DE60032676D1 - Drucksensor und Herstellungsverfahren desselben - Google Patents

Drucksensor und Herstellungsverfahren desselben

Info

Publication number
DE60032676D1
DE60032676D1 DE60032676T DE60032676T DE60032676D1 DE 60032676 D1 DE60032676 D1 DE 60032676D1 DE 60032676 T DE60032676 T DE 60032676T DE 60032676 T DE60032676 T DE 60032676T DE 60032676 D1 DE60032676 D1 DE 60032676D1
Authority
DE
Germany
Prior art keywords
manufacturing
pressure sensor
sensor
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60032676T
Other languages
English (en)
Other versions
DE60032676T2 (de
Inventor
Takashi Masuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Azbil Corp
Original Assignee
Azbil Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Azbil Corp filed Critical Azbil Corp
Application granted granted Critical
Publication of DE60032676D1 publication Critical patent/DE60032676D1/de
Publication of DE60032676T2 publication Critical patent/DE60032676T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
DE60032676T 1999-07-16 2000-07-15 Drucksensor und Herstellungsverfahren desselben Expired - Lifetime DE60032676T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP20369699 1999-07-16
JP20369699A JP3619065B2 (ja) 1999-07-16 1999-07-16 圧力センサ

Publications (2)

Publication Number Publication Date
DE60032676D1 true DE60032676D1 (de) 2007-02-15
DE60032676T2 DE60032676T2 (de) 2007-11-08

Family

ID=16478342

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60032676T Expired - Lifetime DE60032676T2 (de) 1999-07-16 2000-07-15 Drucksensor und Herstellungsverfahren desselben

Country Status (6)

Country Link
US (1) US6450039B1 (de)
EP (1) EP1069419B1 (de)
JP (1) JP3619065B2 (de)
KR (1) KR100372340B1 (de)
CN (1) CN1125975C (de)
DE (1) DE60032676T2 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10134360A1 (de) * 2001-07-14 2003-02-06 Endress & Hauser Gmbh & Co Kg Drucksensor
JP2003045903A (ja) * 2001-08-01 2003-02-14 Fujitsu Ten Ltd ダイボンド装置
KR100411475B1 (ko) * 2001-09-24 2003-12-18 주식회사코닉스 정전 용량식 압력센서의 제조방법 및 이를 이용한 압력검출 장치
US6907789B2 (en) * 2002-05-06 2005-06-21 Honeywell International Inc. Sensor package
EP1707931B1 (de) 2005-03-31 2013-03-27 STMicroelectronics Srl Analoge Dateneingabevorrichtung versehen mit einem mikroelektromechanischem Drucksensor
US7538401B2 (en) 2005-05-03 2009-05-26 Rosemount Aerospace Inc. Transducer for use in harsh environments
US7628309B1 (en) * 2005-05-03 2009-12-08 Rosemount Aerospace Inc. Transient liquid phase eutectic bonding
US20070013014A1 (en) * 2005-05-03 2007-01-18 Shuwen Guo High temperature resistant solid state pressure sensor
US7183620B2 (en) * 2005-06-21 2007-02-27 Kulite Semiconductor Products, Inc. Moisture resistant differential pressure sensors
EP1762925B1 (de) * 2005-09-09 2016-12-21 STMicroelectronics Srl Analoge Eingabevorrichtung mit integriertem Druckaufnehmer und elektronisches Gerät ausgestattet mit einer solchen Eingabevorrichtung.
JP5139766B2 (ja) * 2007-10-15 2013-02-06 日本電波工業株式会社 圧電デバイス及び圧電デバイスの製造方法
KR101447114B1 (ko) * 2008-12-30 2014-10-06 삼성전자주식회사 접촉힘 센서 패키지
JP2010217170A (ja) * 2009-02-17 2010-09-30 Seiko Epson Corp 複合センサー、電子機器
US7921721B2 (en) 2009-04-09 2011-04-12 Kulite Semiconductor Products, Inc. Leadless oil filled pressure transducer
US8209857B2 (en) * 2009-06-19 2012-07-03 The Regents Of The University Of Michigan Method of making a thin film device
US8587107B2 (en) * 2010-02-09 2013-11-19 Microsemi Corporation Silicon carbide semiconductor
US8237171B2 (en) * 2010-02-09 2012-08-07 Microsemi Corporation High voltage high package pressure semiconductor package
US8141429B2 (en) 2010-07-30 2012-03-27 Rosemount Aerospace Inc. High temperature capacitive static/dynamic pressure sensors and methods of making the same
WO2016015028A1 (en) * 2014-07-24 2016-01-28 Spec Sensors, Llc Electrochemical sensors and packaging and related methods
KR101247744B1 (ko) 2011-04-28 2013-03-26 (주)에스팩솔루션 몰딩형 반도체 압력센서모듈 제조방법
WO2013184152A1 (en) * 2012-06-08 2013-12-12 Hoya Corporation Usa Submount for electronic, optoelectronic, optical, or photonic components
EP2579013A1 (de) * 2011-10-07 2013-04-10 Technische Universität Darmstadt Erfindung betreffend druckbeaufschlagte Stromdurchführungen
US8516897B1 (en) * 2012-02-21 2013-08-27 Honeywell International Inc. Pressure sensor
US9046426B1 (en) * 2012-06-15 2015-06-02 The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration Modular apparatus and method for attaching multiple devices
US8984952B2 (en) 2012-09-07 2015-03-24 Dynisco Instruments Llc Capacitive pressure sensor
US8943895B2 (en) 2012-09-07 2015-02-03 Dynisco Instruments Llc Capacitive pressure sensor
US9103738B2 (en) 2012-09-07 2015-08-11 Dynisco Instruments Llc Capacitive pressure sensor with intrinsic temperature compensation
US9557237B2 (en) * 2013-11-18 2017-01-31 Sensata Technologies, Inc. MEMS pressure sensor field shield layout for surface charge immunity in oil filled packaging
US9316552B2 (en) * 2014-02-28 2016-04-19 Measurement Specialties, Inc. Differential pressure sensing die
WO2017019549A1 (en) * 2015-07-24 2017-02-02 Spec Sensors, Llc Electrochemical sensors and packaging and related methods
US10549982B2 (en) 2016-02-15 2020-02-04 Stmicroelectronics S.R.L. Pressure sensor encapsulated in elastomeric material, and system including the pressure sensor
CN106323539B (zh) * 2016-09-23 2022-07-22 上海立格仪表有限公司 一种传感器基座
IT201700073763A1 (it) * 2017-07-05 2019-01-05 St Microelectronics Srl Sensore capacitivo di pressione per il monitoraggio di strutture edilizie, in particolare di calcestruzzo
JP2021527211A (ja) * 2018-06-12 2021-10-11 ドワイヤー、インストゥルメンツ、インコーポレーテッドＤｗｙｅｒ Ｉｎｓｔｒｕｍｅｎｔｓ， Ｉｎｃ． 耐静電気放電型圧力センサ
CN112798157A (zh) * 2020-12-28 2021-05-14 西安赛尔电子材料科技有限公司 一种压力传感器基座及其制作方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4665754A (en) * 1985-04-08 1987-05-19 Honeywell Inc. Pressure transducer
US4703658A (en) * 1986-06-18 1987-11-03 Motorola, Inc. Pressure sensor assembly
DE4040821A1 (de) * 1990-12-20 1992-06-25 Bosch Gmbh Robert Elektronisches bauelement und verfahren zu dessen aufbau
US5581226A (en) * 1994-11-02 1996-12-03 Motorola, Inc. High pressure sensor structure and method
JPH10325772A (ja) * 1997-05-27 1998-12-08 Nissan Motor Co Ltd 半導体圧力センサおよびその製造方法
JPH1164137A (ja) * 1997-08-25 1999-03-05 Hitachi Ltd 半導体圧力センサ

