DE60039407D1 - Verfahren zur Herstellung chrombeschichteten Kupfers für Leiterplatten - Google Patents

Verfahren zur Herstellung chrombeschichteten Kupfers für Leiterplatten

Info

Publication number
DE60039407D1
DE60039407D1 DE60039407T DE60039407T DE60039407D1 DE 60039407 D1 DE60039407 D1 DE 60039407D1 DE 60039407 T DE60039407 T DE 60039407T DE 60039407 T DE60039407 T DE 60039407T DE 60039407 D1 DE60039407 D1 DE 60039407D1
Authority
DE
Germany
Prior art keywords
printed circuit
circuit boards
plated copper
producing chromium
chromium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60039407T
Other languages
English (en)
Inventor
Jiangtao Wang
John Callahan
Dan Lillie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gould Electronics Inc
Original Assignee
Nikko Materials USA Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikko Materials USA Inc filed Critical Nikko Materials USA Inc
Application granted granted Critical
Publication of DE60039407D1 publication Critical patent/DE60039407D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C23C14/025—Metallic sublayers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/321—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
    • C23C28/3225—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only with at least one zinc-based layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
    • C23C28/3455—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer with a refractory ceramic layer, e.g. refractory metal oxide, ZrO2, rare earth oxides or a thermal barrier system comprising at least one refractory oxide layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite
DE60039407T 2000-02-08 2000-12-07 Verfahren zur Herstellung chrombeschichteten Kupfers für Leiterplatten Expired - Lifetime DE60039407D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/500,192 US6489034B1 (en) 2000-02-08 2000-02-08 Method of forming chromium coated copper for printed circuit boards

Publications (1)

Publication Number Publication Date
DE60039407D1 true DE60039407D1 (de) 2008-08-21

Family

ID=23988414

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60039407T Expired - Lifetime DE60039407D1 (de) 2000-02-08 2000-12-07 Verfahren zur Herstellung chrombeschichteten Kupfers für Leiterplatten

Country Status (8)

Country Link
US (1) US6489034B1 (de)
EP (1) EP1123988B1 (de)
JP (1) JP3311338B2 (de)
KR (1) KR100352280B1 (de)
CN (1) CN1280448C (de)
CA (1) CA2322363C (de)
DE (1) DE60039407D1 (de)
TW (1) TW593756B (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040015670A (ko) 2001-01-24 2004-02-19 트리콘 호울딩즈 리미티드 탄탈륨 필름 침착방법
EP1261241A1 (de) * 2001-05-17 2002-11-27 Shipley Co. L.L.C. Widerstand und Leiterplatte, die den Widerstand in ihre Struktur einbettet
US6589413B2 (en) * 2001-08-09 2003-07-08 Gould Electronics Inc. Method of making a copper on INVAR® composite
JP4379854B2 (ja) * 2001-10-30 2009-12-09 日鉱金属株式会社 表面処理銅箔
EP1327995A3 (de) * 2002-01-11 2005-10-12 Shipley Co. L.L.C. Wiederstandstruktur
US6824880B1 (en) 2003-05-15 2004-11-30 Ga-Tek, Inc. Process for improving adhesion of resistive foil to laminating materials
KR100593741B1 (ko) * 2004-08-02 2006-06-30 도레이새한 주식회사 구리 삼성분계 화합물을 타이층으로 사용한연성회로기판용 적층구조체
US20060086620A1 (en) * 2004-10-21 2006-04-27 Chase Lee A Textured decorative plating on plastic components
CA2674646A1 (en) * 2005-09-08 2008-05-08 John C. Bilello Amorphous metal film and process for applying same
JP5479668B2 (ja) * 2006-12-26 2014-04-23 古河電気工業株式会社 表面処理銅箔
US8303792B1 (en) 2007-08-29 2012-11-06 Magnecomp Corporation High strength electrodeposited suspension conductors
KR20120084784A (ko) * 2007-11-14 2012-07-30 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 저항막층을 구비한 구리박
CN102177015A (zh) 2008-10-14 2011-09-07 Jx日矿日石金属株式会社 带电阻膜的金属箔及其制造方法
SG174370A1 (en) 2009-03-25 2011-10-28 Jx Nippon Mining & Metals Corp Metal foil with electric resistance film and production method therefor
ES2338627B1 (es) * 2009-08-28 2011-06-08 Zanini Auto Grup S.A. Tratamiento de piezas con zonas de acabado metalizado de aspecto diferenciado.
JP2012201980A (ja) 2011-03-28 2012-10-22 Jx Nippon Mining & Metals Corp 電気抵抗層付き金属箔及びその製造方法
US20130344322A1 (en) 2011-03-28 2013-12-26 Jx Nippon Mining & Metals Corporation Metal Foil Provided with Electrically Resistive Film, and Method for Producing Same
WO2012132593A1 (ja) 2011-03-31 2012-10-04 Jx日鉱日石金属株式会社 電気抵抗層を備えた金属箔及び同金属箔を用いたプリント回路用基板
TWI745566B (zh) * 2017-03-29 2021-11-11 美商康寧公司 基板塗覆設備和方法

