DE602004002429D1 - Festkörper-Bildaufnahme-Vorrichtung, Signalverarbeitungsvorrichtung, Kamera und Vorrichtung zur Aufnahme eines Spektrums - Google Patents

Festkörper-Bildaufnahme-Vorrichtung, Signalverarbeitungsvorrichtung, Kamera und Vorrichtung zur Aufnahme eines Spektrums

Info

Publication number
DE602004002429D1
DE602004002429D1 DE602004002429T DE602004002429T DE602004002429D1 DE 602004002429 D1 DE602004002429 D1 DE 602004002429D1 DE 602004002429 T DE602004002429 T DE 602004002429T DE 602004002429 T DE602004002429 T DE 602004002429T DE 602004002429 D1 DE602004002429 D1 DE 602004002429D1
Authority
DE
Germany
Prior art keywords
spectrum
camera
recording
solid
signal processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602004002429T
Other languages
English (en)
Other versions
DE602004002429T2 (de
Inventor
Takumi Yamaguti
Daisuke Ueda
Takuma Katayama
Motonari Katsuno
Shinji Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE602004002429D1 publication Critical patent/DE602004002429D1/de
Application granted granted Critical
Publication of DE602004002429T2 publication Critical patent/DE602004002429T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
    • E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
    • E06B11/00—Means for allowing passage through fences, barriers or the like, e.g. stiles
    • E06B11/02—Gates; Doors
    • E06B11/022—Gates; Doors characterised by the manner of movement
    • E06B11/023—Gates; Doors characterised by the manner of movement where the gate opens within the plane of the gate
    • E06B11/026—Gates; Doors characterised by the manner of movement where the gate opens within the plane of the gate horizontally
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14621—Colour filter arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14623—Optical shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/80—Camera processing pipelines; Components thereof
    • H04N23/84—Camera processing pipelines; Components thereof for processing colour signals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14636—Interconnect structures
DE602004002429T 2003-04-07 2004-04-06 Festkörper-Bildaufnahme-Vorrichtung, Signalverarbeitungsvorrichtung, Kamera und Vorrichtung zur Aufnahme eines Spektrums Expired - Fee Related DE602004002429T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003103359 2003-04-07
JP2003103359 2003-04-07
JP2003159263 2003-06-04
JP2003159263 2003-06-04

Publications (2)

Publication Number Publication Date
DE602004002429D1 true DE602004002429D1 (de) 2006-11-02
DE602004002429T2 DE602004002429T2 (de) 2007-09-20

Family

ID=32993096

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004002429T Expired - Fee Related DE602004002429T2 (de) 2003-04-07 2004-04-06 Festkörper-Bildaufnahme-Vorrichtung, Signalverarbeitungsvorrichtung, Kamera und Vorrichtung zur Aufnahme eines Spektrums

Country Status (6)

Country Link
US (1) US20050133879A1 (de)
EP (1) EP1475963B1 (de)
KR (1) KR20040087911A (de)
CN (1) CN1538528A (de)
DE (1) DE602004002429T2 (de)
TW (1) TW200507635A (de)

