DE60124423D1 - Vorrichtung und verfahren zur befestigung von völlig befreiten mikrobauteilen - Google Patents

Vorrichtung und verfahren zur befestigung von völlig befreiten mikrobauteilen

Info

Publication number
DE60124423D1
DE60124423D1 DE60124423T DE60124423T DE60124423D1 DE 60124423 D1 DE60124423 D1 DE 60124423D1 DE 60124423 T DE60124423 T DE 60124423T DE 60124423 T DE60124423 T DE 60124423T DE 60124423 D1 DE60124423 D1 DE 60124423D1
Authority
DE
Germany
Prior art keywords
microcomponent
totally released
substrate
preferred
constraining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60124423T
Other languages
English (en)
Other versions
DE60124423T2 (de
Inventor
D Ellis
G Parker
D Skidmore
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zyvex Labs Richardson Tex Us LLC
Original Assignee
Zyvex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zyvex Corp filed Critical Zyvex Corp
Application granted granted Critical
Publication of DE60124423D1 publication Critical patent/DE60124423D1/de
Publication of DE60124423T2 publication Critical patent/DE60124423T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035Constitution or structural means for controlling the movement of the flexible or deformable elements
    • B81B3/0051For defining the movement, i.e. structures that guide or limit the movement of an element
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/05Type of movement
    • B81B2203/053Translation according to an axis perpendicular to the substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/05Type of movement
    • B81B2203/055Translation in a plane parallel to the substrate, i.e. enabling movement along any direction in the plane
DE60124423T 2000-07-14 2001-07-12 Vorrichtung und verfahren zur befestigung von völlig befreiten mikrobauteilen Expired - Lifetime DE60124423T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/616,500 US6677225B1 (en) 2000-07-14 2000-07-14 System and method for constraining totally released microcomponents
US616500 2000-07-14
PCT/US2001/021899 WO2002006152A2 (en) 2000-07-14 2001-07-12 System and method for constraining totally released microcomponents

Publications (2)

Publication Number Publication Date
DE60124423D1 true DE60124423D1 (de) 2006-12-21
DE60124423T2 DE60124423T2 (de) 2007-10-04

Family

ID=24469729

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60124423T Expired - Lifetime DE60124423T2 (de) 2000-07-14 2001-07-12 Vorrichtung und verfahren zur befestigung von völlig befreiten mikrobauteilen

Country Status (8)

Country Link
US (1) US6677225B1 (de)
EP (1) EP1345843B1 (de)
JP (1) JP2004504172A (de)
KR (1) KR100539137B1 (de)
CN (1) CN1241826C (de)
AT (1) ATE344784T1 (de)
DE (1) DE60124423T2 (de)
WO (1) WO2002006152A2 (de)

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US7647848B2 (en) * 2005-11-29 2010-01-19 Drexel University Integrated system for simultaneous inspection and manipulation
US7405863B2 (en) * 2006-06-01 2008-07-29 Qualcomm Mems Technologies, Inc. Patterning of mechanical layer in MEMS to reduce stresses at supports
JP4327183B2 (ja) * 2006-07-31 2009-09-09 株式会社日立製作所 内燃機関の高圧燃料ポンプ制御装置
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EP1939137B1 (de) 2006-12-30 2016-08-24 Nuvotronics, LLC Dreidimensionale Mikrostrukturen und Herstellungsverfahren dafür
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KR101593686B1 (ko) 2007-03-20 2016-02-12 누보트로닉스, 엘.엘.씨 일체화된 전자 요소들 및 이들의 형성 방법
US7719752B2 (en) * 2007-05-11 2010-05-18 Qualcomm Mems Technologies, Inc. MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same
US8068268B2 (en) * 2007-07-03 2011-11-29 Qualcomm Mems Technologies, Inc. MEMS devices having improved uniformity and methods for making them
WO2009067635A1 (en) * 2007-11-20 2009-05-28 Board Of Regents, The University Of Texas System Method and apparatus for detethering mesoscale, microscale, and nanoscale components and devices
KR101104641B1 (ko) * 2008-11-17 2012-01-12 풍원공업 주식회사 비데용 힌지장치
US8428740B2 (en) 2010-08-06 2013-04-23 Nano-Retina, Inc. Retinal prosthesis techniques
US8718784B2 (en) * 2010-01-14 2014-05-06 Nano-Retina, Inc. Penetrating electrodes for retinal stimulation
US8706243B2 (en) 2009-02-09 2014-04-22 Rainbow Medical Ltd. Retinal prosthesis techniques
US8150526B2 (en) 2009-02-09 2012-04-03 Nano-Retina, Inc. Retinal prosthesis
US8442641B2 (en) 2010-08-06 2013-05-14 Nano-Retina, Inc. Retinal prosthesis techniques
US8659371B2 (en) 2009-03-03 2014-02-25 Bae Systems Information And Electronic Systems Integration Inc. Three-dimensional matrix structure for defining a coaxial transmission line channel
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
US8917150B2 (en) 2010-01-22 2014-12-23 Nuvotronics, Llc Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels
US8368153B2 (en) * 2010-04-08 2013-02-05 United Microelectronics Corp. Wafer level package of MEMS microphone and manufacturing method thereof
US8571669B2 (en) 2011-02-24 2013-10-29 Nano-Retina, Inc. Retinal prosthesis with efficient processing circuits
US8659816B2 (en) 2011-04-25 2014-02-25 Qualcomm Mems Technologies, Inc. Mechanical layer and methods of making the same
US8866300B1 (en) 2011-06-05 2014-10-21 Nuvotronics, Llc Devices and methods for solder flow control in three-dimensional microstructures
US8814601B1 (en) 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
EP2731783A4 (de) 2011-07-13 2016-03-09 Nuvotronics Llc Verfahren zur herstellung von elektronischen und mechanischen strukturen
US9166114B2 (en) * 2012-12-11 2015-10-20 LuxVue Technology Corporation Stabilization structure including sacrificial release layer and staging cavity
US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
US9370417B2 (en) 2013-03-14 2016-06-21 Nano-Retina, Inc. Foveated retinal prosthesis
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
US9474902B2 (en) 2013-12-31 2016-10-25 Nano Retina Ltd. Wearable apparatus for delivery of power to a retinal prosthesis
US10310009B2 (en) 2014-01-17 2019-06-04 Nuvotronics, Inc Wafer scale test interface unit and contactors
US9331791B2 (en) 2014-01-21 2016-05-03 Nano Retina Ltd. Transfer of power and data
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
US10511073B2 (en) 2014-12-03 2019-12-17 Cubic Corporation Systems and methods for manufacturing stacked circuits and transmission lines
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
CN112087696B (zh) * 2020-06-30 2022-01-07 歌尔微电子有限公司 微型麦克风防尘装置及mems麦克风
CN112492478B (zh) * 2020-12-02 2022-08-19 潍坊歌尔微电子有限公司 微型麦克风防尘装置及mems麦克风

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Also Published As

Publication number Publication date
DE60124423T2 (de) 2007-10-04
ATE344784T1 (de) 2006-11-15
WO2002006152B1 (en) 2002-08-08
EP1345843A2 (de) 2003-09-24
CN1241826C (zh) 2006-02-15
EP1345843B1 (de) 2006-11-08
KR100539137B1 (ko) 2005-12-26
JP2004504172A (ja) 2004-02-12
WO2002006152A3 (en) 2002-07-11
US6677225B1 (en) 2004-01-13
CN1441749A (zh) 2003-09-10
WO2002006152A2 (en) 2002-01-24
KR20030067657A (ko) 2003-08-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: ZYVEX LABS, LLC, RICHARDSON, TEX., US