DE602004023200D1 - Halbleiterbauelement mit supergitter - Google Patents

Halbleiterbauelement mit supergitter

Info

Publication number
DE602004023200D1
DE602004023200D1 DE602004023200T DE602004023200T DE602004023200D1 DE 602004023200 D1 DE602004023200 D1 DE 602004023200D1 DE 602004023200 T DE602004023200 T DE 602004023200T DE 602004023200 T DE602004023200 T DE 602004023200T DE 602004023200 D1 DE602004023200 D1 DE 602004023200D1
Authority
DE
Germany
Prior art keywords
grille
super
semiconductor component
semiconductor
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004023200T
Other languages
English (en)
Inventor
Robert J Mears
Jean Augustin Yiptong
Marek Hytha
Scott A Kreps
Ilija Dukovski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mears Technologies Inc
Original Assignee
Mears Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/603,621 external-priority patent/US20040266116A1/en
Priority claimed from US10/603,696 external-priority patent/US20040262594A1/en
Application filed by Mears Technologies Inc filed Critical Mears Technologies Inc
Publication of DE602004023200D1 publication Critical patent/DE602004023200D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/15—Structures with periodic or quasi periodic potential variation, e.g. multiple quantum wells, superlattices
    • H01L29/151—Compositional structures
    • H01L29/152—Compositional structures with quantum effects only in vertical direction, i.e. layered structures with quantum effects solely resulting from vertical potential variation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232—Field-effect technology
    • H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/8238—Complementary field-effect transistors, e.g. CMOS
    • H01L21/823807—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the channel structures, e.g. channel implants, halo or pocket implants, or channel materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1025—Channel region of field-effect devices
    • H01L29/1029—Channel region of field-effect devices of field-effect transistors
    • H01L29/1033—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure
    • H01L29/1054—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure with a variation of the composition, e.g. channel with strained layer for increasing the mobility
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/15—Structures with periodic or quasi periodic potential variation, e.g. multiple quantum wells, superlattices
    • H01L29/151—Compositional structures
    • H01L29/152—Compositional structures with quantum effects only in vertical direction, i.e. layered structures with quantum effects solely resulting from vertical potential variation
    • H01L29/155—Comprising only semiconductor materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
DE602004023200T 2003-06-26 2004-06-28 Halbleiterbauelement mit supergitter Active DE602004023200D1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/603,621 US20040266116A1 (en) 2003-06-26 2003-06-26 Methods of fabricating semiconductor structures having improved conductivity effective mass
US10/603,696 US20040262594A1 (en) 2003-06-26 2003-06-26 Semiconductor structures having improved conductivity effective mass and methods for fabricating same
US10/647,060 US6958486B2 (en) 2003-06-26 2003-08-22 Semiconductor device including band-engineered superlattice
PCT/US2004/020652 WO2005034245A1 (en) 2003-06-26 2004-06-28 Semiconductor device including band-engineered superlattice

Publications (1)

Publication Number Publication Date
DE602004023200D1 true DE602004023200D1 (de) 2009-10-29

Family

ID=33493657

Family Applications (4)

Application Number Title Priority Date Filing Date
DE602004025349T Active DE602004025349D1 (de) 2003-06-26 2004-06-28 Halbleiterbauelement mit bandlücken-angepasstem üb
DE602004023200T Active DE602004023200D1 (de) 2003-06-26 2004-06-28 Halbleiterbauelement mit supergitter
DE602004016855T Active DE602004016855D1 (de) 2003-06-26 2004-06-28 Verfahren zur herstellung eines halbleiterbauelements mit bandentworfenem supergitter
DE602004017472T Active DE602004017472D1 (de) 2003-06-26 2004-06-28 Halbleiterbauelement mit einem mosfet mit bandlücken-angepasstem übergitter

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE602004025349T Active DE602004025349D1 (de) 2003-06-26 2004-06-28 Halbleiterbauelement mit bandlücken-angepasstem üb

Family Applications After (2)

Application Number Title Priority Date Filing Date
DE602004016855T Active DE602004016855D1 (de) 2003-06-26 2004-06-28 Verfahren zur herstellung eines halbleiterbauelements mit bandentworfenem supergitter
DE602004017472T Active DE602004017472D1 (de) 2003-06-26 2004-06-28 Halbleiterbauelement mit einem mosfet mit bandlücken-angepasstem übergitter

Country Status (7)

Country Link
US (8) US6897472B2 (de)
EP (2) EP1644981B1 (de)
JP (5) JP4918355B2 (de)
AU (2) AU2004301905B2 (de)
CA (2) CA2530067C (de)
DE (4) DE602004025349D1 (de)
WO (2) WO2005034245A1 (de)

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