DE60133092D1 - Örtliche erwärmung und kühlung von substraten - Google Patents

Örtliche erwärmung und kühlung von substraten

Info

Publication number
DE60133092D1
DE60133092D1 DE60133092T DE60133092T DE60133092D1 DE 60133092 D1 DE60133092 D1 DE 60133092D1 DE 60133092 T DE60133092 T DE 60133092T DE 60133092 T DE60133092 T DE 60133092T DE 60133092 D1 DE60133092 D1 DE 60133092D1
Authority
DE
Germany
Prior art keywords
cooling
gas
wafer
substrates
local heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60133092T
Other languages
English (en)
Other versions
DE60133092T2 (de
Inventor
Andreas Tillman
Dieter Zernickel
Sohaila Shooshtarian
Narasimha Acharya
Mike Elbert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mattson Thermal Products Inc
Original Assignee
Mattson Thermal Products Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mattson Thermal Products Inc filed Critical Mattson Thermal Products Inc
Publication of DE60133092D1 publication Critical patent/DE60133092D1/de
Application granted granted Critical
Publication of DE60133092T2 publication Critical patent/DE60133092T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Formation Of Insulating Films (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Non-Reversible Transmitting Devices (AREA)
DE60133092T 2000-03-17 2001-03-15 Örtliche erwärmung und kühlung von substraten Expired - Lifetime DE60133092T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/527,873 US7037797B1 (en) 2000-03-17 2000-03-17 Localized heating and cooling of substrates
US527873 2000-03-17
PCT/IB2001/000392 WO2001069656A2 (en) 2000-03-17 2001-03-15 Localized heating and cooling of substrates

Publications (2)

Publication Number Publication Date
DE60133092D1 true DE60133092D1 (de) 2008-04-17
DE60133092T2 DE60133092T2 (de) 2009-02-19

Family

ID=24103294

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60133092T Expired - Lifetime DE60133092T2 (de) 2000-03-17 2001-03-15 Örtliche erwärmung und kühlung von substraten

Country Status (8)

Country Link
US (1) US7037797B1 (de)
EP (1) EP1264333B1 (de)
JP (1) JP5511115B2 (de)
KR (1) KR100784580B1 (de)
AT (1) ATE388482T1 (de)
DE (1) DE60133092T2 (de)
TW (1) TW495813B (de)
WO (1) WO2001069656A2 (de)

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US20120225203A1 (en) * 2011-03-01 2012-09-06 Applied Materials, Inc. Apparatus and Process for Atomic Layer Deposition
DE102012101923B4 (de) * 2012-03-07 2019-11-07 Osram Opto Semiconductors Gmbh Substratträgeranordnung, Beschichtungsanlage mit Substratträgeranordnung und Verfahren zur Durchführung eines Beschichtungsverfahrens
DE102012205616B4 (de) * 2012-04-04 2016-07-14 Siltronic Ag Vorrichtung zum Abscheiden einer Schicht auf einer Halbleiterscheibe mittels Gasphasenabscheidung
KR20150097715A (ko) * 2012-12-17 2015-08-26 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치를 위한 기판 지지체 및 리소그래피 장치
WO2014174803A1 (ja) * 2013-04-22 2014-10-30 パナソニック株式会社 Ｅｌ表示装置の製造方法
US9511549B2 (en) 2014-06-02 2016-12-06 Toyota Motor Engineering & Manufacturing North America, Inc. Anisotropic thermal energy guiding shells and methods for fabricating thermal energy guiding shells
US10458962B2 (en) 2016-07-22 2019-10-29 Pulmostics Limited Temperature control for surface acoustic wave sensor
US11127607B2 (en) * 2019-11-11 2021-09-21 Xia Tai Xin Semiconductor (Qing Dao) Ltd. Heat processing system
CN113234914B (zh) * 2021-04-16 2022-07-19 北京钢研高纳科技股份有限公司 基于加热气体精确控温的梯度热处理炉及热处理方法

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Also Published As

Publication number Publication date
WO2001069656A3 (en) 2002-03-14
DE60133092T2 (de) 2009-02-19
WO2001069656A2 (en) 2001-09-20
KR20030007466A (ko) 2003-01-23
KR100784580B1 (ko) 2007-12-10
ATE388482T1 (de) 2008-03-15
US7037797B1 (en) 2006-05-02
EP1264333A2 (de) 2002-12-11
EP1264333B1 (de) 2008-03-05
JP5511115B2 (ja) 2014-06-04
TW495813B (en) 2002-07-21
JP2003526940A (ja) 2003-09-09

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Legal Events

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