DE60132162D1 - Gestapeltes Leistungsverstärkermodul - Google Patents
Gestapeltes LeistungsverstärkermodulInfo
- Publication number
- DE60132162D1 DE60132162D1 DE60132162T DE60132162T DE60132162D1 DE 60132162 D1 DE60132162 D1 DE 60132162D1 DE 60132162 T DE60132162 T DE 60132162T DE 60132162 T DE60132162 T DE 60132162T DE 60132162 D1 DE60132162 D1 DE 60132162D1
- Authority
- DE
- Germany
- Prior art keywords
- power amplifier
- amplifier module
- stacked power
- stacked
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US725643 | 2000-11-29 | ||
US09/725,643 US6462950B1 (en) | 2000-11-29 | 2000-11-29 | Stacked power amplifier module |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60132162D1 true DE60132162D1 (de) | 2008-02-14 |
DE60132162T2 DE60132162T2 (de) | 2009-01-02 |
Family
ID=24915395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60132162T Expired - Lifetime DE60132162T2 (de) | 2000-11-29 | 2001-10-31 | Gestapeltes Leistungsverstärkermodul |
Country Status (4)
Country | Link |
---|---|
US (1) | US6462950B1 (de) |
EP (1) | EP1211730B1 (de) |
JP (1) | JP2002217650A (de) |
DE (1) | DE60132162T2 (de) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6512285B1 (en) * | 2001-10-05 | 2003-01-28 | Skyworks Solutions, Inc. | High inductance inductor in a semiconductor package |
CN100352317C (zh) * | 2002-06-07 | 2007-11-28 | 松下电器产业株式会社 | 电子元件安装板、电子元件模块、制造电子元件安装板的方法及通信设备 |
US20040232982A1 (en) * | 2002-07-19 | 2004-11-25 | Ikuroh Ichitsubo | RF front-end module for wireless communication devices |
US6859129B2 (en) * | 2002-08-20 | 2005-02-22 | Asia Pacific Microsystems | Three-dimensional integrated adjustable inductor, its module and fabrication method of the same |
KR100489820B1 (ko) * | 2002-11-19 | 2005-05-16 | 삼성전기주식회사 | 세라믹 다층기판 및 그 제조방법 |
KR100495211B1 (ko) * | 2002-11-25 | 2005-06-14 | 삼성전기주식회사 | 세라믹 다층기판 및 그 제조방법 |
TW591788B (en) * | 2003-04-02 | 2004-06-11 | United Radiotek Inc | Protection circuit scheme for electrostatic discharge |
US7026664B2 (en) * | 2003-04-24 | 2006-04-11 | Power-One, Inc. | DC-DC converter implemented in a land grid array package |
US7791210B2 (en) * | 2003-11-05 | 2010-09-07 | Lsi Corporation | Semiconductor package having discrete non-active electrical components incorporated into the package |
US20050205986A1 (en) * | 2004-03-18 | 2005-09-22 | Ikuroh Ichitsubo | Module with integrated active substrate and passive substrate |
ATE513312T1 (de) | 2004-12-20 | 2011-07-15 | Iq Evolution Gmbh | Mikrokühlkörper |
US7769355B2 (en) * | 2005-01-19 | 2010-08-03 | Micro Mobio Corporation | System-in-package wireless communication device comprising prepackaged power amplifier |
DE102006018161A1 (de) * | 2006-04-19 | 2007-10-25 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Elektronisches Bauelementmodul |
US7843302B2 (en) * | 2006-05-08 | 2010-11-30 | Ibiden Co., Ltd. | Inductor and electric power supply using it |
JP5060550B2 (ja) * | 2006-06-20 | 2012-10-31 | エヌエックスピー ビー ヴィ | パワーアンプ・アセンブリ |
US7675365B2 (en) * | 2007-01-10 | 2010-03-09 | Samsung Electro-Mechanics | Systems and methods for power amplifiers with voltage boosting multi-primary transformers |
US7679216B2 (en) * | 2007-07-20 | 2010-03-16 | Infineon Technologies Ag | Power supply scheme for reduced power compensation |
US8357980B2 (en) * | 2007-10-15 | 2013-01-22 | Hewlett-Packard Development Company, L.P. | Plasmonic high-speed devices for enhancing the performance of microelectronic devices |
US20090153281A1 (en) * | 2007-12-13 | 2009-06-18 | Ahmadreza Rofougaran | Method and system for an integrated circuit package with ferri/ferromagnetic layers |
US7576607B2 (en) * | 2008-01-03 | 2009-08-18 | Samsung Electro-Mechanics | Multi-segment primary and multi-turn secondary transformer for power amplifier systems |
US8044759B2 (en) * | 2008-01-08 | 2011-10-25 | Samsung Electro-Mechanics | Overlapping compact multiple transformers |
US7746174B2 (en) * | 2008-06-12 | 2010-06-29 | Samsung Electro-Mechanics Company, Ltd. | Systems and methods for power amplifier with integrated passive device |
JP2010238821A (ja) * | 2009-03-30 | 2010-10-21 | Sony Corp | 多層配線基板、スタック構造センサパッケージおよびその製造方法 |
US8125276B2 (en) * | 2010-03-12 | 2012-02-28 | Samsung Electro-Mechanics | Sharing of inductor interstage matching in parallel amplification system for wireless communication systems |
CN103119703B (zh) * | 2010-09-23 | 2016-01-20 | 高通Mems科技公司 | 集成的无源器件和功率放大器 |
