DE602004002429D1 - Festkörper-Bildaufnahme-Vorrichtung, Signalverarbeitungsvorrichtung, Kamera und Vorrichtung zur Aufnahme eines Spektrums - Google Patents
Festkörper-Bildaufnahme-Vorrichtung, Signalverarbeitungsvorrichtung, Kamera und Vorrichtung zur Aufnahme eines SpektrumsInfo
- Publication number
- DE602004002429D1 DE602004002429D1 DE602004002429T DE602004002429T DE602004002429D1 DE 602004002429 D1 DE602004002429 D1 DE 602004002429D1 DE 602004002429 T DE602004002429 T DE 602004002429T DE 602004002429 T DE602004002429 T DE 602004002429T DE 602004002429 D1 DE602004002429 D1 DE 602004002429D1
- Authority
- DE
- Germany
- Prior art keywords
- spectrum
- camera
- recording
- solid
- signal processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003384 imaging method Methods 0.000 title 1
- 238000001228 spectrum Methods 0.000 title 1
Classifications
-
- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B11/00—Means for allowing passage through fences, barriers or the like, e.g. stiles
- E06B11/02—Gates; Doors
- E06B11/022—Gates; Doors characterised by the manner of movement
- E06B11/023—Gates; Doors characterised by the manner of movement where the gate opens within the plane of the gate
- E06B11/026—Gates; Doors characterised by the manner of movement where the gate opens within the plane of the gate horizontally
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14623—Optical shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/80—Camera processing pipelines; Components thereof
- H04N23/84—Camera processing pipelines; Components thereof for processing colour signals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003103359 | 2003-04-07 | ||
| JP2003103359 | 2003-04-07 | ||
| JP2003159263 | 2003-06-04 | ||
| JP2003159263 | 2003-06-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE602004002429D1 true DE602004002429D1 (de) | 2006-11-02 |
| DE602004002429T2 DE602004002429T2 (de) | 2007-09-20 |
Family
ID=32993096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE602004002429T Expired - Fee Related DE602004002429T2 (de) | 2003-04-07 | 2004-04-06 | Festkörper-Bildaufnahme-Vorrichtung, Signalverarbeitungsvorrichtung, Kamera und Vorrichtung zur Aufnahme eines Spektrums |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20050133879A1 (de) |
| EP (1) | EP1475963B1 (de) |
| KR (1) | KR20040087911A (de) |
| CN (1) | CN1538528A (de) |
| DE (1) | DE602004002429T2 (de) |
| TW (1) | TW200507635A (de) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4322166B2 (ja) * | 2003-09-19 | 2009-08-26 | 富士フイルム株式会社 | 固体撮像素子 |
| JP2007005629A (ja) * | 2005-06-24 | 2007-01-11 | Matsushita Electric Ind Co Ltd | 固体撮像装置 |
| WO2007010696A1 (ja) * | 2005-07-21 | 2007-01-25 | Matsushita Electric Industrial Co., Ltd. | 撮像装置 |
| EP1979726B1 (de) * | 2006-01-19 | 2013-11-06 | Philips Intellectual Property & Standards GmbH | Farbgesteuerte beleuchtungsvorrichtung |
| US7615731B2 (en) * | 2006-09-14 | 2009-11-10 | Carestream Health, Inc. | High fill-factor sensor with reduced coupling |
| JP5059476B2 (ja) * | 2007-04-23 | 2012-10-24 | ラピスセミコンダクタ株式会社 | 半導体装置、光測定装置、光検出装置、及び半導体装置の製造方法 |
| EP2034743A4 (de) * | 2007-05-31 | 2014-03-05 | Panasonic Corp | Bildbearbeitungsanordnung |
| US8130293B2 (en) * | 2007-06-15 | 2012-03-06 | Panasonic Corporation | Image processing apparatus having patterned polarizer, patterned polarizer, and image processing method |
| US8564700B2 (en) * | 2007-12-07 | 2013-10-22 | Panasonic Corporation | Image processing device, image processing method, and imaging device using a patterned polarizer |
| KR100920542B1 (ko) * | 2007-12-24 | 2009-10-08 | 주식회사 동부하이텍 | 이미지 센서 및 그 제조방법 |
| JP2009277798A (ja) * | 2008-05-13 | 2009-11-26 | Sony Corp | 固体撮像装置及び電子機器 |
| CN102017601B (zh) * | 2008-06-26 | 2013-03-13 | 松下电器产业株式会社 | 图像处理装置及图像合成方法 |
| KR101467509B1 (ko) * | 2008-07-25 | 2014-12-01 | 삼성전자주식회사 | 이미지 센서 및 이미지 센서 동작 방법 |
| JP5262823B2 (ja) * | 2009-02-23 | 2013-08-14 | ソニー株式会社 | 固体撮像装置および電子機器 |
| US20110175981A1 (en) * | 2010-01-19 | 2011-07-21 | Chun-Hung Lai | 3d color image sensor |
| JP2011176715A (ja) * | 2010-02-25 | 2011-09-08 | Nikon Corp | 裏面照射型撮像素子および撮像装置 |
