DE602004020200D1 - Belichtungsgerät und verfahren zur herstellung einer vorrichtung - Google Patents

Belichtungsgerät und verfahren zur herstellung einer vorrichtung

Info

Publication number
DE602004020200D1
DE602004020200D1 DE602004020200T DE602004020200T DE602004020200D1 DE 602004020200 D1 DE602004020200 D1 DE 602004020200D1 DE 602004020200 T DE602004020200 T DE 602004020200T DE 602004020200 T DE602004020200 T DE 602004020200T DE 602004020200 D1 DE602004020200 D1 DE 602004020200D1
Authority
DE
Germany
Prior art keywords
substrate
liquid
optical system
projection optical
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602004020200T
Other languages
English (en)
Inventor
Hideaki Hara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Nippon Kogaku KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=33156817&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE602004020200(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nikon Corp, Nippon Kogaku KK filed Critical Nikon Corp
Publication of DE602004020200D1 publication Critical patent/DE602004020200D1/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70341Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00Photographic printing apparatus
    • G03B27/32Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/42Projection printing apparatus, e.g. enlarger, copying camera for automatic sequential copying of the same original
DE602004020200T 2003-04-07 2004-04-06 Belichtungsgerät und verfahren zur herstellung einer vorrichtung Expired - Fee Related DE602004020200D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003103145 2003-04-07
PCT/JP2004/004969 WO2004090956A1 (ja) 2003-04-07 2004-04-06 露光装置及びデバイス製造方法

Publications (1)

Publication Number Publication Date
DE602004020200D1 true DE602004020200D1 (de) 2009-05-07

Family

ID=33156817

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004020200T Expired - Fee Related DE602004020200D1 (de) 2003-04-07 2004-04-06 Belichtungsgerät und verfahren zur herstellung einer vorrichtung

Country Status (8)

Country Link
US (4) US7480029B2 (de)
EP (1) EP1612850B1 (de)
JP (2) JP4902201B2 (de)
KR (1) KR101176817B1 (de)
AT (1) ATE426914T1 (de)
DE (1) DE602004020200D1 (de)
TW (1) TWI385706B (de)
WO (1) WO2004090956A1 (de)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE426914T1 (de) * 2003-04-07 2009-04-15 Nikon Corp Belichtungsgerat und verfahren zur herstellung einer vorrichtung
KR20170018113A (ko) 2003-04-09 2017-02-15 가부시키가이샤 니콘 노광 방법 및 장치, 그리고 디바이스 제조 방법
KR101497289B1 (ko) * 2003-04-10 2015-02-27 가부시키가이샤 니콘 액침 리소그래피 장치용 운반 영역을 포함하는 환경 시스템
EP2717098B1 (de) 2003-04-10 2015-05-13 Nikon Corporation System zur Umgebungskontrolle mittels Vakuum-Rückförderung für eine Immersionslithografievorrichtung
KR101697896B1 (ko) 2003-04-11 2017-01-18 가부시키가이샤 니콘 액침 리소그래피 머신에서 웨이퍼 교환동안 투영 렌즈 아래의 갭에서 액침 액체를 유지하는 장치 및 방법
EP2261742A3 (de) 2003-06-11 2011-05-25 ASML Netherlands BV Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
US6867844B2 (en) 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
TWI564933B (zh) 2003-06-19 2017-01-01 尼康股份有限公司 An exposure apparatus, an exposure method, and an element manufacturing method
EP1491956B1 (de) * 2003-06-27 2006-09-06 ASML Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung eines Artikels
US6809794B1 (en) 2003-06-27 2004-10-26 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
EP2264531B1 (de) 2003-07-09 2013-01-16 Nikon Corporation Belichtungsgerät und Verfahren zur Herstellung einer Vorrichtung
US7370659B2 (en) 2003-08-06 2008-05-13 Micron Technology, Inc. Photolithographic stepper and/or scanner machines including cleaning devices and methods of cleaning photolithographic stepper and/or scanner machines
TWI245163B (en) 2003-08-29 2005-12-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
KR101748923B1 (ko) * 2003-09-03 2017-06-19 가부시키가이샤 니콘 액침 리소그래피용 유체를 제공하기 위한 장치 및 방법
US7411653B2 (en) 2003-10-28 2008-08-12 Asml Netherlands B.V. Lithographic apparatus
TW201834020A (zh) 2003-10-28 2018-09-16 日商尼康股份有限公司 照明光學裝置、曝光裝置、曝光方法以及元件製造方法
US7528929B2 (en) 2003-11-14 2009-05-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI612338B (zh) 2003-11-20 2018-01-21 尼康股份有限公司 光學照明裝置、曝光裝置、曝光方法、以及元件製造方法
JP4323946B2 (ja) 2003-12-19 2009-09-02 キヤノン株式会社 露光装置
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
TWI379344B (en) 2004-02-06 2012-12-11 Nikon Corp Polarization changing device, optical illumination apparatus, light-exposure apparatus and light-exposure method
CN100592210C (zh) * 2004-02-13 2010-02-24 卡尔蔡司Smt股份公司 微平版印刷投影曝光装置的投影物镜
KR20180042456A (ko) 2004-03-25 2018-04-25 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
KR101330370B1 (ko) * 2004-04-19 2013-11-15 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US8054448B2 (en) 2004-05-04 2011-11-08 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
US7304715B2 (en) * 2004-08-13 2007-12-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7379155B2 (en) * 2004-10-18 2008-05-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7161654B2 (en) * 2004-12-02 2007-01-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1821337B1 (de) * 2004-12-06 2016-05-11 Nikon Corporation Wartungsverfahren
US7180571B2 (en) * 2004-12-08 2007-02-20 Asml Netherlands B.V. Lithographic projection apparatus and actuator
SG124351A1 (en) * 2005-01-14 2006-08-30 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP3079164A1 (de) 2005-01-31 2016-10-12 Nikon Corporation Belichtungsvorrichtung und herstellungsverfahren einer vorrichtung
