 SG SG200502561A patent/SG115844A1/en unknown
- 2005-03-30 DE DE602005002782T patent/DE602005002782T2/de active Active
- 2005-03-30 AT AT05251949T patent/ATE375602T1/de active
- 2005-03-30 EP EP05251949A patent/EP1601006B1/de not_active Not-in-force
- 2005-03-31 JP JP2005100384A patent/JP4630104B2/ja not_active Expired - Fee Related
- 2005-03-31 TW TW094110229A patent/TWI299511B/zh not_active IP Right Cessation
- 2005-03-31 TW TW096125205A patent/TWI310581B/zh not_active IP Right Cessation
- 2005-04-01 CN CN2009101521217A patent/CN101630633B/zh not_active Expired - Fee Related
- 2005-04-01 CN CNB2005100762256A patent/CN100539034C/zh not_active Expired - Fee Related
- 2005-04-01 KR KR1020050027777A patent/KR101134325B1/ko not_active IP Right Cessation
- 2005-04-01 CN CN2005100717585A patent/CN1707759B/zh not_active Expired - Fee Related
- 2005-04-01 CN CN200910138830XA patent/CN101572223B/zh not_active Expired - Fee Related
- 2005-04-01 MY MYPI20051482A patent/MY139622A/en unknown
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Also Published As
Publication number | Publication date |
---|---|
KR20060045450A (ko) | 2006-05-17 |
CN101630633B (zh) | 2011-05-11 |
ATE375602T1 (de) | 2007-10-15 |
TWI299511B (en) | 2008-08-01 |
DE602005002782T2 (de) | 2008-07-17 |
TW200741806A (en) | 2007-11-01 |
EP1601006A2 (de) | 2005-11-30 |
CN101572223A (zh) | 2009-11-04 |
JP4630104B2 (ja) | 2011-02-09 |
KR101134325B1 (ko) | 2012-04-09 |
CN1707759B (zh) | 2010-04-21 |
CN100539034C (zh) | 2009-09-09 |
CN101572223B (zh) | 2011-08-17 |
US7293571B2 (en) | 2007-11-13 |
TWI310581B (en) | 2009-06-01 |
TW200603217A (en) | 2006-01-16 |
MY139622A (en) | 2009-10-30 |
US20050148197A1 (en) | 2005-07-07 |
CN101630633A (zh) | 2010-01-20 |
CN1707759A (zh) | 2005-12-14 |
US7406972B2 (en) | 2008-08-05 |
EP1601006B1 (de) | 2007-10-10 |
SG115844A1 (en) | 2005-10-28 |
CN1722374A (zh) | 2006-01-18 |
EP1601006A3 (de) | 2005-12-14 |
JP2005311355A (ja) | 2005-11-04 |
US20080006307A1 (en) | 2008-01-10 |
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