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE503299A (de) 1949-10-29
US2662957A (en) 1949-10-29 1953-12-15 Eisler Paul Electrical resistor or semiconductor
US3368919A (en) 1964-07-29 1968-02-13 Sylvania Electric Prod Composite protective coat for thin film devices
US3489656A (en) 1964-11-09 1970-01-13 Western Electric Co Method of producing an integrated circuit containing multilayer tantalum compounds
US3621442A (en) 1968-11-07 1971-11-16 Allen Bradley Co Terminal connection of electronic devices
US3742120A (en) 1970-10-28 1973-06-26 Us Navy Single layer self-destruct circuit produced by co-deposition of tungstic oxide and aluminum
US3864825A (en) 1972-06-12 1975-02-11 Microsystems Int Ltd Method of making thin-film microelectronic resistors
FR2210881B1 (de) 1972-12-14 1976-04-23 Honeywell Bull
US3857683A (en) 1973-07-27 1974-12-31 Mica Corp Printed circuit board material incorporating binary alloys
US4164607A (en) 1977-04-04 1979-08-14 General Dynamics Corporation Electronics Division Thin film resistor having a thin layer of resistive metal of a nickel, chromium, gold alloy
US4203025A (en) 1977-08-19 1980-05-13 Hitachi, Ltd. Thick-film thermal printing head
DE2833919C2 (de) 1978-08-02 1982-06-09 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von elektrischen Schichtschaltungen auf Kunststoffolien
JPS587077A (ja) 1981-07-02 1983-01-14 東急建設株式会社 サツシの取付方法
JPS5895301A (ja) 1981-12-01 1983-06-06 Matsushita Electric Ind Co Ltd レ−ザ−全反射鏡
DE3151630C2 (de) 1981-12-28 1986-07-03 Endress U. Hauser Gmbh U. Co, 7867 Maulburg Feuchtigkeitsfühler und Verfahren zu seiner Herstellung
US4396900A (en) 1982-03-08 1983-08-02 The United States Of America As Represented By The Secretary Of The Navy Thin film microstrip circuits
JPS5916084A (ja) 1982-07-19 1984-01-27 Nitto Electric Ind Co Ltd 入力タブレツト
JPS60119784A (ja) 1983-12-01 1985-06-27 Kanegafuchi Chem Ind Co Ltd 絶縁金属基板の製法およびそれに用いる装置
JPS6135973A (ja) 1984-07-30 1986-02-20 Hitachi Ltd 感熱ヘツド
US4892776A (en) 1987-09-02 1990-01-09 Ohmega Electronics, Inc. Circuit board material and electroplating bath for the production thereof
US5243320A (en) 1988-02-26 1993-09-07 Gould Inc. Resistive metal layers and method for making same
US5038132A (en) 1989-12-22 1991-08-06 Texas Instruments Incorporated Dual function circuit board, a resistor element therefor, and a circuit embodying the element
US5039570A (en) 1990-04-12 1991-08-13 Planar Circuit Technologies, Inc. Resistive laminate for printed circuit boards, method and apparatus for forming the same
US5172473A (en) 1990-05-07 1992-12-22 International Business Machines Corporation Method of making cone electrical contact
AU8079491A (en) 1990-07-02 1992-01-23 Olin Corporation Rinsing of copper foil after anti-tarnish treatment
JP2932397B2 (ja) * 1990-11-14 1999-08-09 日本真空技術株式会社 プリント基板の製造方法
JP2794968B2 (ja) 1991-02-22 1998-09-10 富士ゼロックス株式会社 通信装置
JP2537108B2 (ja) 1991-03-14 1996-09-25 日本電解株式会社 プリント回路用銅箔及びその製造方法
US5128008A (en) 1991-04-10 1992-07-07 International Business Machines Corporation Method of forming a microelectronic package having a copper substrate
JP2755058B2 (ja) * 1991-11-14 1998-05-20 日立化成工業株式会社 印刷配線板用金属箔とその製造法並びにこの金属箔を用いた配線板の製造法
TW230290B (de) * 1991-11-15 1994-09-11 Nikko Guruder Foreer Kk
JPH0787270B2 (ja) 1992-02-19 1995-09-20 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
JPH05275817A (ja) * 1992-07-17 1993-10-22 Japan Energy Corp 銅箔の製造方法
JP2717911B2 (ja) * 1992-11-19 1998-02-25 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
US5552234A (en) * 1993-03-29 1996-09-03 Japan Energy Corporation Copper foil for printed circuits
DE69432591T2 (de) 1993-07-21 2004-03-18 Ohmega Electronics, Inc., Culver City Material für leiterplatte mit barriereschicht
TW326423B (en) 1993-08-06 1998-02-11 Gould Inc Metallic foil with adhesion promoting layer
JP3329572B2 (ja) * 1994-04-15 2002-09-30 福田金属箔粉工業株式会社 印刷回路用銅箔およびその表面処理方法
TW289900B (de) 1994-04-22 1996-11-01 Gould Electronics Inc
JP3527786B2 (ja) 1995-03-01 2004-05-17 株式会社日立グローバルストレージテクノロジーズ 多層磁気抵抗効果膜および磁気ヘッド
US5863666A (en) 1997-08-07 1999-01-26 Gould Electronics Inc. High performance flexible laminate
US5885436A (en) * 1997-08-06 1999-03-23 Gould Electronics Inc. Adhesion enhancement for metal foil
US5908544A (en) * 1997-09-04 1999-06-01 Gould Electronics, Inc. Zinc-chromium stabilizer containing a hydrogen inhibiting additive
US6132589A (en) * 1998-09-10 2000-10-17 Ga-Tek Inc. Treated copper foil and process for making treated copper foil

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CA2322363A1 (en) 2001-08-08
CA2322363C (en) 2004-09-14
EP1123988A1 (de) 2001-08-16
CN1315591A (zh) 2001-10-03
CN1280448C (zh) 2006-10-18
JP3311338B2 (ja) 2002-08-05
JP2001220689A (ja) 2001-08-14
US6489034B1 (en) 2002-12-03
TW593756B (en) 2004-06-21
EP1123988B1 (de) 2008-07-09
KR20010077901A (ko) 2001-08-20
KR100352280B1 (ko) 2002-09-12

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