US8692973B2 (en) 2005-01-31 2014-04-08 Nikon Corporation Exposure apparatus and method for producing device
CN102360170B (zh) 2005-02-10 2014-03-12 Asml荷兰有限公司 浸没液体、曝光装置及曝光方法
US7324185B2 (en) 2005-03-04 2008-01-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411654B2 (en) 2005-04-05 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20060232753A1 (en) 2005-04-19 2006-10-19 Asml Holding N.V. Liquid immersion lithography system with tilted liquid flow
US8248577B2 (en) 2005-05-03 2012-08-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP2660853B1 (de) 2005-05-12 2017-07-05 Nikon Corporation Optisches Projektionssystem, Belichtungsvorrichtung und Belichtungsverfahren
DE102005024163A1 (de) 2005-05-23 2006-11-30 Carl Zeiss Smt Ag Optisches System einer mikrolithographischen Projektionsbelichtungsanlage
US7583358B2 (en) 2005-07-25 2009-09-01 Micron Technology, Inc. Systems and methods for retrieving residual liquid during immersion lens photolithography
US7456928B2 (en) * 2005-08-29 2008-11-25 Micron Technology, Inc. Systems and methods for controlling ambient pressure during processing of microfeature workpieces, including during immersion lithography
JP2007088339A (ja) * 2005-09-26 2007-04-05 Nikon Corp 露光装置、及びデバイス製造方法
US20070127002A1 (en) * 2005-11-09 2007-06-07 Nikon Corporation Exposure apparatus and method, and device manufacturing method
JPWO2007055199A1 (ja) 2005-11-09 2009-04-30 株式会社ニコン 露光装置及び方法、並びにデバイス製造方法
EP1947683A4 (de) * 2005-11-09 2010-08-25 Nikon Corp Belichtungsvorrichtung, belichtungsverfahren und bauelemente-herstellungsverfahren
TWI397945B (zh) 2005-11-14 2013-06-01 尼康股份有限公司 A liquid recovery member, an exposure apparatus, an exposure method, and an element manufacturing method
US7773195B2 (en) 2005-11-29 2010-08-10 Asml Holding N.V. System and method to increase surface tension and contact angle in immersion lithography
EP1965414A4 (de) 2005-12-06 2010-08-25 Nikon Corp Belichtungsverfahren, belichtungsvorrichtung und verfahren zur bauelementeherstellung
US8472004B2 (en) 2006-01-18 2013-06-25 Micron Technology, Inc. Immersion photolithography scanner
JP4889331B2 (ja) * 2006-03-22 2012-03-07 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
US9477158B2 (en) 2006-04-14 2016-10-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
JP5267029B2 (ja) 2007-10-12 2013-08-21 株式会社ニコン 照明光学装置、露光装置及びデバイスの製造方法
EP2179329A1 (de) 2007-10-16 2010-04-28 Nikon Corporation Optisches beleuchtungssystem, belichtungsgerät und geräteherstellungsverfahren
CN101681123B (zh) 2007-10-16 2013-06-12 株式会社尼康 照明光学系统、曝光装置以及元件制造方法
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
CN101910817B (zh) 2008-05-28 2016-03-09 株式会社尼康 照明光学系统、曝光装置以及器件制造方法
DE102008050868A1 (de) * 2008-09-30 2010-04-08 M+W Zander Products Gmbh Einrichtung zur Temperaturstabilisierung von Flüssigkeiten, vorzugsweise von ultrareinem Wasser, bei der Herstellung von Chips sowie Verfahren zur Temperaturstabilisierung von Flüssigkeiten zur Anwendung bei der Herstellung von Chips
US20110153387A1 (en) * 2009-12-17 2011-06-23 Google Inc. Customizing surveys
DE112014005277T5 (de) * 2014-06-12 2016-10-06 Fuji Electric Co., Ltd. Vorrichtung zum Einbringen von Verunreinigungen, Verfahren zum Einbringen von Verunreinigungen und Verfahren zur Herstellung eines Halbleiterelements

