DE602004000063D1 - LCT-Epoxidharz mit HTC-Oligomeren und Herstellungsverfahren - Google Patents

LCT-Epoxidharz mit HTC-Oligomeren und Herstellungsverfahren

Info

Publication number
DE602004000063D1
DE602004000063D1 DE200460000063 DE602004000063T DE602004000063D1 DE 602004000063 D1 DE602004000063 D1 DE 602004000063D1 DE 200460000063 DE200460000063 DE 200460000063 DE 602004000063 T DE602004000063 T DE 602004000063T DE 602004000063 D1 DE602004000063 D1 DE 602004000063D1
Authority
DE
Germany
Prior art keywords
htc
oligomers
epoxy resin
manufacturing process
lct epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE200460000063
Other languages
English (en)
Other versions
DE602004000063T2 (de
Inventor
James D B Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Energy Inc
Original Assignee
Siemens Westinghouse Power Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Westinghouse Power Corp filed Critical Siemens Westinghouse Power Corp
Publication of DE602004000063D1 publication Critical patent/DE602004000063D1/de
Application granted granted Critical
Publication of DE602004000063T2 publication Critical patent/DE602004000063T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/30Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00Liquid crystal materials
    • C09K19/04Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/38Polymers
    • C09K19/3833Polymers with mesogenic groups in the side chain
    • C09K19/3876Polyoxyalkylene polymers
    • C09K19/388Polyepoxides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/32Insulating of coils, windings, or parts thereof
    • H01F27/323Insulation between winding turns, between winding layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/32Insulating of coils, windings, or parts thereof
    • H01F27/327Encapsulating or impregnating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991Coated
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
DE200460000063 2003-07-11 2004-04-01 LCT-Epoxidharz mit HTC-Oligomeren und Herstellungsverfahren Expired - Lifetime DE602004000063T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US618125 2003-07-11
US10/618,125 US7033670B2 (en) 2003-07-11 2003-07-11 LCT-epoxy polymers with HTC-oligomers and method for making the same

Publications (2)

Publication Number Publication Date
DE602004000063D1 true DE602004000063D1 (de) 2005-09-29
DE602004000063T2 DE602004000063T2 (de) 2006-03-02

Family

ID=33452704

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200460000063 Expired - Lifetime DE602004000063T2 (de) 2003-07-11 2004-04-01 LCT-Epoxidharz mit HTC-Oligomeren und Herstellungsverfahren

Country Status (3)

