DE602004001098D1 - Wässrige Dispersion zum chemisch-mechanischen Polieren - Google Patents

Wässrige Dispersion zum chemisch-mechanischen Polieren

Info

Publication number
DE602004001098D1
DE602004001098D1 DE602004001098T DE602004001098T DE602004001098D1 DE 602004001098 D1 DE602004001098 D1 DE 602004001098D1 DE 602004001098 T DE602004001098 T DE 602004001098T DE 602004001098 T DE602004001098 T DE 602004001098T DE 602004001098 D1 DE602004001098 D1 DE 602004001098D1
Authority
DE
Germany
Prior art keywords
aqueous dispersion
mechanical polishing
chemical mechanical
polishing
chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004001098T
Other languages
English (en)
Other versions
DE602004001098T2 (de
Inventor
Masayuki Hattori
Nobuo Kawahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Publication of DE602004001098D1 publication Critical patent/DE602004001098D1/de
Application granted granted Critical
Publication of DE602004001098T2 publication Critical patent/DE602004001098T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
DE602004001098T 2003-07-01 2004-06-30 Wässrige Dispersion zum chemisch-mechanischen Polieren Active DE602004001098T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003270113A JP4637464B2 (ja) 2003-07-01 2003-07-01 化学機械研磨用水系分散体
JP2003270113 2003-07-01

Publications (2)

Publication Number Publication Date
DE602004001098D1 true DE602004001098D1 (de) 2006-07-20
DE602004001098T2 DE602004001098T2 (de) 2006-11-30

Family

ID=33432372

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004001098T Active DE602004001098T2 (de) 2003-07-01 2004-06-30 Wässrige Dispersion zum chemisch-mechanischen Polieren

Country Status (7)

Country Link
US (1) US7090786B2 (de)
EP (1) EP1493789B1 (de)
JP (1) JP4637464B2 (de)
KR (1) KR100609362B1 (de)
CN (1) CN1276051C (de)
DE (1) DE602004001098T2 (de)
TW (1) TWI263672B (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4648019B2 (ja) 2005-02-02 2011-03-09 本田技研工業株式会社 加圧バッグの製造方法、及び係る加圧バッグを用いた複合材成形品の成形方法
DE102005017372A1 (de) * 2005-04-14 2006-10-19 Degussa Ag Wässrige Ceroxiddispersion
TWI385226B (zh) 2005-09-08 2013-02-11 羅門哈斯電子材料Ｃｍｐ控股公司 用於移除聚合物阻障之研磨漿液
KR100880107B1 (ko) * 2006-01-25 2009-01-21 주식회사 엘지화학 Ｃｍｐ 슬러리 및 이를 이용한 반도체 웨이퍼의 연마 방법
JPWO2007108215A1 (ja) * 2006-03-20 2009-08-06 三井化学株式会社 研磨用組成物
US7538969B2 (en) * 2006-08-23 2009-05-26 Imation Corp. Servo pattern with encoded data
WO2008105223A1 (ja) * 2007-02-27 2008-09-04 Hitachi Chemical Co., Ltd. シリコン膜用ｃｍｐスラリー
KR101657723B1 (ko) * 2008-07-15 2016-09-19 다우 글로벌 테크놀로지스 엘엘씨 살생물 조성물 및 방법
JP5497400B2 (ja) * 2009-10-14 2014-05-21 日本化学工業株式会社 半導体ウエハ研磨用組成物および研磨方法
JP2012146972A (ja) 2010-12-24 2012-08-02 Hitachi Chem Co Ltd 研磨液及びこの研磨液を用いた基板の研磨方法
US9281210B2 (en) * 2013-10-10 2016-03-08 Cabot Microelectronics Corporation Wet-process ceria compositions for polishing substrates, and methods related thereto
JP6930976B2 (ja) * 2016-01-06 2021-09-01 シーエムシー マテリアルズ，インコーポレイティド 低ｋ基板の研磨方法
KR102475282B1 (ko) * 2017-03-29 2022-12-07 삼성전자주식회사 화학적 기계적 연마용 슬러리 조성물
KR102623640B1 (ko) * 2020-07-22 2024-01-11 삼성에스디아이 주식회사 텅스텐 패턴 웨이퍼 연마용 ｃｍｐ 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼의 연마 방법

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1287259B (de) * 1967-04-26 1969-01-16 Henkel & Cie Gmbh Verwendung von Nitroalkoholen als Potenzierungsmittel in antimikrobiellen Mitteln
JP2877440B2 (ja) 1989-06-09 1999-03-31 ナルコ ケミカル カンパニー コロイド状シリカ研磨性スラリー
JPH1022241A (ja) * 1996-07-08 1998-01-23 Tokyo Fine Chem Kk シリコンウェハ用ラップ液およびラップ剤
JPH10154672A (ja) * 1996-09-30 1998-06-09 Hitachi Chem Co Ltd 酸化セリウム研磨剤及び基板の研磨法
ES2216490T3 (es) * 1998-02-24 2004-10-16 Showa Denko Kabushiki Kaisha Composicion abrasiva para pulir un dispositivo semiconductor y procedimiento para producir un dispositivo semiconductor con la misma.
JP2001118812A (ja) * 1999-08-09 2001-04-27 Nikon Corp 化学機械研磨装置および半導体デバイス製造方法
US6258140B1 (en) * 1999-09-27 2001-07-10 Fujimi America Inc. Polishing composition
JP4123685B2 (ja) * 2000-05-18 2008-07-23 Ｊｓｒ株式会社 化学機械研磨用水系分散体
JP2002114970A (ja) * 2000-10-04 2002-04-16 Asahi Denka Kogyo Kk 水系ラップ液及び水系ラップ剤
JP2002155268A (ja) * 2000-11-20 2002-05-28 Toshiba Corp 化学的機械的研磨用スラリ及び半導体装置の製造方法
JP2002203818A (ja) * 2000-12-27 2002-07-19 Jsr Corp 研磨方法
JP2002184734A (ja) * 2000-12-19 2002-06-28 Tokuyama Corp 半導体装置の製造方法
JP2002190458A (ja) * 2000-12-21 2002-07-05 Jsr Corp 化学機械研磨用水系分散体
JP5017574B2 (ja) * 2001-05-25 2012-09-05 エア プロダクツ アンド ケミカルズ インコーポレイテッド 酸化セリウム研磨剤及び基板の製造方法
JP2003082336A (ja) * 2001-09-12 2003-03-19 Asahi Denka Kogyo Kk 水系ラップ液及び水系ラップ剤
JP2003124159A (ja) * 2001-10-16 2003-04-25 Asahi Denka Kogyo Kk 水系ラップ液及び水系ラップ剤

Also Published As

Publication number Publication date
KR100609362B1 (ko) 2006-08-08
US7090786B2 (en) 2006-08-15
TWI263672B (en) 2006-10-11
EP1493789B1 (de) 2006-06-07
JP4637464B2 (ja) 2011-02-23
CN1276051C (zh) 2006-09-20
US20050001199A1 (en) 2005-01-06
TW200504191A (en) 2005-02-01
CN1576345A (zh) 2005-02-09
JP2005026604A (ja) 2005-01-27
KR20050004039A (ko) 2005-01-12
EP1493789A1 (de) 2005-01-05
DE602004001098T2 (de) 2006-11-30

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