Family Cites Families (155)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE416412A (de) * 1935-07-08
US2552414A (en) * 1948-06-08 1951-05-08 Hazeltine Research Inc Electrical connector for solid dielectric type coaxial lines
US3243321A (en) * 1962-11-02 1966-03-29 Atlas Copco Ab Method of teflon coating of metals
US3398391A (en) * 1967-08-10 1968-08-20 Alexander R. Brishka Hermetically sealed connectors
GB1242527A (en) * 1967-10-20 1971-08-11 Kodak Ltd Optical instruments
US3678447A (en) * 1970-06-17 1972-07-18 Amp Inc Coaxial cable connector sub-assembly
US3633051A (en) * 1971-02-16 1972-01-04 Gte Sylvania Inc Transistorized load control circuit
US4372112A (en) * 1980-07-01 1983-02-08 Ford Motor Company Thin-walled exhaust gas manifold casting
US4346164A (en) 1980-10-06 1982-08-24 Werner Tabarelli Photolithographic method for the manufacture of integrated circuits
JPS57153433A (en) 1981-03-18 1982-09-22 Hitachi Ltd Manufacturing device for semiconductor
JPS58202448A (ja) 1982-05-21 1983-11-25 Hitachi Ltd 露光装置
JPS5919912A (ja) 1982-07-26 1984-02-01 Hitachi Ltd 液浸距離保持装置
DD221563A1 (de) 1983-09-14 1985-04-24 Mikroelektronik Zt Forsch Tech Immersionsobjektiv fuer die schrittweise projektionsabbildung einer maskenstruktur
DD224448A1 (de) 1984-03-01 1985-07-03 Zeiss Jena Veb Carl Einrichtung zur fotolithografischen strukturuebertragung
JPS6265326A (ja) 1985-09-18 1987-03-24 Hitachi Ltd 露光装置
JPS63157419A (ja) 1986-12-22 1988-06-30 Toshiba Corp 微細パタ−ン転写装置
US5059287A (en) * 1989-06-16 1991-10-22 Charles W. Harkey, Sr. Portable water distiller
JPH03209479A (ja) 1989-09-06 1991-09-12 Sanee Giken Kk 露光方法
JPH04305915A (ja) 1991-04-02 1992-10-28 Nikon Corp 密着型露光装置
JPH04305917A (ja) 1991-04-02 1992-10-28 Nikon Corp 密着型露光装置
JP3203698B2 (ja) * 1991-09-02 2001-08-27 株式会社ニコン 顕微鏡の液浸対物レンズ及び防水キャップ
JPH0562877A (ja) 1991-09-02 1993-03-12 Yasuko Shinohara 光によるlsi製造縮小投影露光装置の光学系
JPH06124873A (ja) 1992-10-09 1994-05-06 Canon Inc 液浸式投影露光装置
JP2753930B2 (ja) * 1992-11-27 1998-05-20 キヤノン株式会社 液浸式投影露光装置
JPH06208058A (ja) * 1993-01-13 1994-07-26 Olympus Optical Co Ltd 顕微鏡対物レンズ
JPH07220990A (ja) 1994-01-28 1995-08-18 Hitachi Ltd パターン形成方法及びその露光装置
US5874820A (en) 1995-04-04 1999-02-23 Nikon Corporation Window frame-guided stage mechanism
US5528118A (en) 1994-04-01 1996-06-18 Nikon Precision, Inc. Guideless stage with isolated reaction stage
US5623853A (en) 1994-10-19 1997-04-29 Nikon Precision Inc. Precision motion stage with single guide beam and follower stage
JPH08316124A (ja) 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
US5825043A (en) 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
DE69717975T2 (de) 1996-12-24 2003-05-28 Asml Netherlands Bv In zwei richtungen ausgewogenes positioniergerät, sowie lithographisches gerät mit einem solchen positioniergerät
JP3747566B2 (ja) * 1997-04-23 2006-02-22 株式会社ニコン 液浸型露光装置
JP3817836B2 (ja) * 1997-06-10 2006-09-06 株式会社ニコン 露光装置及びその製造方法並びに露光方法及びデバイス製造方法
US6083040A (en) * 1997-07-25 2000-07-04 Itt Manufacturing Enterprises, Inc. Connector with releasable mounting flange
US6058666A (en) * 1997-08-31 2000-05-09 Lin; Wei-Hwang Twin-axis prestressed single-tee beam with lower flange and process of construction
JP4026943B2 (ja) * 1997-09-04 2007-12-26 キヤノン株式会社 露光装置およびデバイス製造方法
WO1999049504A1 (fr) * 1998-03-26 1999-09-30 Nikon Corporation Procede et systeme d'exposition par projection
JP2000012453A (ja) * 1998-06-18 2000-01-14 Nikon Corp 露光装置及びその使用方法、露光方法、並びにマスクの製造方法
US7187503B2 (en) 1999-12-29 2007-03-06 Carl Zeiss Smt Ag Refractive projection objective for immersion lithography
US6995930B2 (en) 1999-12-29 2006-02-07 Carl Zeiss Smt Ag Catadioptric projection objective with geometric beam splitting
JP2002083766A (ja) * 2000-06-19 2002-03-22 Nikon Corp 投影光学系、該光学系の製造方法、及び前記光学系を備えた投影露光装置
KR100866818B1 (ko) * 2000-12-11 2008-11-04 가부시키가이샤 니콘 투영광학계 및 이 투영광학계를 구비한 노광장치
JP2002305138A (ja) * 2001-04-05 2002-10-18 Nikon Corp 露光装置および露光方法
WO2002091078A1 (en) 2001-05-07 2002-11-14 Massachusetts Institute Of Technology Methods and apparatus employing an index matching medium