Country Link
US (2) US7033670B2 (de)
EP (1) EP1496522B1 (de)
DE (1) DE602004000063T2 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7781063B2 (en) * 2003-07-11 2010-08-24 Siemens Energy, Inc. High thermal conductivity materials with grafted surface functional groups
US7033670B2 (en) * 2003-07-11 2006-04-25 Siemens Power Generation, Inc. LCT-epoxy polymers with HTC-oligomers and method for making the same
US20050277721A1 (en) * 2004-06-15 2005-12-15 Siemens Westinghouse Power Corporation High thermal conductivity materials aligned within resins
US8216672B2 (en) * 2004-06-15 2012-07-10 Siemens Energy, Inc. Structured resin systems with high thermal conductivity fillers
US7592045B2 (en) * 2004-06-15 2009-09-22 Siemens Energy, Inc. Seeding of HTC fillers to form dendritic structures
US7553781B2 (en) * 2004-06-15 2009-06-30 Siemens Energy, Inc. Fabrics with high thermal conductivity coatings
US20080050580A1 (en) * 2004-06-15 2008-02-28 Stevens Gary C High Thermal Conductivity Mica Paper Tape
US20050274774A1 (en) * 2004-06-15 2005-12-15 Smith James D Insulation paper with high thermal conductivity materials
US7553438B2 (en) * 2004-06-15 2009-06-30 Siemens Energy, Inc. Compression of resin impregnated insulating tapes
US7776392B2 (en) * 2005-04-15 2010-08-17 Siemens Energy, Inc. Composite insulation tape with loaded HTC materials
US8030818B2 (en) * 2004-06-15 2011-10-04 Siemens Energy, Inc. Stator coil with improved heat dissipation
US7579397B2 (en) * 2005-01-27 2009-08-25 Rensselaer Polytechnic Institute Nanostructured dielectric composite materials
US7846853B2 (en) * 2005-04-15 2010-12-07 Siemens Energy, Inc. Multi-layered platelet structure
US7651963B2 (en) 2005-04-15 2010-01-26 Siemens Energy, Inc. Patterning on surface with high thermal conductivity materials
US7955661B2 (en) * 2005-06-14 2011-06-07 Siemens Energy, Inc. Treatment of micropores in mica materials
US20070026221A1 (en) * 2005-06-14 2007-02-01 Siemens Power Generation, Inc. Morphological forms of fillers for electrical insulation
US7781057B2 (en) * 2005-06-14 2010-08-24 Siemens Energy, Inc. Seeding resins for enhancing the crystallinity of polymeric substructures
US7655295B2 (en) 2005-06-14 2010-02-02 Siemens Energy, Inc. Mix of grafted and non-grafted particles in a resin
US7851059B2 (en) * 2005-06-14 2010-12-14 Siemens Energy, Inc. Nano and meso shell-core control of physical properties and performance of electrically insulating composites
US8357433B2 (en) * 2005-06-14 2013-01-22 Siemens Energy, Inc. Polymer brushes
US7547847B2 (en) * 2006-09-19 2009-06-16 Siemens Energy, Inc. High thermal conductivity dielectric tape
WO2010118336A1 (en) * 2009-04-10 2010-10-14 Rensselaer Polytechnic Institute Diblock copolymer modified nanoparticle-polymer nanocomposites for electrical insulation
US8917510B2 (en) * 2011-01-14 2014-12-23 International Business Machines Corporation Reversibly adhesive thermal interface material
US8511369B2 (en) 2011-04-18 2013-08-20 International Business Machines Corporation Thermally reversible crosslinked polymer modified particles and methods for making the same
JP5163821B1 (ja) 2011-08-12 2013-03-13 堺化学工業株式会社 被覆酸化マグネシウム粒子、その製造方法、放熱性フィラー及び樹脂組成物
US8960291B2 (en) * 2012-03-21 2015-02-24 Harris Corporation Method for forming a hydrocarbon resource RF radiator
DE102012205046A1 (de) * 2012-03-29 2013-10-02 Siemens Aktiengesellschaft Elektroisolationskörper für eine Hochspannungsrotationsmaschine und Verfahren zum Herstellen des Elektroisolationskörpers
DE102013201053A1 (de) * 2013-01-23 2014-07-24 Siemens Aktiengesellschaft Isolationsanordnung für eine Hochspannungsmaschine
US9085719B2 (en) 2013-03-18 2015-07-21 International Business Machines Corporation Thermally reversible thermal interface materials with improved moisture resistance
US9928935B2 (en) 2013-05-31 2018-03-27 General Electric Company Electrical insulation system
US9879163B2 (en) 2014-06-06 2018-01-30 General Electric Company Composition for bonding windings or core laminates in an electrical machine, and associated method
US9911521B2 (en) 2014-06-06 2018-03-06 General Electric Company Curable composition for electrical machine, and associated method
US11677282B2 (en) * 2020-02-27 2023-06-13 Accelerated Systems Inc. Composite material for thermal management in an electric motor
CN113527881B (zh) * 2021-08-19 2023-10-27 北京印刷学院 一种聚酰亚胺复合薄膜及其制备方法

Family Cites Families (140)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US619075A (en) * 1899-02-07 Post-hole auger
US3069302A (en) 1955-06-13 1962-12-18 Westinghouse Electric Corp Insulated conductors and processes for producing them
GB881036A (en) 1957-02-27 1961-11-01 Mc Graw Edison Co Improvements relating to insulated electrical conductors
US2996106A (en) * 1957-03-13 1961-08-15 Synthetic Mica Corp Method of manufacturing inorganically bonded micaceous sheet
BE609030A (de) * 1960-10-11 1900-01-01
US3427189A (en) * 1965-03-10 1969-02-11 Atomic Energy Commission Radiation resistant insulation
US3246271A (en) * 1965-04-16 1966-04-12 Westinghouse Electric Corp Paper insulation for transformers
US3868613A (en) * 1971-10-14 1975-02-25 Westinghouse Electric Corp Solventless epoxy resin composition and an electrical member impregnated therewith
JPS5232062B2 (de) * 1972-12-25 1977-08-19
US3960803A (en) * 1973-06-22 1976-06-01 Westinghouse Electric Corporation Flexible nontacky prepreg for bonding coils in high voltage devices and method of making said prepreg
CA1016586A (en) * 1974-02-18 1977-08-30 Hubert G. Panter Grounding of outer winding insulation to cores in dynamoelectric machines
US3974302A (en) * 1974-11-26 1976-08-10 Westinghouse Electric Corporation Method of making patterned dry resin coated sheet insulation
CH579844A5 (de) 1974-12-04 1976-09-15 Bbc Brown Boveri & Cie
US4160926A (en) * 1975-06-20 1979-07-10 The Epoxylite Corporation Materials and impregnating compositions for insulating electric machines
US4760296A (en) * 1979-07-30 1988-07-26 General Electric Company Corona-resistant insulation, electrical conductors covered therewith and dynamoelectric machines and transformers incorporating components of such insulated conductors
US4335367A (en) * 1979-08-17 1982-06-15 Tokyo Shibaura Denki Kabushiki Kaisha Electrically insulated coil
US4361661A (en) 1980-05-22 1982-11-30 Western Electric Company, Incorporated Thermal backfill composition method
US4491618A (en) * 1980-11-08 1985-01-01 Hitachi Chemical Company, Ltd. Reconstituted mica materials, reconstituted mica prepreg materials, reconstituted mica products and insulated coils
US4400226A (en) * 1981-07-16 1983-08-23 General Electric Company Method of making an insulated electromagnetic coil
FR2517460A1 (fr) 1981-12-02 1983-06-03 Alsthom Atlantique Ruban de guipage pour isolation elementaire de conducteurs
US4427740A (en) * 1982-04-09 1984-01-24 Westinghouse Electric Corp. High maximum service temperature low cure temperature non-linear electrical grading coatings resistant to V.P.I. resins containing highly reactive components
US4634911A (en) * 1985-04-16 1987-01-06 Westinghouse Electric Corp. High voltage dynamoelectric machine with selectively increased coil turn-to-turn insulation strength
US4694064A (en) * 1986-02-28 1987-09-15 The Dow Chemical Company Rod-shaped dendrimer
US4704322A (en) 1986-09-22 1987-11-03 Essex Group, Inc. Resin rich mica tape
SE455246B (sv) 1986-10-22 1988-06-27 Asea Ab Herva for anordnande i spar i en stator eller rotor i en elektrisk maskin och sett att tillverka en sadan herva
US5011872A (en) * 1987-12-21 1991-04-30 The Carborudum Company Thermally conductive ceramic/polymer composites
DE3812697A1 (de) * 1988-04-16 1989-12-28 Programmelectronic Eng Ag Verfahren zur reduzierung der stoergroessenwirkung bei geblaesebrenneranlagen und geblaesebrenneranlage
FI105605B (fi) 1989-04-27 2000-09-15 Siemens Ag Planarisoiva eriste
JP2542119B2 (ja) * 1989-11-01 1996-10-09 ポリプラスチックス株式会社 熱可塑性相互侵入網目構造体及びその形成法
US5126192A (en) * 1990-01-26 1992-06-30 International Business Machines Corporation Flame retardant, low dielectric constant microsphere filled laminate
US5288769A (en) * 1991-03-27 1994-02-22 Motorola, Inc. Thermally conducting adhesive containing aluminum nitride
US5352493A (en) 1991-05-03 1994-10-04 Veniamin Dorfman Method for forming diamond-like nanocomposite or doped-diamond-like nanocomposite films
US5490319A (en) * 1992-01-29 1996-02-13 Ebara Corporation Thermotropic liquid crystal polymer composition and insulator
US5281388A (en) * 1992-03-20 1994-01-25 Mcdonnell Douglas Corporation Resin impregnation process for producing a resin-fiber composite
US5409968A (en) * 1992-11-06 1995-04-25 Minnesota Mining And Manufacturing Company Controlled conductivity antistatic articles
DE4244298C2 (de) * 1992-12-28 2003-02-27 Alstom Isolierband und Verfahren zu seiner Herstellung
US5433906A (en) * 1993-07-09 1995-07-18 General Motors Corporation Composite of small carbon fibers and thermoplastics and method for making same
US5510174A (en) 1993-07-14 1996-04-23 Chomerics, Inc. Thermally conductive materials containing titanium diboride filler
US5578901A (en) 1994-02-14 1996-11-26 E. I. Du Pont De Nemours And Company Diamond fiber field emitters
JPH07268622A (ja) 1994-03-01 1995-10-17 Applied Sci & Technol Inc マイクロ波プラズマ付着源
US5723920A (en) * 1994-10-12 1998-03-03 General Electric Company Stator bars internally graded with conductive binder tape
NL9500509A (nl) * 1995-03-14 1996-10-01 Vicair B V Ondersteuningsinrichting zoals bijvoorbeeld een kussen.
JP3512519B2 (ja) * 1995-04-10 2004-03-29 大塚化学ホールディングス株式会社 高熱伝導性樹脂組成物及びそのフィルム
US5801334A (en) * 1995-08-24 1998-09-01 Theodorides; Demetrius C. Conductor (turn) insulation system for coils in high voltage machines
US5710475A (en) * 1995-11-22 1998-01-20 General Electric Company Insulation of high thermal conductivity and apparatus containing same
JP2000501782A (ja) * 1995-12-01 2000-02-15 イー・アイ・デユポン・ドウ・ヌムール・アンド・カンパニー ダイヤモンド状炭素で被覆された改善された機械的性質をもつアラミド繊維
US5780119A (en) * 1996-03-20 1998-07-14 Southwest Research Institute Treatments to reduce friction and wear on metal alloy components
US6313219B1 (en) 1996-05-02 2001-11-06 Lucent Technologies, Inc. Method for hybrid inorganic/organic composite materials
US6130495A (en) 1996-05-15 2000-10-10 Siemens Aktiengesellschaft Supporting element for an electric winding, turbogenerator and method of producing a corona shield
JP3201262B2 (ja) 1996-05-30 2001-08-20 株式会社日立製作所 熱硬化性樹脂組成物,電機絶縁線輪,回転電機及びその製造方法
US6344271B1 (en) * 1998-11-06 2002-02-05 Nanoenergy Corporation Materials and products using nanostructured non-stoichiometric substances
US6255738B1 (en) * 1996-09-30 2001-07-03 Tessera, Inc. Encapsulant for microelectronic devices
US5904984A (en) * 1996-10-17 1999-05-18 Siemens Westinghouse Power Corporation Electrical insulation using liquid crystal thermoset epoxy resins
US6359232B1 (en) * 1996-12-19 2002-03-19 General Electric Company Electrical insulating material and stator bar formed therewith
US5878620A (en) * 1997-01-23 1999-03-09 Schlege Systems, Inc. Conductive fabric sensor for vehicle seats
US6103382A (en) 1997-03-14 2000-08-15 Siemens Westinghouse Power Corporation Catalyzed mica tapes for electrical insulation