US20120280755A1 (en) * | 2011-05-04 | 2012-11-08 | Triquint Semiconductor, Inc. | Flip-chip power amplifier and impedance matching network |
ITVI20120145A1 (it) | 2012-06-15 | 2013-12-16 | St Microelectronics Srl | Struttura comprensiva di involucro comprendente connessioni laterali |
US10115671B2 (en) | 2012-08-03 | 2018-10-30 | Snaptrack, Inc. | Incorporation of passives and fine pitch through via for package on package |
US9871448B2 (en) | 2012-12-31 | 2018-01-16 | Nvidia Corporation | Super N-phase switching mode power supply |
US9538636B1 (en) * | 2013-03-14 | 2017-01-03 | Macom Technology Solutions Holdings, Inc. | Blind via edge castellation |
KR101503144B1 (ko) * | 2013-07-29 | 2015-03-16 | 삼성전기주식회사 | 박막 인덕터 소자 및 이의 제조방법 |
US9831198B2 (en) * | 2013-08-22 | 2017-11-28 | Nvidia Corporation | Inductors for integrated voltage regulators |
US9306776B2 (en) | 2013-09-10 | 2016-04-05 | Nvidia Corporation | Filtering high speed signals |
US9306514B2 (en) * | 2014-05-28 | 2016-04-05 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Hybrid power amplifier comprising heterojunction bipolar transistors (HBTs) and complementary metal oxide semiconductor (CMOS) devices |
US10050528B2 (en) * | 2015-06-29 | 2018-08-14 | Infineon Technologies Austria Ag | Current distribution in DC-DC converters |
JP6618549B2 (ja) * | 2015-12-03 | 2019-12-11 | 三菱電機株式会社 | 半導体装置 |
FR3053528B1 (fr) * | 2016-06-30 | 2018-11-02 | Safran Electronics & Defense | Dispositif electronique ayant une banque integree de composants passifs |
CN111968995B (zh) * | 2020-07-13 | 2024-02-09 | 深圳市汇芯通信技术有限公司 | 一种集成无源器件及其制作方法和集成电路 |
CN116601756A (zh) * | 2020-12-02 | 2023-08-15 | 株式会社村田制作所 | 集成电路和高频模块 |
CN116670817A (zh) * | 2020-12-02 | 2023-08-29 | 株式会社村田制作所 | 集成电路和高频模块 |
DE102021110251A1 (de) * | 2021-04-22 | 2022-10-27 | Sma Solar Technology Ag | Leistungshalbleiteranordnung und wechselrichterbrücke mit leistungshalbleiteranordnung |
WO2023225905A1 (zh) * | 2022-05-25 | 2023-11-30 | 京东方科技集团股份有限公司 | 滤波器及其制作方法、电子设备 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2551203B2 (ja) * | 1990-06-05 | 1996-11-06 | 三菱電機株式会社 | 半導体装置 |
US5214000A (en) * | 1991-12-19 | 1993-05-25 | Raychem Corporation | Thermal transfer posts for high density multichip substrates and formation method |
US5542175A (en) * | 1994-12-20 | 1996-08-06 | International Business Machines Corporation | Method of laminating and circuitizing substrates having openings therein |
US5604673A (en) * | 1995-06-07 | 1997-02-18 | Hughes Electronics | Low temperature co-fired ceramic substrates for power converters |
JP2820108B2 (ja) * | 1996-03-13 | 1998-11-05 | 日本電気株式会社 | 電子部品の実装構造およびその製造方法 |
US5796165A (en) * | 1996-03-19 | 1998-08-18 | Matsushita Electronics Corporation | High-frequency integrated circuit device having a multilayer structure |
JP3176307B2 (ja) * | 1997-03-03 | 2001-06-18 | 日本電気株式会社 | 集積回路装置の実装構造およびその製造方法 |
JP3226489B2 (ja) * | 1998-02-19 | 2001-11-05 | 日東電工株式会社 | 回路付きサスペンション基板 |
US6201701B1 (en) * | 1998-03-11 | 2001-03-13 | Kimball International, Inc. | Integrated substrate with enhanced thermal characteristics |
JP3144377B2 (ja) * | 1998-03-13 | 2001-03-12 | 日本電気株式会社 | 半導体装置の製造方法 |
JP3147087B2 (ja) * | 1998-06-17 | 2001-03-19 | 日本電気株式会社 | 積層型半導体装置放熱構造 |
WO2000027172A1 (en) * | 1998-10-29 | 2000-05-11 | Trustees Of Princeton University | Foldable circuits and method of making same |
US6246010B1 (en) * | 1998-11-25 | 2001-06-12 | 3M Innovative Properties Company | High density electronic package |
JP3538045B2 (ja) * | 1998-12-09 | 2004-06-14 | 三菱電機株式会社 | Rf回路モジュール |
JP2000331835A (ja) * | 1999-05-21 | 2000-11-30 | Taiyo Yuden Co Ltd | 積層電子部品及び回路モジュール |
-
2000
- 2000-11-29 US US09/725,643 patent/US6462950B1/en not_active Expired - Lifetime
-
2001
- 2001-10-31 DE DE60132162T patent/DE60132162T2/de not_active Expired - Lifetime
- 2001-10-31 EP EP01309248A patent/EP1211730B1/de not_active Expired - Lifetime
- 2001-11-27 JP JP2001361228A patent/JP2002217650A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP1211730A2 (de) | 2002-06-05 |
US6462950B1 (en) | 2002-10-08 |
US20020064029A1 (en) | 2002-05-30 |
EP1211730A3 (de) | 2003-05-28 |
JP2002217650A (ja) | 2002-08-02 |
DE60132162T2 (de) | 2009-01-02 |
EP1211730B1 (de) | 2008-01-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8380 | Miscellaneous part iii |
Free format text: ALS ALLEINIGER VERTRETER WURDE EISENFUEHR, SPEISER & PARTNER IN MUENCHEN AUFGENOMMEN. |