DE10123027B4 (de) * 2001-05-11 2005-07-21 Evotec Oai Ag Vorrichtung zur Untersuchung chemischer und/oder biologischer Proben
US6666732B1 (en) * 2001-05-21 2003-12-23 John E. Endacott Terminal connector
DE10210899A1 (de) 2002-03-08 2003-09-18 Zeiss Carl Smt Ag Refraktives Projektionsobjektiv für Immersions-Lithographie
US7092069B2 (en) 2002-03-08 2006-08-15 Carl Zeiss Smt Ag Projection exposure method and projection exposure system
DE10229818A1 (de) 2002-06-28 2004-01-15 Carl Zeiss Smt Ag Verfahren zur Fokusdetektion und Abbildungssystem mit Fokusdetektionssystem
US6581579B1 (en) * 2002-06-19 2003-06-24 Walbro Engine Management, L.L.C. Vapor separator for a fuel pump assembly
JP2005536775A (ja) 2002-08-23 2005-12-02 株式会社ニコン 投影光学系、フォトリソグラフィ方法および露光装置、並びに露光装置を用いた方法
US6954993B1 (en) 2002-09-30 2005-10-18 Lam Research Corporation Concentric proximity processing head
US7093375B2 (en) 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
US7367345B1 (en) 2002-09-30 2008-05-06 Lam Research Corporation Apparatus and method for providing a confined liquid for immersion lithography
US6988326B2 (en) 2002-09-30 2006-01-24 Lam Research Corporation Phobic barrier meniscus separation and containment
US6788477B2 (en) * 2002-10-22 2004-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for method for immersion lithography
DE60335595D1 (de) 2002-11-12 2011-02-17 Asml Netherlands Bv Lithographischer Apparat mit Immersion und Verfahren zur Herstellung einer Vorrichtung
CN101713932B (zh) 2002-11-12 2012-09-26 Asml荷兰有限公司 光刻装置和器件制造方法
CN101470360B (zh) 2002-11-12 2013-07-24 Asml荷兰有限公司 光刻装置和器件制造方法
US7110081B2 (en) 2002-11-12 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP3977324B2 (ja) 2002-11-12 2007-09-19 エーエスエムエル ネザーランズ ビー.ブイ. リソグラフィ装置
SG121822A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
SG131766A1 (en) 2002-11-18 2007-05-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
DE10253679A1 (de) 2002-11-18 2004-06-03 Infineon Technologies Ag Optische Einrichtung zur Verwendung bei einem Lithographie-Verfahren, insbesondere zur Herstellung eines Halbleiter-Bauelements, sowie optisches Lithographieverfahren
US6679726B1 (en) * 2002-11-26 2004-01-20 Molex Incorporated Panel mounted electrical connector
DE10258718A1 (de) 2002-12-09 2004-06-24 Carl Zeiss Smt Ag Projektionsobjektiv, insbesondere für die Mikrolithographie, sowie Verfahren zur Abstimmung eines Projektionsobjektives
US6992750B2 (en) 2002-12-10 2006-01-31 Canon Kabushiki Kaisha Exposure apparatus and method
JP4184346B2 (ja) 2002-12-13 2008-11-19 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 層上のスポットを照射するための方法及び装置における液体除去
ATE335272T1 (de) 2002-12-19 2006-08-15 Koninkl Philips Electronics Nv Verfahren und anordnung zum bestrahlen einer schicht mittels eines lichtpunkts
US7010958B2 (en) 2002-12-19 2006-03-14 Asml Holding N.V. High-resolution gas gauge proximity sensor
US7514699B2 (en) 2002-12-19 2009-04-07 Koninklijke Philips Electronics N.V. Method and device for irradiating spots on a layer
US6781670B2 (en) 2002-12-30 2004-08-24 Intel Corporation Immersion lithography
TWI247339B (en) 2003-02-21 2006-01-11 Asml Holding Nv Lithographic printing with polarized light
JP4449310B2 (ja) * 2003-02-27 2010-04-14 株式会社寺岡精工 計量印字装置
US6943941B2 (en) 2003-02-27 2005-09-13 Asml Netherlands B.V. Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems
US7206059B2 (en) 2003-02-27 2007-04-17 Asml Netherlands B.V. Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems
US7029832B2 (en) 2003-03-11 2006-04-18 Samsung Electronics Co., Ltd. Immersion lithography methods using carbon dioxide
US20050164522A1 (en) 2003-03-24 2005-07-28 Kunz Roderick R. Optical fluids, and systems and methods of making and using the same
ATE426914T1 (de) * 2003-04-07 2009-04-15 Nikon Corp Belichtungsgerat und verfahren zur herstellung einer vorrichtung
WO2004093159A2 (en) 2003-04-09 2004-10-28 Nikon Corporation Immersion lithography fluid control system
