DE602004003395D1 - Lösungsmittelfreie, voc-freie strahlungs- oder wärmehärtbare beschichtungsstoffe - Google Patents

Lösungsmittelfreie, voc-freie strahlungs- oder wärmehärtbare beschichtungsstoffe

Info

Publication number
DE602004003395D1
DE602004003395D1 DE200460003395 DE602004003395T DE602004003395D1 DE 602004003395 D1 DE602004003395 D1 DE 602004003395D1 DE 200460003395 DE200460003395 DE 200460003395 DE 602004003395 T DE602004003395 T DE 602004003395T DE 602004003395 D1 DE602004003395 D1 DE 602004003395D1
Authority
DE
Germany
Prior art keywords
free
compositions
voc
solvent
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE200460003395
Other languages
English (en)
Other versions
DE602004003395T2 (de
Inventor
Ramkrishna Ghoshal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polyset Co
Original Assignee
Polyset Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyset Co filed Critical Polyset Co
Publication of DE602004003395D1 publication Critical patent/DE602004003395D1/de
Application granted granted Critical
Publication of DE602004003395T2 publication Critical patent/DE602004003395T2/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31525—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31609—Particulate metal or metal compound-containing
    • Y10T428/31612—As silicone, silane or siloxane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
DE200460003395 2003-08-07 2004-08-05 Lösungsmittelfreie, voc-freie strahlungs- oder wärmehärtbare beschichtungsstoffe Expired - Fee Related DE602004003395T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/636,101 US6962948B2 (en) 2003-08-07 2003-08-07 Solventless, non-polluting radiation and thermal curable coatings
US636101 2003-08-07
PCT/US2004/025176 WO2005017057A1 (en) 2003-08-07 2004-08-05 Solventless, non-polluting radiation and thermally curable coatings

Publications (2)

Publication Number Publication Date
DE602004003395D1 true DE602004003395D1 (de) 2007-01-04
DE602004003395T2 DE602004003395T2 (de) 2007-09-13

Family

ID=34193557

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200460003395 Expired - Fee Related DE602004003395T2 (de) 2003-08-07 2004-08-05 Lösungsmittelfreie, voc-freie strahlungs- oder wärmehärtbare beschichtungsstoffe

Country Status (6)

Country Link
US (2) US6962948B2 (de)
EP (1) EP1651731B1 (de)
AT (1) ATE346124T1 (de)
AU (1) AU2004264507A1 (de)
DE (1) DE602004003395T2 (de)
WO (1) WO2005017057A1 (de)

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JP2005008691A (ja) * 2003-06-17 2005-01-13 Konica Minolta Medical & Graphic Inc 活性エネルギー線硬化型インクジェットインク及び印刷物
US6962948B2 (en) * 2003-08-07 2005-11-08 Polyset Company, Inc. Solventless, non-polluting radiation and thermal curable coatings
JP2006124636A (ja) * 2004-06-28 2006-05-18 Konica Minolta Medical & Graphic Inc 活性光線硬化型組成物、活性光線硬化型インクジェットインク、該活性光線硬化型インクジェットインクを用いた画像形成方法及びインクジェット記録装置
US7288607B2 (en) * 2004-10-12 2007-10-30 E. I. Du Pont De Nemours & Co. High solids primer composition based on epoxy ring opening curing reaction
JP4986423B2 (ja) * 2005-08-03 2012-07-25 日東電工株式会社 剥離処理基材及びその製造方法
ES2527101T3 (es) * 2005-08-12 2015-01-20 Markem-Imaje Corporation Formulaciones de tintas catiónicas
US8048981B2 (en) * 2005-09-20 2011-11-01 General Electric Company Thermally curable compositions and method
FR2912605B1 (fr) * 2007-02-16 2011-07-15 Xeda International Combinaisons d'esters de l'acide abietique avec un ou plusieurs terpenes et leur utilisation pour l'enrobage des fruits et legumes
CN101977919B (zh) * 2008-03-24 2014-04-23 昭和电工株式会社 环氧化合物及其制造方法
US20090294724A1 (en) * 2008-05-27 2009-12-03 Appealing Products, Inc. Anti-icing material and surface treatments
JP5793491B2 (ja) * 2010-03-02 2015-10-14 サンスター技研株式会社 硬化性組成物
US8629688B2 (en) * 2010-09-29 2014-01-14 International Business Machines Corporation Method for sulfur-based corrosion testing
TWI557183B (zh) * 2015-12-16 2016-11-11 財團法人工業技術研究院 矽氧烷組成物、以及包含其之光電裝置
KR101339772B1 (ko) * 2011-02-28 2014-02-05 한국과학기술원 광경화 투명 수지 조성물
BR112013026805B1 (pt) 2011-04-18 2020-05-26 Momentive Perfomance Materials Gmbh Uso de poliorganossiloxanos ou silanos para o tratamento de materiais lignocelulósicos, uso de composições compreendendo pelo menos um polissiloxano e/ou silano, composições, processo para o tratamento de material lignocelulósico, uso de pelo menos um polissiloxano e/ou silano e material lignocelulósico
CN107674206B (zh) * 2012-08-31 2021-05-25 株式会社大赛璐 固化性组合物及其固化物、光学构件以及光学装置
EP3112389B1 (de) * 2014-02-28 2019-06-05 Daicel Corporation Härtbare zusammensetzung, gehärtetes produkt daraus und linse auf waferebene
JP6514221B2 (ja) * 2014-09-17 2019-05-15 株式会社ダイセル 硬化性組成物、及びそれを用いた光学素子
KR102567687B1 (ko) * 2015-06-17 2023-08-18 주식회사 다이셀 경화성 조성물
TWI557177B (zh) * 2015-12-16 2016-11-11 財團法人工業技術研究院 低介電無溶劑型樹脂組成物及基板結構
US20170369654A1 (en) * 2016-06-24 2017-12-28 Dow Global Technologies Llc Curable resin composition
KR102566344B1 (ko) 2017-08-18 2023-08-10 피나 테크놀러지, 인코포레이티드 에폭시화된 폴리파르네센 및 이를 생산하기 위한 방법
US10858541B2 (en) * 2017-12-19 2020-12-08 Rohm And Haas Electronic Materials Llc Curable composition
CN114181581A (zh) * 2021-12-27 2022-03-15 深圳市法鑫忠信新材料有限公司 一种高硬度的涂料组合物及其制备方法
CN117285706A (zh) * 2022-06-24 2023-12-26 常州正洁智造科技有限公司 阳离子型光固化组合物、涂料、具有光固化涂层的制品、油墨

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US5863970A (en) 1995-12-06 1999-01-26 Polyset Company, Inc. Epoxy resin composition with cycloaliphatic epoxy-functional siloxane
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US6832036B2 (en) * 2002-10-11 2004-12-14 Polyset Company, Inc. Siloxane optical waveguides
US6962948B2 (en) * 2003-08-07 2005-11-08 Polyset Company, Inc. Solventless, non-polluting radiation and thermal curable coatings
US7019386B2 (en) * 2004-04-27 2006-03-28 Polyset Company, Inc. Siloxane epoxy polymers for low-k dielectric applications

Also Published As

Publication number Publication date
US6962948B2 (en) 2005-11-08
WO2005017057A1 (en) 2005-02-24
AU2004264507A1 (en) 2005-02-24
EP1651731B1 (de) 2006-11-22
US7285579B2 (en) 2007-10-23
DE602004003395T2 (de) 2007-09-13
US20050042458A1 (en) 2005-02-24
US20050170187A1 (en) 2005-08-04
EP1651731A1 (de) 2006-05-03
ATE346124T1 (de) 2006-12-15

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