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JP2007005629A (ja) * 2005-06-24 2007-01-11 Matsushita Electric Ind Co Ltd 固体撮像装置
KR20080022075A (ko) * 2005-07-21 2008-03-10 마츠시타 덴끼 산교 가부시키가이샤 촬상장치
WO2007083250A1 (en) * 2006-01-19 2007-07-26 Philips Intellectual Property & Standards Gmbh Color-controlled illumination device
US7615731B2 (en) * 2006-09-14 2009-11-10 Carestream Health, Inc. High fill-factor sensor with reduced coupling
JP5059476B2 (ja) * 2007-04-23 2012-10-24 ラピスセミコンダクタ株式会社 半導体装置、光測定装置、光検出装置、及び半導体装置の製造方法
CN101584222B (zh) * 2007-05-31 2011-10-12 松下电器产业株式会社 图像处理装置
CN101569205B (zh) * 2007-06-15 2012-05-23 松下电器产业株式会社 图像处理装置
JP4486703B2 (ja) * 2007-12-07 2010-06-23 パナソニック株式会社 撮像装置
KR100920542B1 (ko) * 2007-12-24 2009-10-08 주식회사 동부하이텍 이미지 센서 및 그 제조방법
JP2009277798A (ja) * 2008-05-13 2009-11-26 Sony Corp 固体撮像装置及び電子機器
WO2009157129A1 (ja) * 2008-06-26 2009-12-30 パナソニック株式会社 画像処理装置、画像分割プログラムおよび画像合成方法
KR101467509B1 (ko) * 2008-07-25 2014-12-01 삼성전자주식회사 이미지 센서 및 이미지 센서 동작 방법
JP5262823B2 (ja) * 2009-02-23 2013-08-14 ソニー株式会社 固体撮像装置および電子機器
US20110175981A1 (en) * 2010-01-19 2011-07-21 Chun-Hung Lai 3d color image sensor
JP2011176715A (ja) * 2010-02-25 2011-09-08 Nikon Corp 裏面照射型撮像素子および撮像装置
US9357956B2 (en) 2010-03-05 2016-06-07 Seiko Epson Corporation Spectroscopic sensor and electronic apparatus
TWI482488B (zh) * 2010-04-12 2015-04-21 Univ Nat Cheng Kung 分散式濾波感測結構及光學裝置
WO2011148574A1 (ja) 2010-05-28 2011-12-01 パナソニック株式会社 固体撮像装置
EP2521179B1 (de) 2011-05-06 2015-10-07 ELMOS Semiconductor AG Vorrichtung zur Erfassung des Spektrums elektromagnetischer Strahlung innerhalb eines vorgegebenen Wellenlängenbereichs
US8866951B2 (en) 2011-08-24 2014-10-21 Aptina Imaging Corporation Super-resolution imaging systems
WO2013167208A1 (de) 2012-05-07 2013-11-14 Elmos Semiconductor Ag Mikrooptisches filter und dessen verwendung in einem spektrometer
CN104471924B (zh) * 2012-07-12 2018-05-01 株式会社尼康 拍摄装置
CN106537890A (zh) * 2014-07-16 2017-03-22 索尼公司 复眼摄像装置
KR102350605B1 (ko) * 2017-04-17 2022-01-14 삼성전자주식회사 이미지 센서
EP3419053A1 (de) 2017-06-21 2018-12-26 Life Technologies GmbH Optische komponente mit wellenleiterbasiertem filter
US10638055B2 (en) 2018-01-15 2020-04-28 Qualcomm Incorporated Aperture simulation
KR102116033B1 (ko) * 2018-06-01 2020-05-27 한국기계연구원 근적외선 광 센서 및 이를 포함하는 카메라
TWI675467B (zh) * 2018-08-29 2019-10-21 力晶積成電子製造股份有限公司 影像感測器及其製造方法
CN110324545B (zh) * 2019-06-11 2022-01-28 Oppo广东移动通信有限公司 一种像素结构、图像传感器及终端
WO2021010339A1 (ja) * 2019-07-12 2021-01-21 株式会社小糸製作所 イメージング装置およびその照明装置、車両、車両用灯具
CN113078265B (zh) * 2021-03-26 2023-04-07 联合微电子中心有限责任公司 一种cmos图像传感器及其制作方法

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DE3120849A1 (de) * 1981-05-26 1982-12-23 Agfa-Gevaert Ag, 5090 Leverkusen Farbfilteranordnung fuer eine optoelektronische wandlervorrichtung
US5324930A (en) * 1993-04-08 1994-06-28 Eastman Kodak Company Lens array for photodiode device with an aperture having a lens region and a non-lens region
US5986297A (en) * 1996-05-22 1999-11-16 Eastman Kodak Company Color active pixel sensor with electronic shuttering, anti-blooming and low cross-talk
US5973316A (en) * 1997-07-08 1999-10-26 Nec Research Institute, Inc. Sub-wavelength aperture arrays with enhanced light transmission
US6057586A (en) * 1997-09-26 2000-05-02 Intel Corporation Method and apparatus for employing a light shield to modulate pixel color responsivity
US5914749A (en) * 1998-03-31 1999-06-22 Intel Corporation Magenta-white-yellow (MWY) color system for digital image sensor applications
FR2781929B1 (fr) * 1998-07-28 2002-08-30 St Microelectronics Sa Capteur d'image a reseau de photodiodes
US6236033B1 (en) * 1998-12-09 2001-05-22 Nec Research Institute, Inc. Enhanced optical transmission apparatus utilizing metal films having apertures and periodic surface topography
JP3319419B2 (ja) * 1999-02-24 2002-09-03 日本電気株式会社 固体撮像装置
US7759679B2 (en) * 2004-01-15 2010-07-20 Panasonic Corporation Solid-state imaging device, manufacturing method of solid-state imaging device, and camera employing same

Also Published As

Publication number Publication date
CN1538528A (zh) 2004-10-20
EP1475963B1 (de) 2006-09-20
US20050133879A1 (en) 2005-06-23
KR20040087911A (ko) 2004-10-15
EP1475963A3 (de) 2005-02-02
EP1475963A2 (de) 2004-11-10
TW200507635A (en) 2005-02-16
DE602004002429T2 (de) 2007-09-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8339 Ceased/non-payment of the annual fee