KR101497289B1 (ko) 2003-04-10 2015-02-27 가부시키가이샤 니콘 액침 리소그래피 장치용 운반 영역을 포함하는 환경 시스템
EP2717098B1 (de) 2003-04-10 2015-05-13 Nikon Corporation System zur Umgebungskontrolle mittels Vakuum-Rückförderung für eine Immersionslithografievorrichtung
KR101129213B1 (ko) 2003-04-10 2012-03-27 가부시키가이샤 니콘 액침 리소그래피 장치용 액체를 수집하는 런-오프 경로
JP4656057B2 (ja) 2003-04-10 2011-03-23 株式会社ニコン 液浸リソグラフィ装置用電気浸透素子
KR101697896B1 (ko) 2003-04-11 2017-01-18 가부시키가이샤 니콘 액침 리소그래피 머신에서 웨이퍼 교환동안 투영 렌즈 아래의 갭에서 액침 액체를 유지하는 장치 및 방법
SG10201803122UA (en) 2003-04-11 2018-06-28 Nikon Corp Immersion lithography apparatus and device manufacturing method
JP4582089B2 (ja) 2003-04-11 2010-11-17 株式会社ニコン 液浸リソグラフィ用の液体噴射回収システム
EP1614000B1 (de) 2003-04-17 2012-01-18 Nikon Corporation Lithographisches Immersionsgerät
JP4146755B2 (ja) 2003-05-09 2008-09-10 松下電器産業株式会社 パターン形成方法
JP4025683B2 (ja) 2003-05-09 2007-12-26 松下電器産業株式会社 パターン形成方法及び露光装置
JP4084710B2 (ja) 2003-06-12 2008-04-30 松下電器産業株式会社 パターン形成方法
JP4054285B2 (ja) 2003-06-12 2008-02-27 松下電器産業株式会社 パターン形成方法
US6867844B2 (en) 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
JP4029064B2 (ja) 2003-06-23 2008-01-09 松下電器産業株式会社 パターン形成方法
JP4084712B2 (ja) 2003-06-23 2008-04-30 松下電器産業株式会社 パターン形成方法
SG110100A1 (en) 2003-06-27 2005-04-28 Asml Holding Nv Immersion photolithography system and method using inverted wafer-projection optics interface
EP1491956B1 (de) 2003-06-27 2006-09-06 ASML Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung eines Artikels
US6809794B1 (en) * 2003-06-27 2004-10-26 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
EP1639391A4 (de) 2003-07-01 2009-04-29 Nikon Corp Verwendung isotopisch spezifizierter fluide als optische elemente
US7384149B2 (en) 2003-07-21 2008-06-10 Asml Netherlands B.V. Lithographic projection apparatus, gas purging method and device manufacturing method and purge gas supply system
US7006209B2 (en) 2003-07-25 2006-02-28 Advanced Micro Devices, Inc. Method and apparatus for monitoring and controlling imaging in immersion lithography systems
US7175968B2 (en) 2003-07-28 2007-02-13 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a substrate
US7326522B2 (en) 2004-02-11 2008-02-05 Asml Netherlands B.V. Device manufacturing method and a substrate
US7700267B2 (en) 2003-08-11 2010-04-20 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion fluid for immersion lithography, and method of performing immersion lithography
US7061578B2 (en) 2003-08-11 2006-06-13 Advanced Micro Devices, Inc. Method and apparatus for monitoring and controlling imaging in immersion lithography systems
US7579135B2 (en) 2003-08-11 2009-08-25 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography apparatus for manufacture of integrated circuits
US7085075B2 (en) 2003-08-12 2006-08-01 Carl Zeiss Smt Ag Projection objectives including a plurality of mirrors with lenses ahead of mirror M3
US6844206B1 (en) 2003-08-21 2005-01-18 Advanced Micro Devices, Llp Refractive index system monitor and control for immersion lithography
US20050045554A1 (en) * 2003-08-28 2005-03-03 Gambro Lundia Ab Membrane unit element, semipermeable membrane, filtration device, and processes for manufacturing the same
US6954256B2 (en) 2003-08-29 2005-10-11 Asml Netherlands B.V. Gradient immersion lithography
US7070915B2 (en) 2003-08-29 2006-07-04 Tokyo Electron Limited Method and system for drying a substrate
US7014966B2 (en) 2003-09-02 2006-03-21 Advanced Micro Devices, Inc. Method and apparatus for elimination of bubbles in immersion medium in immersion lithography systems
KR101748923B1 (ko) 2003-09-03 2017-06-19 가부시키가이샤 니콘 액침 리소그래피용 유체를 제공하기 위한 장치 및 방법
US6961186B2 (en) 2003-09-26 2005-11-01 Takumi Technology Corp. Contact printing using a magnified mask image
US7369217B2 (en) 2003-10-03 2008-05-06 Micronic Laser Systems Ab Method and device for immersion lithography
US7678527B2 (en) 2003-10-16 2010-03-16 Intel Corporation Methods and compositions for providing photoresist with improved properties for contacting liquids