Also Published As

Publication number Publication date
US6450039B1 (en) 2002-09-17
KR100372340B1 (ko) 2003-02-17
DE60032676T2 (de) 2007-11-08
CN1281140A (zh) 2001-01-24
JP2001033329A (ja) 2001-02-09
EP1069419B1 (de) 2007-01-03
EP1069419A3 (de) 2004-03-31
EP1069419A2 (de) 2001-01-17
KR20010029946A (ko) 2001-04-16
CN1125975C (zh) 2003-10-29
JP3619065B2 (ja) 2005-02-09

Similar Documents

Publication Publication Date Title
DE60032676D1 (de) Drucksensor und Herstellungsverfahren desselben
DE60015451D1 (de) Drucksensor und Herstellungsverfahren desselben
DE60143780D1 (de) Zusammengesetzte Sensorvorrichtung und zugehöriges Herstellungsverfahren
DE60031089D1 (de) Kapazitiver Drucksensor und zugehöriges Herstellungsverfahren
DE69934841D1 (de) Druckwandler und Herstellungsverfahren
JP2002504674A5 (ja) 圧力センサ
DE69922722D1 (de) Oberflächenform-Erkennungssensor und dessen Herstellungsverfahren
DE60022939D1 (de) Ausbringbare Sensorvorrichtung und Ausbringverfahren
EP1329960A4 (de) Drucksensor und verfahren zu seiner herstellung
DE60139615D1 (de) Verbundmembran und herstellungsverfahren
DE69936461D1 (de) Magnetsensor und zugehöriges herstellungsverfahren
DE60128019D1 (de) Bildsensorstruktur und Herstellungsverfahren dazu
DE60037057D1 (de) Halbleiterelement und Herstellungsverfahren dafür
DE69941585D1 (de) Nahfeld Abtastkopf und Herstellungsverfahren dafür
DE60034791D1 (de) Mikrobauelement und dessen herstellungsverfahren
FI991506A (fi) Menetelmä anturielementien valmistamiseksi ja anturielementti
DE69942040D1 (de) Sensorvorrichtung und dessen herstellungsverfahren.
DE60030395D1 (de) Elektronischer Drucksensor
DE69809906T2 (de) Sensorvorrichtung und herstellungsverfahren dazu
DE60026278D1 (de) Anzeigevorrichtung und herstellungsverfahren
EP1055920A4 (de) Halbleiter-drucksensor und verfahren zur herstellung
DE10196531T1 (de) Beschleunigungssensor und Herstellungsverfahren dafür
DE60140315D1 (de) Flexible matrize und herstellungsverfahren dafür
DE60129309D1 (de) Gassensor und zugehöriges herstellungsverfahren
DE50014915D1 (de) Drucksensor

Legal Events

Date Code Title Description
8381 Inventor (new situation)

Inventor name: MASUDA, TAKASHI, TOKYO, JP

8364 No opposition during term of opposition