US6160042A (en) 1997-05-01 2000-12-12 Edison Polymer Innovation Corporation Surface treated boron nitride for forming a low viscosity high thermal conductivity polymer based boron nitride composition and method
DE19720555A1 (de) 1997-05-16 1998-11-19 Abb Research Ltd Statorwicklungsisolierung
RU2114210C1 (ru) * 1997-05-30 1998-06-27 Валерий Павлович Гончаренко Способ формирования углеродного алмазоподобного покрытия в вакууме
EP0887417A3 (de) * 1997-06-27 1999-01-13 Takeda Chemical Industries, Ltd. Verfahren zur Herstellung von einem 19P2-Liganden mittels Spaltung eines diesen Liganden enthaltenden Fusionsproteins
US6821672B2 (en) 1997-09-02 2004-11-23 Kvg Technologies, Inc. Mat of glass and other fibers and method for producing it
WO1999026286A1 (en) 1997-11-13 1999-05-27 Bp Amoco Corporation Heat pipe thermal management apparatus
US6015597A (en) * 1997-11-26 2000-01-18 3M Innovative Properties Company Method for coating diamond-like networks onto particles
US6265068B1 (en) * 1997-11-26 2001-07-24 3M Innovative Properties Company Diamond-like carbon coatings on inorganic phosphors
DE69739076D1 (de) 1997-12-18 2008-12-11 Mitsubishi Electric Corp Rotierende elektrische Maschine
US5938934A (en) * 1998-01-13 1999-08-17 Dow Corning Corporation Dendrimer-based nanoscopic sponges and metal composites
US6153721A (en) * 1998-02-26 2000-11-28 Honeywell International Inc. Preparation of polyindanebisphenols and polymers derived therefrom
JP3458693B2 (ja) * 1998-02-27 2003-10-20 株式会社日立製作所 絶縁材及び電機巻線
US6288341B1 (en) * 1998-02-27 2001-09-11 Hitachi, Ltd. Insulating material windings using same and a manufacturing method thereof
US6396864B1 (en) * 1998-03-13 2002-05-28 Jds Uniphase Corporation Thermally conductive coatings for light emitting devices
EP0944098B1 (de) * 1998-03-19 2005-06-01 Hitachi, Ltd. Wärmeleitfähige, elektrisch nicht leitende Zusammensetzung
US6369183B1 (en) * 1998-08-13 2002-04-09 Wm. Marsh Rice University Methods and materials for fabrication of alumoxane polymers
DE19850826A1 (de) 1998-11-04 2000-05-11 Basf Ag Als Separatoren in elektrochemischen Zellen geeignete Verbundkörper
US6242825B1 (en) * 1998-11-25 2001-06-05 Hitachi, Ltd. Electric rotating machine with reduced thickness and volume of insulation
US6162849A (en) 1999-01-11 2000-12-19 Ferro Corporation Thermally conductive thermoplastic
US6048919A (en) * 1999-01-29 2000-04-11 Chip Coolers, Inc. Thermally conductive composite material
WO2000049066A1 (en) 1999-02-16 2000-08-24 The Dow Chemical Company Core-shell tectodendrimers
US6572935B1 (en) 1999-03-13 2003-06-03 The Regents Of The University Of California Optically transparent, scratch-resistant, diamond-like carbon coatings
US6238790B1 (en) * 1999-05-26 2001-05-29 Siemens Westinghouse Power Corporation Superdielectric high voltage insulation for dynamoelectric machinery
US6384152B2 (en) * 1999-07-19 2002-05-07 Siemens Westinghouse Power Corporation Insulating resin of epoxy resin, epoxy diluent, phenolic accelerator and organotin catalyst
CN1215490C (zh) 1999-08-27 2005-08-17 株式会社日立制作所 绝缘材料和电机绕组及其制造方法
WO2001040537A1 (en) * 1999-11-30 2001-06-07 The Regents Of The University Of California Method for producing fluorinated diamond-like carbon films
WO2001044373A1 (en) * 1999-12-17 2001-06-21 Matsushita Electric Industrial Co., Ltd. Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module
US6620497B2 (en) * 2000-01-11 2003-09-16 Cool Options, Inc. Polymer composition with boron nitride coated carbon flakes
