DE60032521D1 - Verfahren zur herstellung von mikroelektromechanische vorrichtungen enthaltenden bauelementen durch verwendung von wenigstens einem uv-härtbaren band - Google Patents

Verfahren zur herstellung von mikroelektromechanische vorrichtungen enthaltenden bauelementen durch verwendung von wenigstens einem uv-härtbaren band

Info

Publication number
DE60032521D1
DE60032521D1 DE60032521T DE60032521T DE60032521D1 DE 60032521 D1 DE60032521 D1 DE 60032521D1 DE 60032521 T DE60032521 T DE 60032521T DE 60032521 T DE60032521 T DE 60032521T DE 60032521 D1 DE60032521 D1 DE 60032521D1
Authority
DE
Germany
Prior art keywords
hardenable
band
containing components
devices containing
microelectromechanical devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60032521T
Other languages
English (en)
Other versions
DE60032521T2 (de
Inventor
Kia Silverbrook
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Silverbrook Research Pty Ltd
Original Assignee
Silverbrook Research Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silverbrook Research Pty Ltd filed Critical Silverbrook Research Pty Ltd
Application granted granted Critical
Publication of DE60032521D1 publication Critical patent/DE60032521D1/de
Publication of DE60032521T2 publication Critical patent/DE60032521T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1635—Manufacturing processes dividing the wafer into individual chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865—Multistep processes for the separation of wafers into individual elements
    • B81C1/00873—Multistep processes for the separation of wafers into individual elements characterised by special arrangements of the devices, allowing an easier separation
DE60032521T 2000-05-24 2000-05-24 Verfahren zur herstellung von mikroelektromechanische vorrichtungen enthaltenden bauelementen durch verwendung von wenigstens einem uv-härtbaren band Expired - Lifetime DE60032521T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/AU2000/000583 WO2001089987A1 (en) 2000-05-23 2000-05-24 Method of fabricating devices incorporating microelectromechanical systems using at least one uv curable tape

Publications (2)

Publication Number Publication Date
DE60032521D1 true DE60032521D1 (de) 2007-02-01
DE60032521T2 DE60032521T2 (de) 2007-11-22

Family

ID=3700808

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60032521T Expired - Lifetime DE60032521T2 (de) 2000-05-24 2000-05-24 Verfahren zur herstellung von mikroelektromechanische vorrichtungen enthaltenden bauelementen durch verwendung von wenigstens einem uv-härtbaren band

Country Status (6)

Country Link
US (4) US7063993B1 (de)
EP (1) EP1294636B1 (de)
AU (1) AU2000247318B2 (de)
DE (1) DE60032521T2 (de)
IL (2) IL153026A0 (de)
WO (1) WO2001089987A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60032521T2 (de) * 2000-05-24 2007-11-22 Silverbrook Research Pty. Ltd., Balmain Verfahren zur herstellung von mikroelektromechanische vorrichtungen enthaltenden bauelementen durch verwendung von wenigstens einem uv-härtbaren band
US6982184B2 (en) * 2001-05-02 2006-01-03 Silverbrook Research Pty Ltd Method of fabricating MEMS devices on a silicon wafer
US6984572B2 (en) * 2002-01-25 2006-01-10 Matsushita Electric Industrial Co., Ltd. Method for manufacturing electronic component
US7268005B2 (en) * 2002-10-30 2007-09-11 Finisar Corporation Apparatus and method for stacking laser bars for uniform facet coating
TW200717519A (en) * 2005-10-28 2007-05-01 Univ Nat Chiao Tung Asynchronous first-in-first-out cell
KR102369934B1 (ko) 2017-06-23 2022-03-03 삼성전자주식회사 칩 실장장치 및 이를 이용한 칩 실장방법

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0715087B2 (ja) * 1988-07-21 1995-02-22 リンテック株式会社 粘接着テープおよびその使用方法
US5000811A (en) 1989-11-22 1991-03-19 Xerox Corporation Precision buttable subunits via dicing
US5273615A (en) * 1992-04-06 1993-12-28 Motorola, Inc. Apparatus and method for handling fragile semiconductor wafers
DE4223215C2 (de) * 1992-07-15 1996-07-11 Bosch Gmbh Robert Verfahren zur Bearbeitung von Siliziumwafern
US5476566A (en) * 1992-09-02 1995-12-19 Motorola, Inc. Method for thinning a semiconductor wafer
US5435876A (en) * 1993-03-29 1995-07-25 Texas Instruments Incorporated Grid array masking tape process
US5445559A (en) * 1993-06-24 1995-08-29 Texas Instruments Incorporated Wafer-like processing after sawing DMDs
US5680702A (en) * 1994-09-19 1997-10-28 Fuji Xerox Co., Ltd. Method for manufacturing ink jet heads
US5882532A (en) * 1996-05-31 1999-03-16 Hewlett-Packard Company Fabrication of single-crystal silicon structures using sacrificial-layer wafer bonding
US5900892A (en) * 1997-03-05 1999-05-04 Xerox Corporation Nozzle plates for ink jet cartridges
US5923995A (en) 1997-04-18 1999-07-13 National Semiconductor Corporation Methods and apparatuses for singulation of microelectromechanical systems
JP3955659B2 (ja) 1997-06-12 2007-08-08 リンテック株式会社 電子部品のダイボンディング方法およびそれに使用されるダイボンディング装置
JPH11204551A (ja) * 1998-01-19 1999-07-30 Sony Corp 半導体装置の製造方法
US6159385A (en) 1998-05-08 2000-12-12 Rockwell Technologies, Llc Process for manufacture of micro electromechanical devices having high electrical isolation
JP2000223446A (ja) * 1998-11-27 2000-08-11 Denso Corp 半導体装置およびその製造方法
US6060336A (en) 1998-12-11 2000-05-09 C.F. Wan Incorporated Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore
JP3816253B2 (ja) * 1999-01-19 2006-08-30 富士通株式会社 半導体装置の製造方法
US6213587B1 (en) * 1999-07-19 2001-04-10 Lexmark International, Inc. Ink jet printhead having improved reliability
US6290331B1 (en) * 1999-09-09 2001-09-18 Hewlett-Packard Company High efficiency orifice plate structure and printhead using the same
DE60032521T2 (de) * 2000-05-24 2007-11-22 Silverbrook Research Pty. Ltd., Balmain Verfahren zur herstellung von mikroelektromechanische vorrichtungen enthaltenden bauelementen durch verwendung von wenigstens einem uv-härtbaren band
WO2002074686A2 (en) * 2000-12-05 2002-09-26 Analog Devices, Inc. A method and device for protecting micro electromechanical systems structures during dicing of a wafer
JP4591019B2 (ja) * 2004-05-24 2010-12-01 セイコーエプソン株式会社 液体噴射ヘッドの製造方法

Also Published As

Publication number Publication date
US7465405B2 (en) 2008-12-16
DE60032521T2 (de) 2007-11-22
AU2000247318B2 (en) 2005-05-05
EP1294636B1 (de) 2006-12-20
US20090061562A1 (en) 2009-03-05
US8070969B2 (en) 2011-12-06
US7063993B1 (en) 2006-06-20
IL153026A (en) 2006-10-31
EP1294636A1 (de) 2003-03-26
EP1294636A4 (de) 2004-11-10
US20120064647A1 (en) 2012-03-15
US20060261423A1 (en) 2006-11-23
IL153026A0 (en) 2003-06-24
WO2001089987A1 (en) 2001-11-29

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