JP2007525824A (ja) 2003-11-05 2007-09-06 ディーエスエム アイピー アセッツ ビー.ブイ. マイクロチップを製造するための方法および装置
US7924397B2 (en) 2003-11-06 2011-04-12 Taiwan Semiconductor Manufacturing Company, Ltd. Anti-corrosion layer on objective lens for liquid immersion lithography applications
US8854602B2 (en) 2003-11-24 2014-10-07 Asml Netherlands B.V. Holding device for an optical element in an objective
US7545481B2 (en) 2003-11-24 2009-06-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7125652B2 (en) 2003-12-03 2006-10-24 Advanced Micro Devices, Inc. Immersion lithographic process using a conforming immersion medium
US7106415B2 (en) * 2003-12-09 2006-09-12 Anvik Corporation Illumination compensator for curved surface lithography
KR100965330B1 (ko) 2003-12-15 2010-06-22 칼 짜이스 에스엠티 아게 적어도 한 개의 액체 렌즈를 가진 마이크로리소그래피 투사대물렌즈로서의 대물렌즈
JP5106858B2 (ja) 2003-12-15 2012-12-26 カール・ツァイス・エスエムティー・ゲーエムベーハー 高開口数と平面状端面とを有する投影対物レンズ
JP5102492B2 (ja) 2003-12-19 2012-12-19 カール・ツァイス・エスエムティー・ゲーエムベーハー 結晶素子を有するマイクロリソグラフィー投影用対物レンズ
US20050185269A1 (en) 2003-12-19 2005-08-25 Carl Zeiss Smt Ag Catadioptric projection objective with geometric beam splitting
US7460206B2 (en) 2003-12-19 2008-12-02 Carl Zeiss Smt Ag Projection objective for immersion lithography
US7589818B2 (en) 2003-12-23 2009-09-15 Asml Netherlands B.V. Lithographic apparatus, alignment apparatus, device manufacturing method, and a method of converting an apparatus
US7394521B2 (en) 2003-12-23 2008-07-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7119884B2 (en) 2003-12-24 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20050147920A1 (en) 2003-12-30 2005-07-07 Chia-Hui Lin Method and system for immersion lithography
US7088422B2 (en) 2003-12-31 2006-08-08 International Business Machines Corporation Moving lens for immersion optical lithography
JP4371822B2 (ja) 2004-01-06 2009-11-25 キヤノン株式会社 露光装置
JP4253592B2 (ja) * 2004-01-06 2009-04-15 オリンパス株式会社 液浸対物レンズ、蛍光分析装置および倒立型顕微鏡。
JP4429023B2 (ja) 2004-01-07 2010-03-10 キヤノン株式会社 露光装置及びデバイス製造方法
US20050153424A1 (en) 2004-01-08 2005-07-14 Derek Coon Fluid barrier with transparent areas for immersion lithography
KR101417706B1 (ko) 2004-01-14 2014-07-08 칼 짜이스 에스엠테 게엠베하 반사굴절식 투영 대물렌즈
KR101099847B1 (ko) 2004-01-16 2011-12-27 칼 짜이스 에스엠티 게엠베하 편광변조 광학소자
WO2005069078A1 (en) 2004-01-19 2005-07-28 Carl Zeiss Smt Ag Microlithographic projection exposure apparatus with immersion projection lens
ATE459898T1 (de) 2004-01-20 2010-03-15 Zeiss Carl Smt Ag Belichtungsvorrichtung und messeinrichtung für eine projektionslinse
US7026259B2 (en) 2004-01-21 2006-04-11 International Business Machines Corporation Liquid-filled balloons for immersion lithography
US7391501B2 (en) 2004-01-22 2008-06-24 Intel Corporation Immersion liquids with siloxane polymer for immersion lithography
EP1723467A2 (de) 2004-02-03 2006-11-22 Rochester Institute of Technology Ein fluid verwendendes photolithographieverfahren und system dafür
WO2005076084A1 (en) 2004-02-09 2005-08-18 Carl Zeiss Smt Ag Projection objective for a microlithographic projection exposure apparatus
US7050146B2 (en) 2004-02-09 2006-05-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN100592210C (zh) * 2004-02-13 2010-02-24 卡尔蔡司Smt股份公司 微平版印刷投影曝光装置的投影物镜
CN101727021A (zh) 2004-02-13 2010-06-09 卡尔蔡司Smt股份公司 微平版印刷投影曝光装置的投影物镜
JP2007523383A (ja) 2004-02-18 2007-08-16 コーニング インコーポレイテッド 深紫外光による大開口数結像のための反射屈折結像光学系
US20050205108A1 (en) 2004-03-16 2005-09-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for immersion lithography lens cleaning
US7027125B2 (en) 2004-03-25 2006-04-11 International Business Machines Corporation System and apparatus for photolithography
US7084960B2 (en) 2004-03-29 2006-08-01 Intel Corporation Lithography using controlled polarization
US7034917B2 (en) 2004-04-01 2006-04-25 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US7227619B2 (en) 2004-04-01 2007-06-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7295283B2 (en) 2004-04-02 2007-11-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Also Published As