KR100615103B1 (ko) * 2000-02-16 2006-08-25 풀러린 인터내셔날 코포레이션 나노튜브, 상기 나노튜브를 구비한 전계 방출 음극과 음극선관 및 이들을 형성하기 위한 방법
US6190775B1 (en) 2000-02-24 2001-02-20 Siemens Westinghouse Power Corporation Enhanced dielectric strength mica tapes
TW555794B (en) * 2000-02-29 2003-10-01 Shinetsu Chemical Co Method for the preparation of low specific gravity silicone rubber elastomers
WO2001068749A1 (en) 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
FR2808622B1 (fr) 2000-05-04 2006-09-08 Bollore Generateur electrochimique a electrolyte polymerique comprenant des polymeres fluores
US20020058140A1 (en) * 2000-09-18 2002-05-16 Dana David E. Glass fiber coating for inhibiting conductive anodic filament formation in electronic supports
US7150911B2 (en) 2001-02-08 2006-12-19 Showa Denko Kabushiki Kaisha Electrical insulating vapor grown carbon fiber and method for producing the same, and use thereof
JP3576119B2 (ja) 2001-04-27 2004-10-13 株式会社東芝 回転電機のコイル及びこのコイルの絶縁に用いられるマイカーテープ
US20030040563A1 (en) * 2001-08-23 2003-02-27 Sagal E. Mikhail Substantially non-abrasive thermally conductive polymer composition containing boron nitride
CN1321232C (zh) 2001-09-20 2007-06-13 昭和电工株式会社 细碳纤维混合物及其组合物
EP1300439A1 (de) 2001-09-26 2003-04-09 Abb Research Ltd. Füllstoff für die Verwendung in elektrischen Feststoff-Isolatoren
WO2003040445A1 (en) 2001-11-07 2003-05-15 Showa Denko K.K. Fine carbon fiber, method for producing the same and use thereof
US20030139510A1 (en) * 2001-11-13 2003-07-24 Sagal E. Mikhail Polymer compositions having high thermal conductivity and dielectric strength and molded packaging assemblies produced therefrom
US6746758B2 (en) * 2002-02-25 2004-06-08 Hitachi, Ltd. Insulating material and electric machine winding and method for manufacturing the same
US6905655B2 (en) * 2002-03-15 2005-06-14 Nanomix, Inc. Modification of selectivity for sensing for nanostructure device arrays
EP1530223B1 (de) 2002-07-04 2009-02-04 Kabushiki Kaisha Toshiba Isolationselement mit hoher thermischer leitfähigkeit, verfahren zu dessen herstellung, elektromagnetische spule und elektromagnetische vorrichtung
US7524557B2 (en) 2002-07-04 2009-04-28 Kabushiki Kaisha Toshiba Highly heat conductive insulating member, method of manufacturing the same and electromagnetic device
JP2004051852A (ja) * 2002-07-22 2004-02-19 Polymatech Co Ltd 熱伝導性高分子成形体及びその製造方法
US20040102529A1 (en) * 2002-11-22 2004-05-27 Campbell John Robert Functionalized colloidal silica, dispersions and methods made thereby
JP2004175926A (ja) * 2002-11-27 2004-06-24 Polymatech Co Ltd 熱伝導性エポキシ樹脂成形体及びその製造方法
KR20050085428A (ko) 2002-12-10 2005-08-29 시바 스페셜티 케미칼스 홀딩 인크. SiOz(0.7 ≤z ≤2.0)로 피복된 알루미늄계 플레이크형안료
US7250477B2 (en) * 2002-12-20 2007-07-31 General Electric Company Thermoset composite composition, method, and article
JP2004250665A (ja) * 2003-01-30 2004-09-09 Suzuka Fuji Xerox Co Ltd 耐熱性熱伝導性材料
US7013965B2 (en) * 2003-04-29 2006-03-21 General Electric Company Organic matrices containing nanomaterials to enhance bulk thermal conductivity
JP3843967B2 (ja) * 2003-06-11 2006-11-08 三菱電機株式会社 絶縁コイルの製造方法
US7033670B2 (en) * 2003-07-11 2006-04-25 Siemens Power Generation, Inc. LCT-epoxy polymers with HTC-oligomers and method for making the same
US7781063B2 (en) * 2003-07-11 2010-08-24 Siemens Energy, Inc. High thermal conductivity materials with grafted surface functional groups
US7042346B2 (en) * 2003-08-12 2006-05-09 Gaige Bradley Paulsen Radio frequency identification parts verification system and method for using same
