DE602004020435D1 - Akustisch gekoppelter Dünnschicht-Transformator - Google Patents
Akustisch gekoppelter Dünnschicht-TransformatorInfo
- Publication number
- DE602004020435D1 DE602004020435D1 DE602004020435T DE602004020435T DE602004020435D1 DE 602004020435 D1 DE602004020435 D1 DE 602004020435D1 DE 602004020435 T DE602004020435 T DE 602004020435T DE 602004020435 T DE602004020435 T DE 602004020435T DE 602004020435 D1 DE602004020435 D1 DE 602004020435D1
- Authority
- DE
- Germany
- Prior art keywords
- acoustically coupled
- film transformer
- coupled thin
- thin
- transformer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezo-electric or electrostrictive material
- H03H9/58—Multiple crystal filters
- H03H9/60—Electric coupling means therefor
- H03H9/605—Electric coupling means therefor consisting of a ladder configuration
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
- H03H9/132—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials characterized by a particular shape
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezo-electric or electrostrictive material
- H03H9/58—Multiple crystal filters
- H03H9/582—Multiple crystal filters implemented with thin-film techniques
- H03H9/583—Multiple crystal filters implemented with thin-film techniques comprising a plurality of piezoelectric layers acoustically coupled
- H03H9/584—Coupled Resonator Filters [CFR]
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezo-electric or electrostrictive material
- H03H9/58—Multiple crystal filters
- H03H9/582—Multiple crystal filters implemented with thin-film techniques
- H03H9/586—Means for mounting to a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/587—Air-gaps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezo-electric or electrostrictive material
- H03H9/58—Multiple crystal filters
- H03H9/60—Electric coupling means therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/0023—Balance-unbalance or balance-balance networks
- H03H9/0095—Balance-unbalance or balance-balance networks using bulk acoustic wave devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/699,481 US6946928B2 (en) | 2003-10-30 | 2003-10-30 | Thin-film acoustically-coupled transformer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE602004020435D1 true DE602004020435D1 (de) | 2009-05-20 |
Family
ID=34423456
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE602004020435T Active DE602004020435D1 (de) | 2003-10-30 | 2004-06-22 | Akustisch gekoppelter Dünnschicht-Transformator |
| DE112004002038T Expired - Fee Related DE112004002038B4 (de) | 2003-10-30 | 2004-10-29 | Akustisch gekoppelter Filmtransformator mit erhöhter Gleichtaktunterdrückung |
| DE112004002035T Expired - Fee Related DE112004002035B4 (de) | 2003-10-30 | 2004-10-29 | Impedanzwandlungsverhältnissteuerung bei akustisch gekoppelten Filmtransformatoren |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE112004002038T Expired - Fee Related DE112004002038B4 (de) | 2003-10-30 | 2004-10-29 | Akustisch gekoppelter Filmtransformator mit erhöhter Gleichtaktunterdrückung |
| DE112004002035T Expired - Fee Related DE112004002035B4 (de) | 2003-10-30 | 2004-10-29 | Impedanzwandlungsverhältnissteuerung bei akustisch gekoppelten Filmtransformatoren |
Country Status (7)
| Country | Link |
|---|---|
| US (5) | US6946928B2 (de) |
| EP (1) | EP1528675B1 (de) |
| JP (3) | JP4648680B2 (de) |
| CN (5) | CN100555856C (de) |
| DE (3) | DE602004020435D1 (de) |
| GB (2) | GB2422059B (de) |
| WO (2) | WO2005046052A1 (de) |
Families Citing this family (186)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100107389A1 (en) | 2002-01-11 | 2010-05-06 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Method of fabricating an electrode for a bulk acoustic resonator |
| US7044196B2 (en) * | 2003-01-31 | 2006-05-16 | Cooligy,Inc | Decoupled spring-loaded mounting apparatus and method of manufacturing thereof |
| US7275292B2 (en) | 2003-03-07 | 2007-10-02 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Method for fabricating an acoustical resonator on a substrate |
| FR2853473B1 (fr) * | 2003-04-01 | 2005-07-01 | St Microelectronics Sa | Composant electronique comprenant un resonateur et procede de fabrication |
| DE10319554B4 (de) * | 2003-04-30 | 2018-05-09 | Snaptrack, Inc. | Mit akustischen Volumenwellen arbeitendes Bauelement mit gekoppelten Resonatoren |
| US7994877B1 (en) | 2008-11-10 | 2011-08-09 | Hrl Laboratories, Llc | MEMS-based quartz hybrid filters and a method of making the same |
| US8766745B1 (en) | 2007-07-25 | 2014-07-01 | Hrl Laboratories, Llc | Quartz-based disk resonator gyro with ultra-thin conductive outer electrodes and method of making same |
| US7019605B2 (en) * | 2003-10-30 | 2006-03-28 | Larson Iii John D | Stacked bulk acoustic resonator band-pass filter with controllable pass bandwidth |
| US6946928B2 (en) * | 2003-10-30 | 2005-09-20 | Agilent Technologies, Inc. | Thin-film acoustically-coupled transformer |
| US7332985B2 (en) * | 2003-10-30 | 2008-02-19 | Avago Technologies Wireless Ip (Singapore) Pte Ltd. | Cavity-less film bulk acoustic resonator (FBAR) devices |
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| US7242270B2 (en) * | 2003-10-30 | 2007-07-10 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Decoupled stacked bulk acoustic resonator-based band-pass filter |
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| US7202560B2 (en) | 2004-12-15 | 2007-04-10 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Wafer bonding of micro-electro mechanical systems to active circuitry |
| US7791434B2 (en) | 2004-12-22 | 2010-09-07 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Acoustic resonator performance enhancement using selective metal etch and having a trench in the piezoelectric |
| JP4622574B2 (ja) * | 2005-02-21 | 2011-02-02 | 株式会社デンソー | 超音波素子 |
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| US7436269B2 (en) * | 2005-04-18 | 2008-10-14 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Acoustically coupled resonators and method of making the same |
| US7934884B2 (en) * | 2005-04-27 | 2011-05-03 | Lockhart Industries, Inc. | Ring binder cover |
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| US7737807B2 (en) | 2005-10-18 | 2010-06-15 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Acoustic galvanic isolator incorporating series-connected decoupled stacked bulk acoustic resonators |
| US20070085632A1 (en) * | 2005-10-18 | 2007-04-19 | Larson John D Iii | Acoustic galvanic isolator |
| US7675390B2 (en) | 2005-10-18 | 2010-03-09 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Acoustic galvanic isolator incorporating single decoupled stacked bulk acoustic resonator |
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2003
- 2003-10-30 US US10/699,481 patent/US6946928B2/en not_active Expired - Lifetime
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2004
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