DE60043767D1 - Kühlstruktur eines Multi-Chip-Moduls - Google Patents

Kühlstruktur eines Multi-Chip-Moduls

Info

Publication number
DE60043767D1
DE60043767D1 DE60043767T DE60043767T DE60043767D1 DE 60043767 D1 DE60043767 D1 DE 60043767D1 DE 60043767 T DE60043767 T DE 60043767T DE 60043767 T DE60043767 T DE 60043767T DE 60043767 D1 DE60043767 D1 DE 60043767D1
Authority
DE
Germany
Prior art keywords
chip module
cooling structure
chip
cooling
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60043767T
Other languages
English (en)
Inventor
Makoto Imai
Naoki Ogawa
Yuji Yagi
Takashi Kojima
Yasushi Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Application granted granted Critical
Publication of DE60043767D1 publication Critical patent/DE60043767D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331—Disposition
    • H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181—On opposite sides of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/93—Thermoelectric, e.g. peltier effect cooling
DE60043767T 1999-12-21 2000-12-20 Kühlstruktur eines Multi-Chip-Moduls Expired - Lifetime DE60043767D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP36205899 1999-12-21
JP2000343677A JP2001244391A (ja) 1999-12-21 2000-11-10 マルチチップモジュールの冷却構造

Publications (1)

Publication Number Publication Date
DE60043767D1 true DE60043767D1 (de) 2010-03-18

Family

ID=26581343

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60043767T Expired - Lifetime DE60043767D1 (de) 1999-12-21 2000-12-20 Kühlstruktur eines Multi-Chip-Moduls

Country Status (4)

Country Link
US (2) US20010022395A1 (de)
EP (1) EP1111677B1 (de)
JP (1) JP2001244391A (de)
DE (1) DE60043767D1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10102750B4 (de) * 2001-01-22 2006-04-20 Siemens Ag Schaltungsanordnung
JP3627738B2 (ja) * 2001-12-27 2005-03-09 株式会社デンソー 半導体装置
JP3780230B2 (ja) 2002-07-03 2006-05-31 株式会社日立製作所 半導体モジュール及び電力変換装置
JP3673776B2 (ja) * 2002-07-03 2005-07-20 株式会社日立製作所 半導体モジュール及び電力変換装置
US7612443B1 (en) 2003-09-04 2009-11-03 University Of Notre Dame Du Lac Inter-chip communication
JP2005158917A (ja) * 2003-11-25 2005-06-16 Sharp Corp 電子ヒートポンプ装置、レーザ部品、光ピックアップおよび電子機器
DE102004018477B4 (de) * 2004-04-16 2008-08-21 Infineon Technologies Ag Halbleitermodul
US7091604B2 (en) * 2004-06-04 2006-08-15 Cabot Microelectronics Corporation Three dimensional integrated circuits
US7079396B2 (en) 2004-06-14 2006-07-18 Sun Microsystems, Inc. Memory module cooling
JP2006066464A (ja) * 2004-08-24 2006-03-09 Toyota Industries Corp 半導体装置
US6943293B1 (en) * 2004-09-01 2005-09-13 Delphi Technologies, Inc. High power electronic package with enhanced cooling characteristics
US7589348B2 (en) * 2005-03-14 2009-09-15 Borealis Technical Limited Thermal tunneling gap diode with integrated spacers and vacuum seal
US7462934B2 (en) * 2006-06-20 2008-12-09 Microsoft Corporation Integrated heat sink
US8091614B2 (en) * 2006-11-10 2012-01-10 International Business Machines Corporation Air/fluid cooling system
US7932170B1 (en) 2008-06-23 2011-04-26 Amkor Technology, Inc. Flip chip bump structure and fabrication method
US9620473B1 (en) 2013-01-18 2017-04-11 University Of Notre Dame Du Lac Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment
JP5765357B2 (ja) * 2013-03-22 2015-08-19 カシオ計算機株式会社 回路基板構造、及び電子機器
JP2015082960A (ja) * 2013-10-24 2015-04-27 株式会社オートネットワーク技術研究所 Ｄｃ−ｄｃコンバータ装置
WO2018164160A1 (ja) * 2017-03-10 2018-09-13 株式会社村田製作所 モジュール

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59200495A (ja) * 1983-04-27 1984-11-13 株式会社日立製作所 マルチチツプ・モジユ−ル
JP2708495B2 (ja) * 1988-09-19 1998-02-04 株式会社日立製作所 半導体冷却装置
JP2592308B2 (ja) * 1988-09-30 1997-03-19 株式会社日立製作所 半導体パッケージ及びそれを用いたコンピュータ
US4965658A (en) * 1988-12-29 1990-10-23 York International Corporation System for mounting and cooling power semiconductor devices
US5345107A (en) * 1989-09-25 1994-09-06 Hitachi, Ltd. Cooling apparatus for electronic device
US5611140A (en) * 1989-12-18 1997-03-18 Epoxy Technology, Inc. Method of forming electrically conductive polymer interconnects on electrical substrates
FR2665046A1 (fr) * 1990-07-20 1992-01-24 Thomson Csf Procede et dispositif pour le montage en parallele de composants de puissance a semi-conducteurs.
US5239448A (en) * 1991-10-28 1993-08-24 International Business Machines Corporation Formulation of multichip modules
US5369552A (en) * 1992-07-14 1994-11-29 Ncr Corporation Multi-chip module with multiple compartments
US5323292A (en) * 1992-10-06 1994-06-21 Hewlett-Packard Company Integrated multi-chip module having a conformal chip/heat exchanger interface
US5500555A (en) * 1994-04-11 1996-03-19 Lsi Logic Corporation Multi-layer semiconductor package substrate with thermally-conductive prepeg layer
JP2926537B2 (ja) * 1994-12-15 1999-07-28 株式会社日立製作所 マルチチップモジュ−ルの冷却装置
JPH08195455A (ja) 1995-01-17 1996-07-30 Hitachi Ltd 半導体冷却装置
JPH08204068A (ja) * 1995-01-20 1996-08-09 Fuji Electric Co Ltd モジュール構造の半導体装置
US5642262A (en) * 1995-02-23 1997-06-24 Altera Corporation High-density programmable logic device in a multi-chip module package with improved interconnect scheme
JP3058047B2 (ja) * 1995-04-04 2000-07-04 株式会社日立製作所 マルチチップモジュールの封止冷却構造
JPH0945827A (ja) * 1995-08-02 1997-02-14 Hitachi Ltd 半導体装置
US5694297A (en) * 1995-09-05 1997-12-02 Astec International Limited Integrated circuit mounting structure including a switching power supply
KR100211058B1 (ko) * 1995-12-23 1999-07-15 이계철 멀티칩 모듈의 냉각장치 및 방법
US5808874A (en) * 1996-05-02 1998-09-15 Tessera, Inc. Microelectronic connections with liquid conductive elements
WO1998012748A1 (fr) * 1996-09-18 1998-03-26 Hitachi, Ltd. Module a semiconducteur de jonction
DE19651528B4 (de) * 1996-12-11 2005-10-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Chipanordnung und Verfahren zum Herstellen derselben
US5900674A (en) * 1996-12-23 1999-05-04 General Electric Company Interface structures for electronic devices
JP3241639B2 (ja) * 1997-06-30 2001-12-25 日本電気株式会社 マルチチップモジュールの冷却構造およびその製造方法
JPH11121666A (ja) * 1997-10-20 1999-04-30 Fujitsu Ltd マルチチップモジュールの冷却装置
US6393169B1 (en) * 1997-12-19 2002-05-21 Intel Corporation Method and apparatus for providing optical interconnection
US5930135A (en) * 1998-01-20 1999-07-27 Reliance Electric Industrial Company Heat sink apparatus and method for making the same
US6392296B1 (en) * 1998-08-31 2002-05-21 Micron Technology, Inc. Silicon interposer with optical connections
US6144013A (en) * 1999-07-01 2000-11-07 International Business Machines Corporation Local humidity control system for low temperature electronic module
US20020000239A1 (en) * 1999-09-27 2002-01-03 Krishna G. Sachdev Removal of cured silicone adhesive for reworking electronic components
US6366461B1 (en) * 1999-09-29 2002-04-02 Silicon Graphics, Inc. System and method for cooling electronic components

Also Published As

Publication number Publication date
US6969907B2 (en) 2005-11-29
US20010022395A1 (en) 2001-09-20
EP1111677B1 (de) 2010-01-27
JP2001244391A (ja) 2001-09-07
EP1111677A3 (de) 2003-10-15
US20030025197A1 (en) 2003-02-06
EP1111677A2 (de) 2001-06-27

Similar Documents

Publication Publication Date Title
DE60043767D1 (de) Kühlstruktur eines Multi-Chip-Moduls
DE60025568D1 (de) Kühleranordnung
DE59912676D1 (de) Leistungshalbleitermodul
DE69943196D1 (de) Halbleiter-Leistungs-Modul
DE60026905D1 (de) Chipträger
DE60017826D1 (de) Kühlstruktur eines elektronischen Geräts
DE60036810D1 (de) Kälteeinrichtung
DE60218023D1 (de) Mittleres strukturmodul
DE50012567D1 (de) Kühlvorrichtung
DE50008555D1 (de) Prallkühlvorrichtung
DE69907590D1 (de) Halbleitermodul
DE50013161D1 (de) Leistungshalbleitermodul
DE50004627D1 (de) Leistungshalbleiter-Modul
DE69907350D1 (de) Anschlussflächenstruktur eines Halbleitermoduls
DE60030106D1 (de) Kältevorrichtung
DE69835651D1 (de) Montierungstruktur eines unbedeckten Halbleiterchips
DE59800049D1 (de) Kühlmodul
DE60032651D1 (de) Halbleitermodul
DE29900370U1 (de) Leistungshalbleitermodul mit Deckel
FR2800678B1 (fr) Module refroidisseur
DE60025250D1 (de) Kältevorrichtung
DE60032748D1 (de) Kältevorrichtung
FR2797319B1 (fr) Module fluidique
DE59903181D1 (de) Can-modul
DE50009602D1 (de) Absorptionskühlanordnung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition