DE602004011950D1 - Klebstoffe mit verbesserter chemikalienbeständigkeit und härtbare silikonzusammensetzungen zur herstellung der klebstoffe - Google Patents

Klebstoffe mit verbesserter chemikalienbeständigkeit und härtbare silikonzusammensetzungen zur herstellung der klebstoffe

Info

Publication number
DE602004011950D1
DE602004011950D1 DE602004011950T DE602004011950T DE602004011950D1 DE 602004011950 D1 DE602004011950 D1 DE 602004011950D1 DE 602004011950 T DE602004011950 T DE 602004011950T DE 602004011950 T DE602004011950 T DE 602004011950T DE 602004011950 D1 DE602004011950 D1 DE 602004011950D1
Authority
DE
Germany
Prior art keywords
adhesives
composition
manufacture
chemical resistance
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004011950T
Other languages
English (en)
Other versions
DE602004011950T2 (de
Inventor
Dongchan Ahn
Patricia Ann Rolley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Publication of DE602004011950D1 publication Critical patent/DE602004011950D1/de
Application granted granted Critical
Publication of DE602004011950T2 publication Critical patent/DE602004011950T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
DE602004011950T 2003-08-14 2004-07-09 Klebstoffe mit verbesserter chemikalienbeständigkeit und härtbare silikonzusammensetzungen zur herstellung der klebstoffe Active DE602004011950T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US641758 2003-08-14
US10/641,758 US7045586B2 (en) 2003-08-14 2003-08-14 Adhesives having improved chemical resistance and curable silicone compositions for preparing the adhesives
PCT/US2004/022241 WO2005019322A1 (en) 2003-08-14 2004-07-09 Adhesives having improved chemical resistance and curable silicone compositions for preparing the adhesives

Publications (2)

Publication Number Publication Date
DE602004011950D1 true DE602004011950D1 (de) 2008-04-03
DE602004011950T2 DE602004011950T2 (de) 2009-02-12

Family

ID=34136436

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004011950T Active DE602004011950T2 (de) 2003-08-14 2004-07-09 Klebstoffe mit verbesserter chemikalienbeständigkeit und härtbare silikonzusammensetzungen zur herstellung der klebstoffe

Country Status (9)

Country Link
US (2) US7045586B2 (de)
EP (1) EP1660572B1 (de)
JP (1) JP5143423B2 (de)
KR (1) KR101121965B1 (de)
CN (1) CN100419010C (de)
AT (1) ATE386772T1 (de)
DE (1) DE602004011950T2 (de)
TW (1) TW200510482A (de)
WO (1) WO2005019322A1 (de)

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US20050038188A1 (en) 2003-08-14 2005-02-17 Dongchan Ahn Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance
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JP5521848B2 (ja) * 2010-07-21 2014-06-18 デクセリアルズ株式会社 異方性導電フィルム、接続構造体及びそれらの製造方法
US10538690B2 (en) * 2011-03-21 2020-01-21 Avery Dennison Corporation Non-flowing silicone adhesive
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JP6338327B2 (ja) * 2013-06-27 2018-06-06 株式会社カネカ 硬化性樹脂組成物、該組成物を硬化させてなる硬化物
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CN103755964B (zh) * 2013-12-27 2016-03-30 深圳市安品有机硅材料有限公司 聚硅氧烷增粘树脂及其制备方法
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CN104531049B (zh) * 2014-12-24 2017-04-19 广州市白云化工实业有限公司 防污染硅酮耐候密封胶及其制备方法
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US7521125B2 (en) 2009-04-21
CN100419010C (zh) 2008-09-17
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EP1660572A1 (de) 2006-05-31
TWI350844B (de) 2011-10-21
WO2005019322A1 (en) 2005-03-03
CN1835996A (zh) 2006-09-20
ATE386772T1 (de) 2008-03-15
KR20060064632A (ko) 2006-06-13
JP2007502346A (ja) 2007-02-08
US20050038217A1 (en) 2005-02-17
US7045586B2 (en) 2006-05-16
DE602004011950T2 (de) 2009-02-12
KR101121965B1 (ko) 2012-03-09
US20050282959A1 (en) 2005-12-22

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