DE60134797D1 - Verfahren zur Herstellung eines Schleifgegenstands - Google Patents

Verfahren zur Herstellung eines Schleifgegenstands

Info

Publication number
DE60134797D1
DE60134797D1 DE60134797T DE60134797T DE60134797D1 DE 60134797 D1 DE60134797 D1 DE 60134797D1 DE 60134797 T DE60134797 T DE 60134797T DE 60134797 T DE60134797 T DE 60134797T DE 60134797 D1 DE60134797 D1 DE 60134797D1
Authority
DE
Germany
Prior art keywords
making
abrasive article
backing
coating composition
abrasive coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60134797T
Other languages
English (en)
Inventor
Michael J Muilenburg
Chong Yong Kim
Jerry J Fizel
Richard J Webb
John J Gagliardi
Daniel B Pendergrass
Robert J Streifel
Wesley J Bruxvoort
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of DE60134797D1 publication Critical patent/DE60134797D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B24D11/005—Making abrasive webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
DE60134797T 2000-11-29 2001-04-11 Verfahren zur Herstellung eines Schleifgegenstands Expired - Lifetime DE60134797D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/726,064 US20020072296A1 (en) 2000-11-29 2000-11-29 Abrasive article having a window system for polishing wafers, and methods

Publications (1)

Publication Number Publication Date
DE60134797D1 true DE60134797D1 (de) 2008-08-21

Family

ID=24917074

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60118171T Expired - Lifetime DE60118171T2 (de) 2000-11-29 2001-04-11 Schleifgegenstand mit fenstersystem sowie verfahren zum polieren von wafern
DE60134797T Expired - Lifetime DE60134797D1 (de) 2000-11-29 2001-04-11 Verfahren zur Herstellung eines Schleifgegenstands

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE60118171T Expired - Lifetime DE60118171T2 (de) 2000-11-29 2001-04-11 Schleifgegenstand mit fenstersystem sowie verfahren zum polieren von wafern

Country Status (13)

Country Link
US (3) US20020072296A1 (de)
EP (2) EP1337380B1 (de)
JP (1) JP2004516947A (de)
KR (1) KR100711160B1 (de)
CN (1) CN1238161C (de)
AT (2) ATE320881T1 (de)
AU (1) AU2001253382A1 (de)
CA (1) CA2430377A1 (de)
DE (2) DE60118171T2 (de)
IL (1) IL155856A0 (de)
MY (1) MY126929A (de)
TW (1) TW564202B (de)
WO (1) WO2002043925A1 (de)