Publication number Publication date
KR20050118721A (ko) 2005-12-19
EP1612850B1 (de) 2009-03-25
US20060023188A1 (en) 2006-02-02
US8111375B2 (en) 2012-02-07
JP4902201B2 (ja) 2012-03-21
JPWO2004090956A1 (ja) 2006-07-06
TWI385706B (zh) 2013-02-11
US20080291410A1 (en) 2008-11-27
JP5287791B2 (ja) 2013-09-11
EP1612850A1 (de) 2006-01-04
JP2010183109A (ja) 2010-08-19
US20060033901A1 (en) 2006-02-16
KR101176817B1 (ko) 2012-08-24
US8537331B2 (en) 2013-09-17
TW200503071A (en) 2005-01-16
EP1612850A4 (de) 2008-01-09
US7480029B2 (en) 2009-01-20
US20070064209A1 (en) 2007-03-22
ATE426914T1 (de) 2009-04-15
WO2004090956A1 (ja) 2004-10-21

Similar Documents

Publication Publication Date Title
ATE426914T1 (de) Belichtungsgerat und verfahren zur herstellung einer vorrichtung
EP1670039A4 (de) Belichtungsvorrichtung und bauelemente-herstellungsverfahren
TW200611082A (en) Exposure system and device production method
ATE462991T1 (de) Belichtungsapparat und verfahren zur herstellung einer vorrichtung
TW201612951A (en) Exposure apparatus, exposure method, and device producing method
EP2199859A3 (de) Belichtungsvorrichtung, Belichtungsverfahren und Vorrichtungsherstellungsverfahren
ATE489724T1 (de) Belichtungsvorrichtung und verfahren zur bauelementherstellung
EP2466618A3 (de) Belichtungsvorrichtung und Verfahren zur Vorrichtungsherstellung
TW200520053A (en) Immersion lithographic process using a conforming immersion medium
EP1624481A4 (de) Belichtungsvorrichtung und verfahren zur bauelementeherstellung
DE602005002782D1 (de) Eine Vorrichtung und ein Verfahren um ein Fluidmeniskus herzustellen
EP1630612A3 (de) Verfahren zur Herstellung einer Mikrostruktur, Belichtungsvorrichtung und elektronischer Apparat
SG2012087615A (en) Exposure apparatus, exposure method, and method for producing device
TW200511388A (en) Exposure method, substrate stage, exposure apparatus and method for manufacturing device
SG150388A1 (en) Exposure apparatus and method for producing device
TW200507064A (en) Exposure apparatus and method for manufacturing device
EP1653501A4 (de) Belichtungsvorrichtung, bauelemente-herstellungsverfahren und steuerverfahren für eine belichtungsvorrichtung
HK1087782A1 (en) Apparatus and method for maintaining immersion fluid under a lithographic projection lens
SG148994A1 (en) Exposure apparatus, exposure method, method for producing device, and optical part
ATE493754T1 (de) Belichtungsvorrichtung, belichtungsverfahren und verfahren zur herstellung einer vorrichtung
TW200515106A (en) Method for exposing a substrate and lithographic projection apparatus
EP1632810A3 (de) Belichtungsgerät und Belichtungsverfahren
TW200518903A (en) A method of manufacturing a mould for producing an optical surface, a method of producing a contact lens and a device for use with these methods
ATE170639T1 (de) Verfahren und vorrichtung zur herstellung einer druckschablone
DE102005053651A1 (de) Mikrolithographische Projektionsbelichtungsanlage sowie Verfahren zur Herstellung mikrostrukturierter Bauelemente

Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee