DE60143548D1 - Einrichtung und vorrichtung zur montage von bauteilen - Google Patents

Einrichtung und vorrichtung zur montage von bauteilen

Info

Publication number
DE60143548D1
DE60143548D1 DE60143548T DE60143548T DE60143548D1 DE 60143548 D1 DE60143548 D1 DE 60143548D1 DE 60143548 T DE60143548 T DE 60143548T DE 60143548 T DE60143548 T DE 60143548T DE 60143548 D1 DE60143548 D1 DE 60143548D1
Authority
DE
Germany
Prior art keywords
assembling components
assembling
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60143548T
Other languages
English (en)
Inventor
Yasuharu Ueno
Shozo Minamitani
Shinji Kanayama
Takashi Shimizu
Satoshi Sida
Shunji Onobori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Application granted granted Critical
Publication of DE60143548D1 publication Critical patent/DE60143548D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53187—Multiple station assembly apparatus
DE60143548T 2000-03-23 2001-03-23 Einrichtung und vorrichtung zur montage von bauteilen Expired - Lifetime DE60143548D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000082263A JP4480840B2 (ja) 2000-03-23 2000-03-23 部品実装装置、及び部品実装方法

Publications (1)

Publication Number Publication Date
DE60143548D1 true DE60143548D1 (de) 2011-01-05

Family

ID=18599093

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60112416T Expired - Lifetime DE60112416T2 (de) 2000-03-23 2001-03-23 Einrichtung und verfahren zur montage von bauteilen
DE60143548T Expired - Lifetime DE60143548D1 (de) 2000-03-23 2001-03-23 Einrichtung und vorrichtung zur montage von bauteilen

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE60112416T Expired - Lifetime DE60112416T2 (de) 2000-03-23 2001-03-23 Einrichtung und verfahren zur montage von bauteilen

Country Status (6)

Country Link
US (2) US7020953B2 (de)
EP (2) EP1553815B1 (de)
JP (1) JP4480840B2 (de)
DE (2) DE60112416T2 (de)
SG (1) SG144725A1 (de)
WO (1) WO2001072097A2 (de)

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US20030086089A1 (en) * 2001-11-02 2003-05-08 Mike Carlomagno System and method for rapid alignment and accurate placement of electronic components on a printed circuit board
WO2004043126A1 (en) * 2002-11-08 2004-05-21 Assembléon N.V. Method for moving at least two elements of a placement machine as well as such a placement machine
TW200419640A (en) * 2003-02-25 2004-10-01 Matsushita Electric Ind Co Ltd Electronic component placement machine and electronic component placement method
US7754832B2 (en) * 2003-02-28 2010-07-13 The Regents Of The University Of California Block copolyolefins possessing a tapered structure
JP4334892B2 (ja) * 2003-03-20 2009-09-30 パナソニック株式会社 部品実装方法
WO2005020657A1 (ja) * 2003-08-20 2005-03-03 Murata Manufacturing Co., Ltd. 部品装着装置及び部品装着方法
JP4390503B2 (ja) 2003-08-27 2009-12-24 パナソニック株式会社 部品実装装置及び部品実装方法
JP4516354B2 (ja) * 2004-05-17 2010-08-04 パナソニック株式会社 部品供給方法
EP1694107A1 (de) * 2005-02-17 2006-08-23 KLARER, Christoph Vorrichtung und Verfahren zur Aufnahme und Übergabe eines elektronischen Bauteils
JP4555118B2 (ja) 2005-02-22 2010-09-29 パナソニック株式会社 部品装着装置及び部品保持部材の判別方法
JP2006268090A (ja) * 2005-03-22 2006-10-05 Fujitsu Ltd Ｒｆｉｄタグ
JP4912900B2 (ja) * 2006-02-03 2012-04-11 株式会社半導体エネルギー研究所 半導体装置の作製方法
US20070183184A1 (en) 2006-02-03 2007-08-09 Semiconductor Energy Laboratory Ltd. Apparatus and method for manufacturing semiconductor device
NL1032810C2 (nl) * 2006-11-03 2008-05-06 Assembleon Bv Werkwijze voor het plaatsen van een component op een substraat alsmede een dergelijke inrichting.
JP4765942B2 (ja) * 2007-01-10 2011-09-07 株式会社デンソー 監視装置と監視方法、および制御装置と制御方法
CH698718B1 (de) * 2007-01-31 2009-10-15 Oerlikon Assembly Equipment Ag Vorrichtung für die Montage eines Flipchips auf einem Substrat.
SG147353A1 (en) * 2007-05-07 2008-11-28 Mfg Integration Technology Ltd Apparatus for object processing
JP2009111312A (ja) * 2007-11-01 2009-05-21 Trinc:Kk チップマウンター
CN101884089B (zh) * 2007-12-03 2012-02-08 松下电器产业株式会社 芯片安装系统
CN101600336A (zh) * 2008-06-04 2009-12-09 鸿富锦精密工业（深圳）有限公司 散热器安装治具
KR20100033200A (ko) * 2008-09-19 2010-03-29 삼성전자주식회사 반도체 패키지 제조 장치 및 방법
JP4788759B2 (ja) * 2008-11-20 2011-10-05 パナソニック株式会社 部品実装装置
US20110182701A1 (en) * 2010-01-28 2011-07-28 Ui Holding Co. Method and apparatus for transferring die from a wafer
KR101710631B1 (ko) * 2010-12-23 2017-03-08 삼성전자주식회사 손 떨림 보정 모듈을 구비하는 디지털 영상 촬영 장치 및 이의 제어 방법
KR20120096727A (ko) * 2011-02-23 2012-08-31 삼성테크윈 주식회사 베어 다이를 픽업 및 실장하기 위한 장치 및 방법
JP5691001B2 (ja) * 2011-11-08 2015-04-01 パナソニックＩｐマネジメント株式会社 反転ヘッド
JP5746610B2 (ja) * 2011-12-22 2015-07-08 ヤマハ発動機株式会社 部品撮像装置および同装置を備えた部品実装装置
US9788470B2 (en) * 2012-10-29 2017-10-10 Fuji Machine Mfg. Co., Ltd. Component supply device
US9036354B2 (en) * 2013-01-15 2015-05-19 Flextronics, Ap, Llc Heat sink thermal press for phase change heat sink material
US9015928B2 (en) * 2013-07-25 2015-04-28 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting apparatus
CN109952017B (zh) * 2013-10-11 2021-02-23 株式会社富士 元件装配机
JP6115617B2 (ja) * 2015-11-16 2017-04-19 Tdk株式会社 実装装置
WO2017194286A1 (en) * 2016-05-13 2017-11-16 Asml Netherlands B.V. Multiple miniature pick up elements for a component stacking and/or pick-and-place process
WO2018013769A1 (en) 2016-07-13 2018-01-18 Universal Instruments Corporation Modular die handling system
CN106228913B (zh) * 2016-08-24 2022-12-30 京东方科技集团股份有限公司 转印设备及其转印方法
CN107366849B (zh) * 2017-08-08 2019-06-11 浙江美科电器有限公司 灯条生产设备
CN107514555B (zh) * 2017-08-08 2020-06-19 浙江美科电器有限公司 Led灯条制造装置
CN107543059B (zh) * 2017-08-08 2019-04-12 浙江美科电器有限公司 高效率灯带生产装置
CN109773474B (zh) * 2017-11-13 2021-07-13 宁波舜宇光电信息有限公司 光学组件的组装设备及组装方法
US20220059406A1 (en) * 2020-08-21 2022-02-24 Advanced Semiconductor Engineering, Inc. Method for manufacturing semiconductor package
CN112261865B (zh) * 2020-10-13 2023-06-20 常州铭赛机器人科技股份有限公司 表面贴装设备及表面贴装方法
CN114521103B (zh) * 2022-03-26 2024-01-26 宁波诚兴道电子科技有限公司 一种pcba线路板自动贴片设备及工艺
CN114828445B (zh) * 2022-05-24 2023-09-15 苏州创阈星智能科技有限公司 一种安装设备

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Also Published As

Publication number Publication date
WO2001072097A3 (en) 2002-06-06
JP2001274596A (ja) 2001-10-05
EP1553815A2 (de) 2005-07-13
US7827677B2 (en) 2010-11-09
EP1553815B1 (de) 2010-11-24
EP1269812A2 (de) 2003-01-02
US20040020043A1 (en) 2004-02-05
JP4480840B2 (ja) 2010-06-16
US20050283972A1 (en) 2005-12-29
EP1269812B1 (de) 2005-08-03
US7020953B2 (en) 2006-04-04
SG144725A1 (en) 2008-08-28
DE60112416T2 (de) 2006-06-01
DE60112416D1 (de) 2005-09-08
WO2001072097A2 (en) 2001-09-27
EP1553815A3 (de) 2007-11-21

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