US20050049350A1 (en) * 2003-08-25 2005-03-03 Sandeep Tonapi Thin bond-line silicone adhesive composition and method for preparing the same
US20050116336A1 (en) * 2003-09-16 2005-06-02 Koila, Inc. Nano-composite materials for thermal management applications
JP4599063B2 (ja) 2004-01-15 2010-12-15 株式会社東芝 コイル巻回用絶縁テープ
US20050236606A1 (en) 2004-04-26 2005-10-27 Certainteed Corporation Flame resistant fibrous insulation and methods of making the same
US7268293B2 (en) 2004-06-15 2007-09-11 Siemen Power Generation, Inc. Surface coating of lapped insulation tape
US20050277349A1 (en) 2004-06-15 2005-12-15 Siemens Westinghouse Power Corporation High thermal conductivity materials incorporated into resins
US20080050580A1 (en) * 2004-06-15 2008-02-28 Stevens Gary C High Thermal Conductivity Mica Paper Tape
US7592045B2 (en) 2004-06-15 2009-09-22 Siemens Energy, Inc. Seeding of HTC fillers to form dendritic structures
US7776392B2 (en) 2005-04-15 2010-08-17 Siemens Energy, Inc. Composite insulation tape with loaded HTC materials
JP2008507594A (ja) 2004-06-15 2008-03-13 シーメンス パワー ジェネレーション インコーポレイテッド 樹脂内に配列した高熱伝導性材料
US20050274774A1 (en) 2004-06-15 2005-12-15 Smith James D Insulation paper with high thermal conductivity materials
US7309526B2 (en) 2004-06-15 2007-12-18 Siemens Power Generation, Inc. Diamond like carbon coating on nanofillers
US8216672B2 (en) 2004-06-15 2012-07-10 Siemens Energy, Inc. Structured resin systems with high thermal conductivity fillers
US7553781B2 (en) 2004-06-15 2009-06-30 Siemens Energy, Inc. Fabrics with high thermal conductivity coatings
US20050277721A1 (en) 2004-06-15 2005-12-15 Siemens Westinghouse Power Corporation High thermal conductivity materials aligned within resins
US7553438B2 (en) * 2004-06-15 2009-06-30 Siemens Energy, Inc. Compression of resin impregnated insulating tapes
US7180409B2 (en) * 2005-03-11 2007-02-20 Temic Automotive Of North America, Inc. Tire tread wear sensor system
US7651963B2 (en) 2005-04-15 2010-01-26 Siemens Energy, Inc. Patterning on surface with high thermal conductivity materials
US7846853B2 (en) * 2005-04-15 2010-12-07 Siemens Energy, Inc. Multi-layered platelet structure
US20060234027A1 (en) 2005-04-18 2006-10-19 Huusken Robert W Fire retardant laminate
US7655295B2 (en) * 2005-06-14 2010-02-02 Siemens Energy, Inc. Mix of grafted and non-grafted particles in a resin
US8357433B2 (en) 2005-06-14 2013-01-22 Siemens Energy, Inc. Polymer brushes
US20070026221A1 (en) * 2005-06-14 2007-02-01 Siemens Power Generation, Inc. Morphological forms of fillers for electrical insulation
US7955661B2 (en) * 2005-06-14 2011-06-07 Siemens Energy, Inc. Treatment of micropores in mica materials
US7781057B2 (en) 2005-06-14 2010-08-24 Siemens Energy, Inc. Seeding resins for enhancing the crystallinity of polymeric substructures
JP4996086B2 (ja) 2005-09-29 2012-08-08 株式会社東芝 マイカテープおよびこのマイカテープを用いた回転電機コイル
US20080127848A1 (en) * 2006-03-28 2008-06-05 Deis Robert M Methods and apparatuses for making lithographic plates
US7547847B2 (en) * 2006-09-19 2009-06-16 Siemens Energy, Inc. High thermal conductivity dielectric tape

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EP1496522B1 (de) 2005-08-24
US20100311936A1 (en) 2010-12-09
US7033670B2 (en) 2006-04-25
EP1496522A1 (de) 2005-01-12
US8039530B2 (en) 2011-10-18
US20050010014A1 (en) 2005-01-13
DE602004000063T2 (de) 2006-03-02

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