| US9357956B2 (en) | 2010-03-05 | 2016-06-07 | Seiko Epson Corporation | Spectroscopic sensor and electronic apparatus |
| TWI482488B (zh) * | 2010-04-12 | 2015-04-21 | Univ Nat Cheng Kung | 分散式濾波感測結構及光學裝置 |
| JPWO2011148574A1 (ja) | 2010-05-28 | 2013-07-25 | パナソニック株式会社 | 固体撮像装置 |
| EP2521179B1 (de) | 2011-05-06 | 2015-10-07 | ELMOS Semiconductor AG | Vorrichtung zur Erfassung des Spektrums elektromagnetischer Strahlung innerhalb eines vorgegebenen Wellenlängenbereichs |
| US8866951B2 (en) | 2011-08-24 | 2014-10-21 | Aptina Imaging Corporation | Super-resolution imaging systems |
| EP2847557B1 (de) | 2012-05-07 | 2017-08-23 | Elmos Semiconductor Aktiengesellschaft | Mikrooptisches filter und dessen verwendung in einem spektrometer |
| WO2014010734A1 (ja) * | 2012-07-12 | 2014-01-16 | 株式会社ニコン | 撮像装置 |
| JP6555264B2 (ja) * | 2014-07-16 | 2019-08-07 | ソニー株式会社 | 複眼撮像装置 |
| KR102350605B1 (ko) * | 2017-04-17 | 2022-01-14 | 삼성전자주식회사 | 이미지 센서 |
| EP3419053A1 (de) | 2017-06-21 | 2018-12-26 | Life Technologies GmbH | Optische komponente mit wellenleiterbasiertem filter |
| US10638055B2 (en) | 2018-01-15 | 2020-04-28 | Qualcomm Incorporated | Aperture simulation |
| KR102116033B1 (ko) * | 2018-06-01 | 2020-05-27 | 한국기계연구원 | 근적외선 광 센서 및 이를 포함하는 카메라 |
| TWI675467B (zh) * | 2018-08-29 | 2019-10-21 | 力晶積成電子製造股份有限公司 | 影像感測器及其製造方法 |
| CN110324545B (zh) * | 2019-06-11 | 2022-01-28 | Oppo广东移动通信有限公司 | 一种像素结构、图像传感器及终端 |
| EP3998767B1 (de) * | 2019-07-12 | 2023-10-11 | Koito Manufacturing Co., Ltd. | Bildgebungsvorrichtung, beleuchtungsvorrichtung dafür, fahrzeug und lampenfassung für fahrzeug |
| CN113078265B (zh) * | 2021-03-26 | 2023-04-07 | 联合微电子中心有限责任公司 | 一种cmos图像传感器及其制作方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3120849A1 (de) * | 1981-05-26 | 1982-12-23 | Agfa-Gevaert Ag, 5090 Leverkusen | Farbfilteranordnung fuer eine optoelektronische wandlervorrichtung |
| US5324930A (en) * | 1993-04-08 | 1994-06-28 | Eastman Kodak Company | Lens array for photodiode device with an aperture having a lens region and a non-lens region |
| US5986297A (en) * | 1996-05-22 | 1999-11-16 | Eastman Kodak Company | Color active pixel sensor with electronic shuttering, anti-blooming and low cross-talk |
| US5973316A (en) * | 1997-07-08 | 1999-10-26 | Nec Research Institute, Inc. | Sub-wavelength aperture arrays with enhanced light transmission |
| US6057586A (en) * | 1997-09-26 | 2000-05-02 | Intel Corporation | Method and apparatus for employing a light shield to modulate pixel color responsivity |
| US5914749A (en) * | 1998-03-31 | 1999-06-22 | Intel Corporation | Magenta-white-yellow (MWY) color system for digital image sensor applications |
| FR2781929B1 (fr) * | 1998-07-28 | 2002-08-30 | St Microelectronics Sa | Capteur d'image a reseau de photodiodes |
| US6236033B1 (en) * | 1998-12-09 | 2001-05-22 | Nec Research Institute, Inc. | Enhanced optical transmission apparatus utilizing metal films having apertures and periodic surface topography |
| JP3319419B2 (ja) * | 1999-02-24 | 2002-09-03 | 日本電気株式会社 | 固体撮像装置 |
| WO2005069376A1 (ja) * | 2004-01-15 | 2005-07-28 | Matsushita Electric Industrial Co.,Ltd. | 固体撮像装置、固体撮像装置の製造方法及びこれを用いたカメラ |
-
2004
- 2004-04-05 US US10/818,922 patent/US20050133879A1/en not_active Abandoned
- 2004-04-06 DE DE602004002429T patent/DE602004002429T2/de not_active Expired - Fee Related
- 2004-04-06 EP EP04252041A patent/EP1475963B1/de not_active Expired - Fee Related
- 2004-04-07 TW TW093109586A patent/TW200507635A/zh unknown
- 2004-04-07 CN CNA2004100431009A patent/CN1538528A/zh active Pending
- 2004-04-07 KR KR1020040023681A patent/KR20040087911A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1538528A (zh) | 2004-10-20 |
| US20050133879A1 (en) | 2005-06-23 |
| DE602004002429T2 (de) | 2007-09-20 |
| EP1475963A2 (de) | 2004-11-10 |
| EP1475963A3 (de) | 2005-02-02 |
| KR20040087911A (ko) | 2004-10-15 |
| TW200507635A (en) | 2005-02-16 |
| EP1475963B1 (de) | 2006-09-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: PANASONIC CORP., KADOMA, OSAKA, JP |
|
| 8339 | Ceased/non-payment of the annual fee |