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US7311862B2 (en) * 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US7267607B2 (en) * 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7435165B2 (en) 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US6960120B2 (en) 2003-02-10 2005-11-01 Cabot Microelectronics Corporation CMP pad with composite transparent window
US6832947B2 (en) * 2003-02-10 2004-12-21 Cabot Microelectronics Corporation CMP pad with composite transparent window
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US7160178B2 (en) * 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
US20050054277A1 (en) * 2003-09-04 2005-03-10 Teng-Chun Tsai Polishing pad and method of polishing wafer
DE10346254A1 (de) * 2003-09-25 2005-05-12 Supfina Grieshaber Gmbh & Co Verfahren zur Bearbeitung von Werkstückoberflächen
JP2005150235A (ja) 2003-11-12 2005-06-09 Three M Innovative Properties Co 半導体表面保護シート及び方法
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US20060025047A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Grading system and method for abrasive article
US20060025048A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Abrasive article detection system and method
US20060025046A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Abrasive article splicing system and methods
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
US7179159B2 (en) * 2005-05-02 2007-02-20 Applied Materials, Inc. Materials for chemical mechanical polishing
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US20080014532A1 (en) * 2006-07-14 2008-01-17 3M Innovative Properties Company Laminate body, and method for manufacturing thin substrate using the laminate body
JP4941735B2 (ja) * 2007-03-30 2012-05-30 東洋ゴム工業株式会社 研磨パッドの製造方法
JP4888905B2 (ja) * 2007-03-30 2012-02-29 東洋ゴム工業株式会社 研磨パッドの製造方法
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US20090017323A1 (en) * 2007-07-13 2009-01-15 3M Innovative Properties Company Layered body and method for manufacturing thin substrate using the layered body
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US7967661B2 (en) * 2008-06-19 2011-06-28 Micron Technology, Inc. Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture
JP5596030B2 (ja) 2008-06-26 2014-09-24 スリーエム イノベイティブ プロパティズ カンパニー 多孔質エレメントを有する研磨パッド及びその製造方法と使用方法
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US20110183583A1 (en) * 2008-07-18 2011-07-28 Joseph William D Polishing Pad with Floating Elements and Method of Making and Using the Same
EP2147745A1 (de) * 2008-07-25 2010-01-27 Supfina Grieshaber GmbH & Co. KG Superfinishmaschine mit Schleifband und Verfahren zum Betrieben einer Superfinishmaschine
EP2327088B1 (de) 2008-08-28 2019-01-09 3M Innovative Properties Company Strukturierter schleifartikel, herstellungsverfahren dafür und verwendung in der waferplanarisierung
US20100112919A1 (en) * 2008-11-03 2010-05-06 Applied Materials, Inc. Monolithic linear polishing sheet
WO2010121025A1 (en) * 2009-04-17 2010-10-21 3M Innovative Properties Company Metal particle transfer article, metal modified substrate, and method of making and using the same
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CN102686362A (zh) 2009-12-30 2012-09-19 3M创新有限公司 包括分相共混聚合物的抛光垫及其制备和使用方法
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US8758088B2 (en) 2011-10-06 2014-06-24 Wayne O. Duescher Floating abrading platen configuration
US8647170B2 (en) 2011-10-06 2014-02-11 Wayne O. Duescher Laser alignment apparatus for rotary spindles
US8602842B2 (en) * 2010-03-12 2013-12-10 Wayne O. Duescher Three-point fixed-spindle floating-platen abrasive system
US8647171B2 (en) * 2010-03-12 2014-02-11 Wayne O. Duescher Fixed-spindle floating-platen workpiece loader apparatus
US8740668B2 (en) * 2010-03-12 2014-06-03 Wayne O. Duescher Three-point spindle-supported floating abrasive platen
US8641476B2 (en) 2011-10-06 2014-02-04 Wayne O. Duescher Coplanar alignment apparatus for rotary spindles
US8500515B2 (en) 2010-03-12 2013-08-06 Wayne O. Duescher Fixed-spindle and floating-platen abrasive system using spherical mounts
US8647172B2 (en) 2010-03-12 2014-02-11 Wayne O. Duescher Wafer pads for fixed-spindle floating-platen lapping
US8696405B2 (en) 2010-03-12 2014-04-15 Wayne O. Duescher Pivot-balanced floating platen lapping machine
US8360823B2 (en) * 2010-06-15 2013-01-29 3M Innovative Properties Company Splicing technique for fixed abrasives used in chemical mechanical planarization
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US8337280B2 (en) 2010-09-14 2012-12-25 Duescher Wayne O High speed platen abrading wire-driven rotary workholder
US8758659B2 (en) 2010-09-29 2014-06-24 Fns Tech Co., Ltd. Method of grooving a chemical-mechanical planarization pad
US8430717B2 (en) 2010-10-12 2013-04-30 Wayne O. Duescher Dynamic action abrasive lapping workholder
BR112013021631B1 (pt) 2011-02-24 2020-12-08 3M Innovative Properties Company artigo abrasivo revestido e suporte de espuma de poliuretano
CN102689270B (zh) * 2011-03-22 2015-04-01 中芯国际集成电路制造(上海)有限公司 固结磨料抛光垫及其制备方法
JP6432497B2 (ja) * 2015-12-10 2018-12-05 信越半導体株式会社 研磨方法
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
WO2019022961A1 (en) * 2017-07-28 2019-01-31 Applied Materials, Inc. METHOD FOR IDENTIFYING AND MONITORING ROLLER ROLL POLISHING PAD MATERIALS DURING PROCESSING
BR112020006842A2 (pt) 2017-10-04 2020-10-06 Saint-Gobain Abrasives, Inc. artigo abrasivo e método para formação do mesmo
US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods

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Also Published As

Publication number Publication date
EP1655103A1 (de) 2006-05-10
CN1476368A (zh) 2004-02-18
DE60118171T2 (de) 2007-01-25
JP2004516947A (ja) 2004-06-10
CN1238161C (zh) 2006-01-25
EP1337380B1 (de) 2006-03-22
US20020072296A1 (en) 2002-06-13
EP1655103B1 (de) 2008-07-09
DE60118171D1 (de) 2006-05-11
TW564202B (en) 2003-12-01
EP1337380A1 (de) 2003-08-27
US20030064663A1 (en) 2003-04-03
KR100711160B1 (ko) 2007-05-16
ATE400405T1 (de) 2008-07-15
US6786810B2 (en) 2004-09-07
IL155856A0 (en) 2003-12-23
AU2001253382A1 (en) 2002-06-11
WO2002043925A1 (en) 2002-06-06
KR20030048484A (ko) 2003-06-19
US6604985B2 (en) 2003-08-12
MY126929A (en) 2006-10-31
CA2430377A1 (en) 2002-06-06
US20030022598A1 (en) 2003-01-30
ATE320881T1 (de) 2006-04-15

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