DE60022458D1 - Halbleitergehäuse, halbleitervorrichtung, elektronikelement und herstellung eines halbleitergehäuses - Google Patents

Halbleitergehäuse, halbleitervorrichtung, elektronikelement und herstellung eines halbleitergehäuses

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Publication number
DE60022458D1
DE60022458D1 DE60022458T DE60022458T DE60022458D1 DE 60022458 D1 DE60022458 D1 DE 60022458D1 DE 60022458 T DE60022458 T DE 60022458T DE 60022458 T DE60022458 T DE 60022458T DE 60022458 D1 DE60022458 D1 DE 60022458D1
Authority
DE
Germany
Prior art keywords
semiconductor
housing
manufacture
electronic element
semiconductor housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60022458T
Other languages
English (en)
Other versions
DE60022458T2 (de
Inventor
Takanao Suzuki
Masatoshi Inaba
Tadanori Ominato
Masahiro Kaizu
Akihito Kurosaka
Nobuyuki Sadakata
Mutsumi Masumoto
Kenji Masumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Texas Instruments Japan Ltd
Original Assignee
Fujikura Ltd
Texas Instruments Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd, Texas Instruments Japan Ltd filed Critical Fujikura Ltd
Publication of DE60022458D1 publication Critical patent/DE60022458D1/de
Application granted granted Critical
Publication of DE60022458T2 publication Critical patent/DE60022458T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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US6835595B1 (en) 2004-12-28
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